摘要:
A method of manufacturing a device having embedded memory including a plurality of memory cells. During manufacturing test, a first test stress is applied to selected cells of the plurality of memory cells with a built-in self test. At least one weak memory cell is identified. The at least one weak memory cell is repaired. A second test stress is applied to the selected cells and the repaired cells with the built-in self test.
摘要:
A method of assigning bits to redundant regions for variable bit redundancy region boundaries in a compliable memory such as a 1-port SRAM is provided. Methods include allocating bits between the redundant regions in nearly equal proportions while minimizing the amount of chip real estate consumed by the memory. Methods also includes allocating bits in equal portions between redundant regions while occupying slightly more memory chip real estate. Methods also allocate bits into redundant regions with a simplified procedure which may or may not allocate bits into the redundant regions in equal proportions. All of the methods allow the total number of memory bits in the complied memory to be re-defined while maintaining the same allocation characteristics for each method. Accordingly, the methods allow efficient use of redundant memory bits while also conserving chip real estate or offering simplified allocation steps.
摘要:
Self-test architectures are provided to implement data column and row redundancy with a totally integrated self-test and repair capability in a Random Access Memory (RAM), either a Dynamic RAM (DRAM) or a Static Ram (SRAM), and are particularly applicable to compileable memories and to embedded RAM within microprocessor or logic chips. The invention uses two passes of self-test of a memory. The first pass of self-test determines the worst failing column, the column with the largest number of unique failing row addresses. After completion of the first pass of self-test, the spare column is allocated to replace the worst failing column. In the second pass of self-test, the BIST (Built In Self-Test) collects unique failing row addresses as it does today for memories with spare rows only. At the completion of the second pass of self-test, the spare rows are then allocated. Once the second pass of self-test is completed, the column and unique failing row addresses are transported to the e-fuse macros and permanently stored in the chip.
摘要:
Aspects of the invention provide a bypass structure for a memory device for reducing unknown test values, and a related method. In one embodiment, a bypass structure for a memory device is disclosed. The bypass structure includes: a logic gate configured to receive a test signal and a clock signal; and an output latch configured to receive an output of the logic gate, an output of the memory device, and a bypass data signal, wherein the output latch is configured to hold the bypass data signal and bypass the output of the memory device in response to asserting the test signal, such that unknown data from the output of the memory device is bypassed.
摘要:
Aspects of the invention provide a bypass structure for a memory device for reducing unknown test values, and a related method. In one embodiment, a bypass structure for a memory device is disclosed. The bypass structure includes: a logic gate configured to receive a test signal and a clock signal; and an output latch configured to receive an output of the logic gate, an output of the memory device, and a bypass data signal, wherein the output latch is configured to hold the bypass data signal and bypass the output of the memory device in response to asserting the test signal, such that unknown data from the output of the memory device is bypassed.
摘要:
A structure comprising a memory chip and a tester for testing the memory chip, and a method for operating the structure. The memory chip comprises a BIST (Built-in Self Test) circuit, a plurality of RAMs (Random Access Memories). A first RAM is selected for testing by scanning in a select value into a RAM select register in the BIST. While the BIST performs a first testing pass for the first RAM, the tester collects cycle numbers of the failing cycles. Then, the BIST performs a second testing pass for the first RAM. At each failing cycle identified during the first testing pass, the BIST pauses so that the content of the location of the first RAM associated with the failing cycle and the state of the BIST can be extracted out of the memory chip. The testing procedures for the other RAMs are similar to that of the first RAM.
摘要:
A method and structure for content addressable memory structure having a memory array of words, each word having multiple memory bits and a plurality of matchlines. Each of the matchlines is connected to one of the words and a matchline compare circuit is connected to the matchlines and is adapted to test all of the words individually. The matchline compare circuit includes a plurality of comparators equal in number to a number of the words, such that each word is connected to a dedicated comparator to allow each word in the memory array to be individually tested.
摘要:
A method of implementing a compilable memory structure configured for supporting multiple test methodologies includes configuring a first plurality of multiplexers for selectively coupling at least one data input path and at least one address path between an external customer connection and a corresponding internal memory connection associated therewith. A second multiplexer is configured for selectively coupling an input of a test latch between a functional memory array connection and a memory logic connection, the memory logic connection coupled to the at least one data input path, with an output of the test latch defining a data out customer connection. Flush logic is configured to direct data from the memory logic connection to the data out customer connection during a test of logic associated with a customer chip, facilitating observation of the memory logic connection at the customer chip.
摘要:
A design structure is embodied in a machine readable medium for designing, manufacturing, or testing an integrated circuit. The design structure includes an input register coupled to a data processing unit input and a test operation mode and functional operation mode. In the test mode operation, the register operates in a clocked mode such that, during the test operation mode, the register propagates data to the data processing unit in response to a clock signal. In the functional operation mode, the register operates in a data flush mode such that the register propagates data to the data processing unit in response to the data. The functional mode is enabled by a flush enable signal and the test mode is enabled by an opposite state of the flush enable signal.
摘要:
A method is provided for operating an interface between a first unit and a second unit supplying its data. The method includes switching control between LSSD_B and LSSD_C clocks and system clock (CLK) to provide a test mode of operation and a functional mode of operation to optimize setup and hold times depending on conditions under which the unit is operating. In the test mode, data is launched by the LSSD_C clock. In the functional mode, the data is launched by the system clock (CLK) to RAM. A method is also provided to determine which memory inputs should use a circuit that provides adequate setup and hold margins.