公开(公告)号：US10340617B2

公开(公告)日：2019-07-02

申请号：US15168262

申请日：2016-05-31

Applicant: Delta Electronics, Inc.

Inventor： Le Liang ,  Shouyu Hong ,  Zhenqing Zhao

IPC: H01R12/58 ,  H02M3/04 ,  H01R12/52

Abstract: A power module with vertically stacked structure and a pin thereof are disclosed. The power module comprises at least three circuit modules. The at least three circuit modules are a first circuit module, a second circuit module and a third circuit module. The pin is led from the first circuit module. The pin comprises: a main body, a first connection surface and a second connection surface. An upper part of the main body is electrically connected with the first circuit module. The first connection surface is provided at a middle part of the main body and electrically connected with the second circuit module. The second connection surface is provided at a terminal of the main body and electrically connected with the third circuit module.

公开(公告)号：US10096562B2

公开(公告)日：2018-10-09

申请号：US15209777

申请日：2016-07-14

Applicant: DELTA ELECTRONICS, INC.

Inventor： Le Liang ,  Kai Lu ,  Zhen-Qing Zhao ,  Zeng Li

IPC: H01L29/15 ,  H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L25/16 ,  H01L25/18

Abstract: A power module package includes a single-layered circuit board, a first electronic component, and a second electronic component. The single-layered circuit board includes an insulating substrate and a conductive layer thereon. A bottom surface of the conductive layer touches a top surface of the insulating substrate. The insulating substrate has plural first openings to allow the conductive layer to be exposed from the bottom surface of the insulating substrate. The first electronic component is disposed on a top surface of the conductive layer. The second electronic component is disposed on the bottom surface of the insulating substrate and received in the first openings. The second electronic component is connected to the conductive layer via the first openings. At least one of the first electronic component and the second electronic component is a bare die.

公开(公告)号：US09892998B2

公开(公告)日：2018-02-13

申请号：US14918837

申请日：2015-10-21

Applicant: DELTA ELECTRONICS, INC.

Inventor： Kai Lu ,  Zhenqing Zhao ,  Shouyu Hong ,  Tao Wang ,  Le Liang

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49568 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49555 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/40225 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/8382 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/0781 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2224/37099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/0665

Abstract: The present disclosure discloses a package module of a power conversion circuit and a manufacturing method thereof. The package module of the power conversion circuit is surface-mountable on a system board. The package module of the power conversion circuit includes: a substrate, a power device die, a molding layer and a plurality of pins. The substrate has a metal layer, an insulating substrate layer and a thermal conductive layer. The insulating substrate layer is disposed between the metal layer and the thermal conductive layer. The power device die is coupled to the metal layer. Devices on the metal layer of the substrate are embedded in the molding layer. The plurality of pins is electrically coupled to the metal layer and embedded in the molding layer, at least a contact surface of each of the pins which is electrically coupled to the system board is exposed, and the contact surface is parallel and/or perpendicular to the thermal conductive layer. The package module with this structure occupies a small area, and facilitates batch production.

公开(公告)号：US09748205B2

公开(公告)日：2017-08-29

申请号：US15081365

申请日：2016-03-25

Applicant: DELTA ELECTRONICS, INC.

Inventor： Kai Lu ,  Zhenqing Zhao ,  Tao Wang ,  Le Liang

IPC: H01L23/495 ,  H01L25/065 ,  H01L23/31 ,  H05K1/02 ,  H05K3/28

CPC classification number: H01L25/0657 ,  H01L23/3107 ,  H01L23/49517 ,  H01L23/49531 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49589 ,  H01L2224/16225 ,  H01L2224/48137 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06572 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/0263 ,  H05K3/284 ,  H05K2201/10166 ,  H05K2203/1316 ,  H01L2924/00012

Abstract: A molding type power module includes: a leadframe including a first step and a second step; a first planar power device including a first surface having electrodes and a second surface opposite to the first surface, the electrodes being correspondingly bond to the first step respectively; and a second planar power device including a first surface having electrodes and a second surface opposite to the first surface, the electrodes being correspondingly bond to the second step respectively, wherein, the first surface of the first planar power device and the first surface of the second planar power device face each other, the projected areas thereof on a vertical direction at least partially overlap, and the first planar power device at least has one electrode electronically connected with the electrodes of the second planar power device.

公开(公告)号：US20160366780A1

公开(公告)日：2016-12-15

申请号：US15168262

申请日：2016-05-31

Applicant: Delta Electronics, Inc.

Inventor： Le Liang ,  Shouyu Hong ,  Zhenqing Zhao

IPC: H05K7/02 ,  H02M7/04 ,  H02M7/44 ,  H01R12/58 ,  H02M1/42 ,  H05K7/20 ,  H02M7/00 ,  H01R12/52 ,  H02M3/04 ,  H02M5/04

CPC classification number: H01R12/585 ,  H01R12/52 ,  H02M3/04

Abstract: A power module with vertically stacked structure and a pin thereof are disclosed. The power module comprises at least three circuit modules. The at least three circuit modules are a first circuit module, a second circuit module and a third circuit module. The pin is led from the first circuit module. The pin comprises: a main body, a first connection surface and a second connection surface. An upper part of the main body is electrically connected with the first circuit module. The first connection surface is provided at a middle part of the main body and electrically connected with the second circuit module. The second connection surface is provided at a terminal of the main body and electrically connected with the third circuit module.

Abstract translation: 公开了具有垂直堆叠结构的电源模块及其引脚。 功率模块包括至少三个电路模块。 所述至少三个电路模块是第一电路模块，第二电路模块和第三电路模块。 引脚从第一个电路模块引出。 销包括：主体，第一连接表面和第二连接表面。 主体的上部与第一电路模块电连接。 第一连接表面设置在主体的中间部分并与第二电路模块电连接。 第二连接表面设置在主体的端子处并与第三电路模块电连接。

公开(公告)号：US10342153B2

公开(公告)日：2019-07-02

申请号：US15291155

申请日：2016-10-12

Applicant: DELTA ELECTRONICS, INC.

Inventor： Le Liang ,  Zhenqing Zhao

IPC: H05K7/00 ,  H05K7/14 ,  H01L25/07

Abstract: Disclosed is a stack structure and its manufacturing method. The stack structure includes at least two stacked modules, wherein at least one of the modules is a power module; at least one metal connection component which is in integrated structure and comprises a first end, a second end and a connection portion with the first end being electrically connected to one of the modules and the second end being electrically connected to the other module; at least one molding compound packaging the at least one module and the end of the metal connection component which is electrically connected to the module, respectively.

公开(公告)号：US11533819B2

公开(公告)日：2022-12-20

申请号：US16404854

申请日：2019-05-07

Applicant: Delta Electronics, Inc.

Inventor： Le Liang ,  Zhenqing Zhao

IPC: H05K7/14 ,  H01L25/07

Abstract: A method for manufacturing a stack structure comprises: providing a lead frame having a metal frame, at least two metal plate portions and a plurality of connection ribs, the connection ribs each comprises a first end, a second end and a connection portion; directly mounting electronic components for constructing two modules on the metal plate portions; packaging the electronic components of the first module, the first ends of the metal connection components which are electrically connected to the first module and the first ends of the part of the connection ribs which are electrically connected to the first module are packaged therein; removing the metal frame and part or whole of the connection ribs, the remaining connection ribs forms pins; and bending the metal connection component so that the two modules connected by the metal connection components are stacked one upon the other, to form the stack structure.

公开(公告)号：US10204882B2

公开(公告)日：2019-02-12

申请号：US15826714

申请日：2017-11-30

Applicant: DELTA ELECTRONICS, INC.

Inventor： Le Liang ,  Shou-Yu Hong ,  Zhen-Qing Zhao

IPC: H01L23/34 ,  H01L21/00 ,  H05K7/10 ,  H01L25/065 ,  H01L21/56 ,  H01L23/433 ,  H01L23/495 ,  H01L23/31

Abstract: A package module includes a power module, a first thermal dissipating component and a packaging plastic. The power module includes a substrate and at least one power semiconductor component disposed on the substrate. The first thermal dissipating component is disposed over the power module. The packaging plastic covers the power module and the first thermal dissipating component, wherein a portion of the first thermal dissipating component is exposed from the packaging plastic.

公开(公告)号：US09875991B2

公开(公告)日：2018-01-23

申请号：US15071215

申请日：2016-03-16

Applicant: DELTA ELECTRONICS, INC.

Inventor： Le Liang ,  Shou-Yu Hong ,  Zhen-Qing Zhao

IPC: H01L25/065 ,  H01L21/56 ,  H01L23/433 ,  H01L23/495 ,  H01L23/31

CPC classification number: H01L25/0655 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49555 ,  H01L23/49575 ,  H01L25/0657

Abstract: A package module includes a power module, a first thermal dissipating component and a packaging plastic. The power module includes a substrate and at least one power semiconductor component disposed on the substrate. The first thermal dissipating component is disposed over the power module. The packaging plastic covers the power module and the first thermal dissipating component, wherein a portion of the first thermal dissipating component is exposed from the packaging plastic.