Abstract:
Various embodiments provide a card reader that provides heat dissipation for high data transfer ICCs. The card reader includes a body having a press bar that physically contacts an upper surface of the ICC when fully inserted into the card reader. The press bar includes an aperture directly overlying and aligned with the card contacts of the card reader and the contact pads of the ICC when fully inserted. The aperture allows any heat generated by the ICC to radiate to a surrounding cooling medium, such as air.
Abstract:
Various embodiments provide a dual purpose press-bar and heat sink for an integrated circuit card (ICC) reader. The dual purpose press-bar and heat sink provides two functions. First, the dual purpose press-bar and heat sink conducts and dissipates internal heat generated by a high data transfer ICC inserted in to the ICC reader. Second, the dual purpose press-bar and heat sink ensures that contact pads of the high data transfer ICC create reliable electrical connections with ICC contacts of the ICC reader. As such, the dual purpose press-bar and heat sink simultaneously dissipates heat from a high data transfer ICC and ensures that a high data transfer ICC maintains proper electrical connections with ICC contacts of an ICC reader.
Abstract:
Various embodiments provide a dual purpose press-bar and heat sink for an integrated circuit card (ICC) reader. The dual purpose press-bar and heat sink provides two functions. First, the dual purpose press-bar and heat sink conducts and dissipates internal heat generated by a high data transfer ICC inserted in to the ICC reader. Second, the dual purpose press-bar and heat sink ensures that contact pads of the high data transfer ICC create reliable electrical connections with ICC contacts of the ICC reader. As such, the dual purpose press-bar and heat sink simultaneously dissipates heat from a high data transfer ICC and ensures that a high data transfer ICC maintains proper electrical connections with ICC contacts of an ICC reader.
Abstract:
An enhanced smartcard reader having a row of first reading contacts, a row of second reading contacts, and a row of third reading contacts. The first reading contacts have arm portions that are cantilevered off a first mounting member of the reader, the second reading contacts have arm portions that are cantilevered off a second mounting member of the reader, and the third reading contacts have arm portions that are cantilevered off a third mounting member of the reader. The third mounting member is located vertically distanced from the second mounting member, and the arm portions of the third reading contacts directly overlay the arm portions of the second reading contacts.
Abstract:
An enhanced smartcard reader having a row of first reading contacts, a row of second reading contacts, and a row of third reading contacts. The first reading contacts have arm portions that are cantilevered off a first mounting member of the reader, the second reading contacts have arm portions that are cantilevered off a second mounting member of the reader, and the third reading contacts have arm portions that are cantilevered off a third mounting member of the reader. The third mounting member is located vertically distanced from the second mounting member, and the arm portions of the third reading contacts directly overlay the arm portions of the second reading contacts.
Abstract:
Various embodiments provide a dual purpose press-bar and heat sink for an integrated circuit card (ICC) reader. The dual purpose press-bar and heat sink provides two functions. First, the dual purpose press-bar and heat sink conducts and dissipates internal heat generated by a high data transfer ICC inserted in to the ICC reader. Second, the dual purpose press-bar and heat sink ensures that contact pads of the high data transfer ICC create reliable electrical connections with ICC contacts of the ICC reader. As such, the dual purpose press-bar and heat sink simultaneously dissipates heat from a high data transfer ICC and ensures that a high data transfer ICC maintains proper electrical connections with ICC contacts of an ICC reader.
Abstract:
A heat sink embodiment has at least one anti-rocking tab that extends outwardly and downwardly from an edge of the body portion of the heat sink. A leading lower edge of the anti-rocking tab is above a top surface of the motherboard when the heat sink is being affixed to the motherboard over a flip chip. During installation of the heat sink to the motherboard, a travel distance limit is imposed by the leading lower edge of the anti-rocking tab, thereby limiting a force that is applied to the die of the flip chip so that an edge and/or a corner of the die of the flip chip is not crushed, or such that the die of the flip chip is not cracked.
Abstract:
A heat sink embodiment has at least one anti-rocking tab that extends outwardly and downwardly from an edge of the body portion of the heat sink. A leading lower edge of the anti-rocking tab is above a top surface of the motherboard when the heat sink is being affixed to the motherboard over a flip chip. During installation of the heat sink to the motherboard, a travel distance limit is imposed by the leading lower edge of the anti-rocking tab, thereby limiting a force that is applied to the die of the flip chip so that an edge and/or a corner of the die of the flip chip is not crushed, or such that the die of the flip chip is not cracked.
Abstract:
A reverse tapered mounting tab for a signal connector is disclosed. The signal connector includes the reverse tapered mounting tab coupled to a connector body having a connector port inside. The reverse tapered mounting tab is configured to be secured in a through hole of a circuit board. Solder may be positioned in the through hole after positioning the mounting tab. The solder may prevent the mechanical tab from being forced through the through hole even after minor cracking and deformations in the solder.
Abstract:
A reverse tapered mounting tab for a signal connector is disclosed. The signal connector includes the reverse tapered mounting tab coupled to a connector body having a connector port inside. The reverse tapered mounting tab is configured to be secured in a through hole of a circuit board. Solder may be positioned in the through hole after positioning the mounting tab. The solder may prevent the mechanical tab from being forced through the through hole even after minor cracking and deformations in the solder.