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公开(公告)号：US10328606B2
公开(公告)日：2019-06-25
申请号：US15647938
申请日：2017-07-12
Applicant: DISCO CORPORATION
Inventor： Fumio Uchida
IPC: B28D5/00 , B28D5/02 , B28D7/00 , B24B49/16 , B24B55/02 , B24B49/00 , B28D1/04 , B28D7/02 , B26D1/54 , B28D1/24
Abstract: A controller of a cutting apparatus includes: a storage section configured to preliminarily store as a threshold an arbitrary value based on a load current value of a motor detected when a cutting blade is rotated at a predetermined rotational speed while supplying a predetermined quantity of cutting water in a state in which a cutting water supply nozzle is positioned in an appropriate position; and a judgment section configured to judge normality or abnormality according to the result of comparison between a load current value detected when the cutting blade is rotated at the predetermined rotational speed while supplying the predetermined quantity of cutting water and the threshold stored in the storage section.
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公开(公告)号：US20180015638A1
公开(公告)日：2018-01-18
申请号：US15647938
申请日：2017-07-12
Applicant: DISCO CORPORATION
Inventor： Fumio Uchida
CPC classification number: B28D5/0076 , B24B49/006 , B24B49/16 , B24B55/02 , B26D1/54 , B28D1/044 , B28D1/046 , B28D1/24 , B28D5/0064 , B28D5/022 , B28D7/005 , B28D7/02
Abstract: A controller of a cutting apparatus includes: a storage section configured to preliminarily store as a threshold an arbitrary value based on a load current value of a motor detected when a cutting blade is rotated at a predetermined rotational speed while supplying a predetermined quantity of cutting water in a state in which a cutting water supply nozzle is positioned in an appropriate position; and a judgment section configured to judge normality or abnormality according to the result of comparison between a load current value detected when the cutting blade is rotated at the predetermined rotational speed while supplying the predetermined quantity of cutting water and the threshold stored in the storage section.
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公开(公告)号：US10211164B2
公开(公告)日：2019-02-19
申请号：US15845803
申请日：2017-12-18
Applicant: DISCO CORPORATION
Inventor： Youngsuk Kim , Byeongdeck Jang , Fumio Uchida
IPC: H01L21/78 , H01L23/552 , H01L21/48 , H01L21/56 , H01L23/31 , H01L23/498 , H01L23/00
Abstract: A plurality of semiconductor packages are manufactured by a method that includes the steps of bonding a plurality of semiconductor chips on the front side of a wiring substrate, next supplying a sealing compound to the front side of the wiring substrate to form a resin layer from the sealing component on the front side of the wiring substrate, thereby forming a sealed substrate including the wiring substrate and the resin layer covering the semiconductor chips, next cutting the sealed substrate from the resin layer side by using a V blade to thereby form a V groove along each division line, next dividing the wiring substrate along each V groove to obtain a plurality of individual bare packages, and finally forming an electromagnetic shield layer on the upper surface and an inclined side surface of each bare package, thereby obtaining the plural semiconductor packages.
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公开(公告)号：US09105708B2
公开(公告)日：2015-08-11
申请号：US14013965
申请日：2013-08-29
Applicant: Disco Corporation
Inventor： Fumio Uchida
IPC: H01L21/78 , H01L21/67 , H01L21/683 , H01L21/66
CPC classification number: H01L21/78 , H01L21/67132 , H01L21/6835 , H01L21/6836 , H01L22/12 , H01L22/20
Abstract: A wafer processing method divides a wafer along a plurality of crossing streets formed on the front side of the wafer to thereby partition a plurality of regions where a plurality of devices are respectively formed. The method includes a division groove forming step of cutting the back side of the wafer along each street by using a cutting blade to thereby form a division groove along each street with a predetermined thickness left between the bottom of the division groove and the front side of the wafer, a wafer supporting step of attaching the back side of the wafer to a dicing tape supported by an annular frame, and a wafer dividing step of applying an external force to the wafer attached to the dicing tape to thereby divide the wafer into the individual devices along the streets where the division grooves are respectively formed.
Abstract translation: 晶片处理方法沿着形成在晶片的前侧上的多个交叉街道划分晶片，从而划分分别形成多个器件的多个区域。 该方法包括：分割槽形成步骤，通过使用切割刀沿着每个街道切割晶片的背面，从而沿着每个街道形成分隔槽，在分隔槽的底部和前侧之间留有预定厚度 晶片，将晶片的背面附接到由环形框架支撑的切割带的晶片支撑步骤，以及将晶片分割步骤，将外力施加到附着于切割带的晶片上，从而将晶片分成 分别形成有划分凹槽的街道上的各个装置。
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公开(公告)号：US20160091887A1
公开(公告)日：2016-03-31
申请号：US14860194
申请日：2015-09-21
Applicant: DISCO CORPORATION
Inventor： Masahiro Kubo , Fumio Uchida , Yohei Yamada
IPC: G05B19/402 , G05B15/02
CPC classification number: G05B19/402 , G05B15/02 , G05B2219/35527 , G05B2219/49074
Abstract: A cutting apparatus including a cutting unit on which a cutting blade is detachably mounted, a control unit for controlling the cutting unit, and a blade case holder for holding a blade case for storing the cutting blade is provided. The blade case is provided with an IC tag allowing reading and writing of use history information of the cutting blade. The control unit is connected to a read/write unit for reading the use history information from the IC tag of the blade case held by the blade case holder and writing the use history information to the IC tag. The use history information read from the IC tag by the read/write unit is reflected in processing conditions for a workpiece to be processed, and the use history information after processing of the workpiece is written to the IC tag by the read/write unit.
Abstract translation: 一种切割装置，包括切割单元，切割刀片可拆卸地安装在其上，用于控制切割单元的控制单元和用于保持用于存储切割刀片的刀片壳体的刀片保持器。 叶片壳体设置有IC标签，其允许读取和写入切割刀片的使用历史信息。 控制单元连接到读/写单元，用于从由刀片盒保持器保持的刀片盒的IC标签读取使用历史信息，并将使用历史信息写入IC标签。 通过读/写单元从IC标签读取的使用历史信息反映在待处理工件的处理条件中，并且通过读/写单元将工件处理后的使用历史信息写入IC标签。
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Patent Agency Ranking
公开(公告)号：US20150187650A1
公开(公告)日：2015-07-02
申请号：US14572917
申请日：2014-12-17
Applicant: DISCO CORPORATION
Inventor： Fumio Uchida , Yoshihiro Tsutsumi
IPC: H01L21/78
CPC classification number: H01L21/78 , B23K26/364 , B23K2103/56 , B28D5/0011 , B28D5/0052 , H01L21/3043 , H01L21/311 , H01L21/6835 , H01L21/6836 , H01L2221/68327 , H01L2221/68336 , H01L2221/6834
Abstract: A wafer processing method includes a functional layer cutting step of applying a laser beam along each division line formed on a functional layer to thereby ablate the functional layer and form a laser processed groove along each division line. A protective member is attached to the front side of the functional layer. A groove is cut by positioning a cutting blade on the back side of the substrate in the area corresponding to each division line. The cut groove has a depth not reaching the functional layer. A dicing tape is attached to the back side of the substrate to support the outer circumferential portion of the dicing tape to an annular frame. The protective member is peeled off and the dicing tape attached to the back side of the substrate is expanded to increase the spacing between the devices.
Abstract translation: 晶片处理方法包括：功能层切割步骤，沿着形成在功能层上的分割线施加激光束，从而消除功能层，并沿着分割线形成激光加工槽。 保护构件附接到功能层的前侧。 通过在与每个分割线对应的区域中的基板的背面上设置切割刀片来切割凹槽。 切槽具有未到达功能层的深度。 将切割带附着到基板的背面，以将切割带的外圆周部分支撑到环形框架上。 剥离保护构件，并且附着到基板的背面的切割带膨胀以增加装置之间的间隔。
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公开(公告)号：US20180182715A1
公开(公告)日：2018-06-28
申请号：US15845803
申请日：2017-12-18
Applicant: DISCO CORPORATION
Inventor： Youngsuk Kim , Byeongdeck Jang , Fumio Uchida
IPC: H01L23/552 , H01L21/78 , H01L21/48 , H01L21/56 , H01L23/498 , H01L23/31 , H01L23/00
CPC classification number: H01L23/552 , H01L21/4853 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L21/78 , H01L23/3114 , H01L23/3128 , H01L23/49816 , H01L23/49838 , H01L24/16 , H01L24/48 , H01L24/97 , H01L2221/68331 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2224/95001 , H01L2224/97 , H01L2924/10253 , H01L2924/10329 , H01L2924/15159 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2224/85 , H01L2224/81
Abstract: A plurality of semiconductor packages are manufactured by a method that includes the steps of bonding a plurality of semiconductor chips on the front side of a wiring substrate, next supplying a sealing compound to the front side of the wiring substrate to form a resin layer from the sealing component on the front side of the wiring substrate, thereby forming a sealed substrate including the wiring substrate and the resin layer covering the semiconductor chips, next cutting the sealed substrate from the resin layer side by using a V blade to thereby form a V groove along each division line, next dividing the wiring substrate along each V groove to obtain a plurality of individual bare packages, and finally forming an electromagnetic shield layer on the upper surface and an inclined side surface of each bare package, thereby obtaining the plural semiconductor packages.
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公开(公告)号：US10061293B2
公开(公告)日：2018-08-28
申请号：US14860194
申请日：2015-09-21
Applicant: DISCO CORPORATION
Inventor： Masahiro Kubo , Fumio Uchida , Yohei Yamada
IPC: G06F19/00 , G05B19/402 , G05B15/02
CPC classification number: G05B19/402 , G05B15/02 , G05B2219/35527 , G05B2219/49074
Abstract: A cutting apparatus including a cutting unit on which a cutting blade is detachably mounted, a control unit for controlling the cutting unit, and a blade case holder for holding a blade case for storing the cutting blade is provided. The blade case is provided with an IC tag allowing reading and writing of use history information of the cutting blade. The control unit is connected to a read/write unit for reading the use history information from the IC tag of the blade case held by the blade case holder and writing the use history information to the IC tag. The use history information read from the IC tag by the read/write unit is reflected in processing conditions for a workpiece to be processed, and the use history information after processing of the workpiece is written to the IC tag by the read/write unit.
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公开(公告)号：US09209085B2
公开(公告)日：2015-12-08
申请号：US14572917
申请日：2014-12-17
Applicant: DISCO CORPORATION
Inventor： Fumio Uchida , Yoshihiro Tsutsumi
IPC: H01L21/78
CPC classification number: H01L21/78 , B23K26/364 , B23K2103/56 , B28D5/0011 , B28D5/0052 , H01L21/3043 , H01L21/311 , H01L21/6835 , H01L21/6836 , H01L2221/68327 , H01L2221/68336 , H01L2221/6834
Abstract: A wafer processing method includes a functional layer cutting step of applying a laser beam along each division line formed on a functional layer to thereby ablate the functional layer and form a laser processed groove along each division line. A protective member is attached to the front side of the functional layer. A groove is cut by positioning a cutting blade on the back side of the substrate in the area corresponding to each division line. The cut groove has a depth not reaching the functional layer. A dicing tape is attached to the back side of the substrate to support the outer circumferential portion of the dicing tape to an annular frame. The protective member is peeled off and the dicing tape attached to the back side of the substrate is expanded to increase the spacing between the devices.
Abstract translation: 晶片处理方法包括：功能层切割步骤，沿着形成在功能层上的分割线施加激光束，从而消除功能层，并沿着分割线形成激光加工槽。 保护构件附接到功能层的前侧。 通过在与每个分割线对应的区域中的基板的背面上设置切割刀片来切割凹槽。 切槽具有未到达功能层的深度。 将切割带附着到基板的背面，以将切割带的外圆周部分支撑到环形框架上。 剥离保护构件，并且附着到基板的背面的切割带膨胀以增加装置之间的间隔。
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公开(公告)号：US20140073067A1
公开(公告)日：2014-03-13
申请号：US14013965
申请日：2013-08-29
Applicant: Disco Corporation
Inventor： Fumio Uchida
CPC classification number: H01L21/78 , H01L21/67132 , H01L21/6835 , H01L21/6836 , H01L22/12 , H01L22/20
Abstract: A wafer processing method divides a wafer along a plurality of crossing streets formed on the front side of the wafer to thereby partition a plurality of regions where a plurality of devices are respectively formed. The method includes a division groove forming step of cutting the back side of the wafer along each street by using a cutting blade to thereby form a division groove along each street with a predetermined thickness left between the bottom of the division groove and the front side of the wafer, a wafer supporting step of attaching the back side of the wafer to a dicing tape supported by an annular frame, and a wafer dividing step of applying an external force to the wafer attached to the dicing tape to thereby divide the wafer into the individual devices along the streets where the division grooves are respectively formed.
Abstract translation: 晶片处理方法沿着形成在晶片的前侧上的多个交叉街道划分晶片，从而划分分别形成多个器件的多个区域。 该方法包括：分割槽形成步骤，通过使用切割刀沿着每个街道切割晶片的背面，从而沿着每个街道形成分隔槽，在分隔槽的底部和前侧之间留有预定厚度 晶片，将晶片的背面附接到由环形框架支撑的切割带的晶片支撑步骤，以及将晶片分割步骤，将外力施加到附着于切割带的晶片上，从而将晶片分成 分别形成有划分凹槽的街道上的各个装置。
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