摘要:
High molecular weight, essentially linear, thermoplastic amino-s-triazine resins having an inherent viscosity of at least about 0.55 dl./g. are disclosed, comprising recurring units of the formula: ##STR1## containing not less than 25 wt. % of triamino-s-triazine units of the formula: ##STR2## Such resins are suitable for molding or extrusion into films, fibers and filaments and for preparation of composite materials.Also disclosed is a process for the production of high molecular weight essentially linear, thermoplastic amino-s-triazine resins which comprises reacting, in contact with water, an inert, water-immiscible organic solvent for at least one of the reactants and a basic acid acceptor, substantially equimolar proportions of a triazine compound or a mixture of triazine compounds of the formula: ##STR3## with a diamine or a mixture of diamines of the formula: ##STR4## until a thermoplastic amino-s-triazine resin having an inherent viscosity of at least about 0.55 dl/g., is produced.
摘要:
A completion assembly for use in a lateral well bore has a base pipe with a plurality of holes through the sidewall of the base pipe. Flow through the holes is regulated to produce an influx difference between the ends of the base pipe. Flow can be regulated by variably spacing or sizing the holes. Flow can also be regulated by selectively inserting a rod between adjacent splines located on the base pipe to cover and block the flow through certain holes in the base pipe. Flow can also be regulated using a rotatable sleeve adjacent to the base pipe such that rotation of the sleeve brings the holes and openings in the pipe and sleeve, respectively, into and out of alignment. A filter can be used to filter sand and other particulates. An erosion inhibitor can be used to extend the useful life of the assembly.
摘要:
A rigid-flexible circuit board is fabricated by providing a core having a dielectric substrate and conductive layer thereon. A sub-composite comprising a polyimide and rigid dielectric substrate adjacent the conductive layer and in both the rigid and flexible segments of the board is provided. A release layer corresponding to the flexible segment of the board is provided. A rigid bonding layer is provided at rigid segments of the board but not at the flexible segments. A composite is formed by providing a second conductive layer adjacent the rigid bonding layer. The composite is laminated. Portions of the second conductive layer corresponding to the flexible segment and release layer are removed.
摘要:
Solder interconnection whereby the gap created by solder connections between a carrier substrate and semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler having a maximum particle size of 31 microns and being at least substantially free of alpha particle emissions.
摘要:
A liquid expoxy composition containing a diglycidyl ether of a dihydric phenol and/or a diglycidyl ether of a tetrabrominated dihydric phenol, an epoxy with a functionality from 2.2 to 4, cycloaliphatic diamine curing agent, and thixotropic agent; and use thereof to fill drilled through-holes in circuit boards and cards and as isolation border around the edges of a board or card.
摘要:
Polymers of a polyfunctional epoxy compound, N,N,N',N'-tetraglycidyl-1,3-propylene bis(p-aminobenzoate), formed by reaction of such epoxy compound with aromatic polyamines. The disclosed polymers are useful as structural resins, e.g., as advanced composite matrix resins.
摘要:
A haptic reconfigurable dashboard system for controlling and monitoring vehicle subsystems is disclosed. The haptic dashboard system comprises (a) a computer for controlling the haptic reconfigurable dashboard system, (b) a virtual device panel for displaying a virtual control device or indicator, the virtual control device or indicator corresponding to one of the subsystems to be controlled or monitored, (c) a haptic device for manipulating the virtual control device or indicator displayed on the virtual device panel, and (d) a haptic feedback mechanism for providing a force effect to the haptic device when it manipulates the virtual control device or indicator. According to virtual controls being carried out in the dashboard system, the subsystems can be controlled or monitored through an interface between the dashboard system and the subsystems, and a user can feel a sense of touching or force through the haptic device while controlling or monitoring the vehicle subsystems.
摘要:
A multiplexing and de-multiplexing system that may both use the same wavelength division multiplexing (WDM) device. For multiplexing, light sources provide a plurality of light beams having different wavelengths and the WDM forms a single light beam. For de-multiplexing, a light source provides a light beam having a plurality of different light wavelengths and the WDM forms a plurality of output light beams each having respective of the wavelengths. The WDM devices may particularly be formed from optically multi-dimensional planar gratings and cubical gratings which may diffract single wavelengths, sets of wavelengths, and ranges of wavelengths each with respect to one optical dimension present. The gratings may be discrete or integrated in the multiplexing or the de-multiplexing devices. Complex embodiments of the multiplexing system, such as an interleaver, and complex embodiments of the de-multiplexing system, such as a de-interleaver, can be formed using blocks of the gratings.
摘要:
A process (400) to construct single- and multi-dimensional optical gratings (100, 800) of interlayers (110, 230, 310 808) of differing refractive index, either in or atop a non-fiber substrate material (104, 202, 302). The optical gratings (100, 800) may particularly be Bragg type gratings, and thus suitable for receiving a laser beam (102, 240, 802) and forming there from one or more reflected beam portions (118, 248, 810) having one or more narrow wavelengths and a passed beam portion (120, 250, 812) of other wavelengths.
摘要:
Compositions containing bisphenol M dicyanate, prepolymer thereof, or mixtures thereof, and 4,4'-ethylidene bisphenol dicyanate, prepolymer thereof or mixtures thereof; and filler having maximum particle size of 20 microns and being substantially free of alpha particle emissions. The compositions are useful in forming interconnection structures for forming an integrated semiconductor device to a carrier substrate.