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公开(公告)号:US08618620B2
公开(公告)日:2013-12-31
申请号:US12835111
申请日:2010-07-13
申请人: Bernhard Winkler , Rainer Leuschner , Horst Theuss
发明人: Bernhard Winkler , Rainer Leuschner , Horst Theuss
IPC分类号: H01L29/84
CPC分类号: B81B7/0058 , B81B2201/025 , B81B2201/0264 , B81B2207/012 , B81B2207/015 , B81C2203/0154 , G01L9/0054 , G01L15/00 , G01L19/141 , G01L19/148 , H01L29/84 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2924/1461 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: Embodiments relate to integrated circuit (IC) sensors and sensing systems and methods. In an embodiment, an IC sensor device includes at least one sensing element; a framing element disposed around the at least one sensing element at a wafer-level; and a package having at least one port predefined at the wafer-level by the framing element, the at least one port configured to expose at least a portion of the at least one sensing element to an ambient environment.
摘要翻译: 实施例涉及集成电路(IC)传感器和感测系统和方法。 在一个实施例中,IC传感器装置包括至少一个感测元件; 在晶片级周围设置在所述至少一个感测元件周围的框架元件; 以及封装,其具有通过框架元件在晶片级预定义的至少一个端口,所述至少一个端口被配置为将所述至少一个感测元件的至少一部分暴露于周围环境。
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公开(公告)号:US20120012949A1
公开(公告)日:2012-01-19
申请号:US12835111
申请日:2010-07-13
申请人: Bernhard Winkler , Rainer Leuschner , Horst Theuss
发明人: Bernhard Winkler , Rainer Leuschner , Horst Theuss
IPC分类号: H01L29/84 , B29C70/68 , H01L31/0203
CPC分类号: B81B7/0058 , B81B2201/025 , B81B2201/0264 , B81B2207/012 , B81B2207/015 , B81C2203/0154 , G01L9/0054 , G01L15/00 , G01L19/141 , G01L19/148 , H01L29/84 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2924/1461 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: Embodiments relate to integrated circuit (IC) sensors and sensing systems and methods. In an embodiment, an IC sensor device includes at least one sensing element; a framing element disposed around the at least one sensing element at a wafer-level; and a package having at least one port predefined at the wafer-level by the framing element, the at least one port configured to expose at least a portion of the at least one sensing element to an ambient environment.
摘要翻译: 实施例涉及集成电路(IC)传感器和感测系统和方法。 在一个实施例中,IC传感器装置包括至少一个感测元件; 在晶片级周围设置在所述至少一个感测元件周围的成帧元件; 以及封装,其具有通过框架元件在晶片级预定义的至少一个端口,所述至少一个端口被配置为将所述至少一个感测元件的至少一部分暴露于周围环境。
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公开(公告)号:US09021887B2
公开(公告)日:2015-05-05
申请号:US13329618
申请日:2011-12-19
申请人: Franz-Peter Kalz , Horst Theuss , Bernhard Winkler , Khalil Hosseini , Joachim Mahler , Manfred Mengel
发明人: Franz-Peter Kalz , Horst Theuss , Bernhard Winkler , Khalil Hosseini , Joachim Mahler , Manfred Mengel
CPC分类号: B81B7/02 , B81B3/0021 , B81B3/0072 , B81B2201/0235 , B81B2201/0264 , B81C2203/0154 , G01L1/18 , G01L9/0072 , G01L19/0092 , G01L19/02
摘要: Micromechanical semiconductor sensing device comprises a micromechanical sensing structure being configured to yield an electrical sensing signal, and a piezoresistive sensing device provided in the micromechanical sensing structure, said piezoresistive sensing device being arranged to sense a mechanical stress disturbing the electrical sensing signal and being configured to yield an electrical disturbance signal based on the sensed mechanical stress disturbing the electrical sensing signal.
摘要翻译: 微机械半导体感测装置包括被配置为产生电感测信号的微机械感测结构和设置在微机械感测结构中的压阻感测装置,所述压阻感测装置被布置成感测扰动电感测信号的机械应力,并被配置为 基于感测到的电感测信号的机械应力产生电干扰信号。
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公开(公告)号:US20130152696A1
公开(公告)日:2013-06-20
申请号:US13329618
申请日:2011-12-19
申请人: Franz-Peter Kalz , Horst Theuss , Bernhard Winkler , Khalil Hosseini , Joachim Mahler , Manfred Mengel
发明人: Franz-Peter Kalz , Horst Theuss , Bernhard Winkler , Khalil Hosseini , Joachim Mahler , Manfred Mengel
IPC分类号: G01B7/16
CPC分类号: B81B7/02 , B81B3/0021 , B81B3/0072 , B81B2201/0235 , B81B2201/0264 , B81C2203/0154 , G01L1/18 , G01L9/0072 , G01L19/0092 , G01L19/02
摘要: Micromechanical semiconductor sensing device comprises a micromechanical sensing structure being configured to yield an electrical sensing signal, and a piezoresistive sensing device provided in the micromechanical sensing structure, said piezoresistive sensing device being arranged to sense a mechanical stress disturbing the electrical sensing signal and being configured to yield an electrical disturbance signal based on the sensed mechanical stress disturbing the electrical sensing signal.
摘要翻译: 微机械半导体感测装置包括被配置为产生电感测信号的微机械感测结构和设置在微机械感测结构中的压阻感测装置,所述压阻感测装置被布置成感测扰动电感测信号的机械应力,并被配置为 基于感测到的电感测信号的机械应力产生电干扰信号。
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公开(公告)号:US09266719B2
公开(公告)日:2016-02-23
申请号:US13406069
申请日:2012-02-27
CPC分类号: B81C1/00182 , B81B2201/0271 , H01L41/0933 , Y10S977/732
摘要: Micro-electromechanical system (MEMS) devices and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a first semiconductive material and at least one trench disposed in the first semiconductive material, the at least one trench having a sidewall. An insulating material layer is disposed over an upper portion of the sidewall of the at least one trench in the first semiconductive material and over a portion of a top surface of the first semiconductive material proximate the sidewall. A second semiconductive material or a conductive material is disposed within the at least one trench and at least over the insulating material layer disposed over the portion of the top surface of the first semiconductive material proximate the sidewall.
摘要翻译: 公开了微机电系统(MEMS)装置及其制造方法。 在一个实施例中,MEMS器件包括第一半导体材料和设置在第一半导体材料中的至少一个沟槽,所述至少一个沟槽具有侧壁。 绝缘材料层设置在第一半导体材料中的至少一个沟槽的侧壁的上部上方,以及靠近侧壁的第一半导体材料的顶表面的一部分之上。 第二半导体材料或导电材料设置在至少一个沟槽内,并且至少在绝缘材料层的上方设置在靠近侧壁的第一半导体材料的顶表面的部分之上。
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公开(公告)号:US20120211805A1
公开(公告)日:2012-08-23
申请号:US13032334
申请日:2011-02-22
申请人: Bernhard Winkler , Andreas Zankl , Klemens Pruegl , Stefan Kolb
发明人: Bernhard Winkler , Andreas Zankl , Klemens Pruegl , Stefan Kolb
CPC分类号: B81B7/008 , B81B2201/0264 , B81B2203/0315 , B81B2207/015 , B81C1/00158 , B81C1/00246 , B81C2203/0707 , B81C2203/0714 , B81C2203/0735 , B81C2203/0771 , H01L27/0611
摘要: Embodiments relate to MEMS devices, particularly MEMS devices integrated with related electrical devices on a single wafer. Embodiments utilize a modular process flow concept as part of a MEMS-first approach, enabling use of a novel cavity sealing process. The impact and potential detrimental effects on the electrical devices by the MEMS processing are thereby reduced or eliminated. At the same time, a highly flexible solution is provided that enables implementation of a variety of measurement principles, including capacitive and piezoresistive. A variety of sensor applications can therefore be addressed with improved performance and quality while remaining cost-effective.
摘要翻译: 实施例涉及MEMS器件,特别是与单个晶片上的相关电气器件集成的MEMS器件。 实施例利用模块化工艺流程概念作为MEMS首要方法的一部分,使得能够使用新颖的腔体密封过程。 因此,通过MEMS处理对电气装置的影响和潜在的有害影响被减少或消除。 同时,提供了一种高度灵活的解决方案,可以实现各种测量原理,包括电容式和压阻式。 因此,可以在提高性能和质量的同时解决各种传感器应用,同时保持成本效益。
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公开(公告)号:US07851875B2
公开(公告)日:2010-12-14
申请号:US12013174
申请日:2008-01-11
IPC分类号: H01L29/84
CPC分类号: B81C1/00182 , B81B2201/0271 , H01L41/0933 , Y10S977/732
摘要: Micro-electromechanical system (MEMS) devices and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a first semiconductive material and at least one trench disposed in the first semiconductive material, the at least one trench having a sidewall. An insulating material layer is disposed over an upper portion of the sidewall of the at least one trench in the first semiconductive material and over a portion of a top surface of the first semiconductive material proximate the sidewall. A second semiconductive material or a conductive material is disposed within the at least one trench and at least over the insulating material layer disposed over the portion of the top surface of the first semiconductive material proximate the sidewall.
摘要翻译: 公开了微机电系统(MEMS)装置及其制造方法。 在一个实施例中,MEMS器件包括第一半导体材料和设置在第一半导体材料中的至少一个沟槽,所述至少一个沟槽具有侧壁。 绝缘材料层设置在第一半导体材料中的至少一个沟槽的侧壁的上部上方,以及靠近侧壁的第一半导体材料的顶表面的一部分之上。 第二半导体材料或导电材料设置在至少一个沟槽内,并且至少在绝缘材料层的上方设置在靠近侧壁的第一半导体材料的顶表面的部分之上。
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公开(公告)号:US07111855B2
公开(公告)日:2006-09-26
申请号:US10740202
申请日:2003-12-18
IPC分类号: B62D17/00
CPC分类号: B60G3/20 , B60G7/008 , B60G2200/144 , B60G2200/462 , B60G2204/143 , B60G2204/148 , B60G2204/422 , B62D17/00 , Y10T403/125
摘要: A toe link assembly of a suspension system includes a cam sleeve having a first and second end, a first cam plate fixedly attached to the cam sleeve at the first end, and a second cam plate fixedly attached to the cam sleeve at the second end. In addition, the toe link assembly includes a first cam washer rotatably received by the first cam plate, a second cam washer rotatably received by the second cam plate, and a bolt having a head fixedly attached to the first cam washer, a body extending between the first and second ends of the cam sleeve, and a shank fixed for rotation with the second cam washer. Rotation of the bolt causes the first and second cam washers to react against the first and second cam plates to position the bolt relative to the cam sleeve along a first longitudinal axis.
摘要翻译: 悬架系统的脚趾连接组件包括具有第一和第二端的凸轮套筒,在第一端处固定地连接到凸轮套筒的第一凸轮板和在第二端处固定地连接到凸轮套筒的第二凸轮板。 此外,脚趾连接组件包括由第一凸轮板可旋转地接收的第一凸轮垫圈,由第二凸轮板可旋转地接收的第二凸轮垫圈和具有固定地连接到第一凸轮垫圈的头部的螺栓, 凸轮套筒的第一端和第二端,以及固定用于与第二凸轮垫圈一起旋转的柄。 螺栓的旋转使得第一和第二凸轮垫圈相对于第一和第二凸轮板反作用以沿着第一纵向轴线相对于凸轮套筒定位螺栓。
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公开(公告)号:US20140363239A1
公开(公告)日:2014-12-11
申请号:US14345903
申请日:2012-07-10
申请人: Josef Glogger , Bernhard Winkler
发明人: Josef Glogger , Bernhard Winkler
IPC分类号: E21D20/02
CPC分类号: E21D20/02 , E21D20/021 , E21D20/025 , F16B13/141
摘要: An anchor rod is disclosed. The anchor rod includes an attachment region and an anchoring region which is insertable into a borehole and which has a profiled section. The profiled section interacts with a curable organic and/or inorganic mortar compound filled into the borehole. The profiled section includes a plurality of expansion sections disposed axially in a row which are conically shaped. For each of the plurality of expansion sections, a diameter of the expansion section increases in a direction toward a free front end of the anchor rod, a ratio of a distance of the expansion section to a mean borehole diameter is 0.40 to 0.60, a ratio of an outer diameter to a core diameter of the expansion section is 1.35 to 1.55, and a cone angle of the expansion section is 22.5° to 27.5°.
摘要翻译: 公开了一种锚杆。 锚杆包括附接区域和可插入钻孔中并具有成型部分的锚定区域。 型材部分与填充到钻孔中的可固化的有机和/或无机砂浆化合物相互作用。 成形部分包括多个沿圆锥形状排列成一列的膨胀部分。 对于多个膨胀部中的每一个,膨胀部的直径朝向锚杆的自由前端的方向增大,膨胀部的距离与平均井眼直径的比率为0.40〜0.60, 的外径与膨胀部的芯直径的比为1.35〜1.55,膨胀部的锥角为22.5°〜27.5°。
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公开(公告)号:US08415191B2
公开(公告)日:2013-04-09
申请号:US13218987
申请日:2011-08-26
IPC分类号: H01L29/84
CPC分类号: G01P15/08 , G01C19/56 , G01P15/097 , G01P15/125 , H01L28/40 , H01L29/785
摘要: Embodiments relate to micromachine structures. In one embodiment, a micromachine structure includes a first electrode, a second electrode, and a sensing element. The sensing element is mechanically movable and is disposed intermediate the first and second electrodes and adapted to oscillate between the first and second electrodes. Further, the sensing element includes a FinFET structure having a height and a width, the height being greater than the width.
摘要翻译: 实施例涉及微机械结构。 在一个实施例中,微型机械结构包括第一电极,第二电极和感测元件。 感测元件是机械可移动的并且设置在第一和第二电极之间并且适于在第一和第二电极之间振荡。 此外,感测元件包括具有高度和宽度的FinFET结构,高度大于宽度。
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