摘要:
Switching characteristics of system components are represented and summed so that their effects on the overall system can be observed during the design process. Full simultaneous switching analysis is provided at the earliest levels of design containing minimal level of design data by a method of computing net based simultaneous switching noise levels which supports packages ranging from the smallest chip level to the largest board level. The simultaneous switching activity is computed based on interaction between each driver and each other driver between each component and each other component, with consideration to the spatial inter-relationship net, within a higher level component, to determine each component's drivers effect on itself as well as the coupling effect between drivers on different components. The analysis involves computing simultaneous switching noise by associating a characteristic triangle with each driver application configuration. The characteristic triangle. The height of the triangle, as well as the pitch of the sides of the triangle will be determined by the characteristics of the net. In the early stages of design, a default characteristic triangle is defined for each technology type. A general triangle is also defined for cases where early analysis needs to be performed prior to choosing a technology.
摘要:
A silicon carrier structure for electronic packaging includes a base substrate, a silicon carrier substrate disposed on the base substrate, a memory chip disposed on the silicon carrier substrate, a microprocessor chip disposed on the silicon carrier substrate, an input/output chip disposed on the silicon carrier substrate, and a clocking chip disposed on the silicon carrier substrate.
摘要:
A total cost estimate is calculated based on a set of printed circuit board (PCB) design parameters. The set of PCB design parameters are received, and PCB attributes are extracted from them. Based on the PCB attributes the PCB is classified and a cost equation is calculated. The cost equation is calculated based on a regression analysis of one or more of the PCB attributes. Once the cost equation is calculated, the total cost is computed based on the cost equation.
摘要:
A silicon carrier structure for electronic packaging includes a base substrate, a silicon carrier substrate disposed on the base substrate, a memory chip disposed on the silicon carrier substrate, a microprocessor chip disposed on the silicon carrier substrate, an input/output chip disposed on the silicon carrier substrate, and a clocking chip disposed on the silicon carrier substrate.
摘要:
An electronic device assembly is provided which includes a substrate, an interposer and an integrated circuit chip. The substrate is fabricated of a first material having a first thermal expansivity, and the interposer and integrated circuit chip are fabricated of a second material having a second thermal expansivity. The second thermal expansivity is different from the first thermal expansivity so that there is a coefficient of thermal expansion mismatch between the substrate and the interposer or chip. The interposer is coupled to the substrate via a first plurality of electrical contacts and an underfill adhesive at least partially surrounding the electrical contacts to bond the interposer to the substrate and thereby reduce strain on the first plurality of electrical contacts. The integrated circuit chip is coupled to the interposer via a second plurality of electrical contacts only, without use of an adhesive surrounding the second plurality of electrical contacts.
摘要:
An electronic device assembly is provided which includes a substrate, an interposer and an integrated circuit chip. The substrate is fabricated of a first material having a first thermal expansivity, and the interposer and integrated circuit chip are fabricated of a second material having a second thermal expansivity. The second thermal expansivity is different from the first thermal expansivity so that there is a coefficient of thermal expansion mismatch between the substrate and the interposer or chip. The interposer is coupled to the substrate via a first plurality of electrical contacts and an underfill adhesive at least partially surrounding the electrical contacts to bond the interposer to the substrate and thereby reduce strain on the first plurality of electrical contacts. The integrated circuit chip is coupled to the interposer via a second plurality of electrical contacts only, without use of an adhesive surrounding the second plurality of electrical contacts.
摘要:
A system and method for performing a test for characterizing high frequency operation of PCB boards. More particularly, a system and methodology is provided to implement a time-domain short pulse propagation (SPP) technique on the production line, on large, multi-layer, product-level PCB boards, for large volume testing, by people who are not familiar with advanced, delicate, measurement techniques, who need robust test facilities, and cannot afford the time or expense of other lab-type approaches.
摘要:
A method for dynamic bandwidth testing of a link between two computer subsystems useful for determining the amount of data which can be buffered in a transmission line by delay, in which at each end of the line circuit modules are provided to couple the subsystem by a bi-directional multi-bit (BiDi) link, and providing within each said circuit module a built-in circuit and logic for dynamic transmission characterization and test of a said BiDi link between computer subsystems using built-in characterization logic macros, and during a test mode, switching said said built-in circuit and logic to test mode and using the test mode to characterize the link performance, and after the completion of characterization, the switching built-in characterization logic macros back to a normal system mode after programmatically setting timing parameters for the BiDi link to ensure safe operation of data transfer before the BiDi link is switched to system mode.
摘要:
A clamping circuit to reduce self-induced switching noise in a multi-chip module semiconductor structure. A module section interconnects the chips and the chips have a power supply and power leads respectively. An impedance path is defined between each of the chips and the power supply to define a current path for switching noise through the top of the module. A high impedance path is defined for voltages below a predetermined upper limit of the chip supply voltage and a low impedance path is defined by the clamping circuit for the voltage range where noise superimposed on the chip supply voltage occurs.
摘要:
A silicon carrier structure for electronic packaging includes a base substrate, a silicon carrier substrate disposed on the base substrate, a memory chip disposed on the silicon carrier substrate, a microprocessor chip disposed on the silicon carrier substrate, an input/output chip disposed on the silicon carrier substrate, and a clocking chip disposed on the silicon carrier substrate.