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    System and method for miniaturization of synthetic jets
    4.
    发明授权
    System and method for miniaturization of synthetic jets 有权
    合成射流小型化的系统和方法

    公开(公告)号：US09216899B2

    公开(公告)日：2015-12-22

    申请号：US13862616

    申请日：2013-04-15

    Applicant: General Electric Company

    Inventor： Mehmet Arik ,  Stanton Earl Weaver

    IPC: F04B45/047 ,  B81B7/00 ,  H01L23/467 ,  B81C1/00 ,  H01L41/09

    CPC classification number: B81B7/0093 ,  B81B2201/036 ,  B81B2201/058 ,  B81B2203/0127 ,  B81C1/00158 ,  F04B45/047 ,  H01L23/467 ,  H01L41/0973 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A micro-electromechanical (MEM) synthetic jet actuator includes a semiconductor substrate having a cavity extending therethrough, such that a first opening is formed in a first surface of the semiconductor substrate and such that a second opening is formed in a second surface of the semiconductor substrate. A first flexible membrane is formed on at least a portion of the front surface of the semiconductor substrate and extends over the first opening. The first flexible membrane also includes an orifice formed therein aligned with the first opening. The MEM synthetic jet actuator also includes a second flexible membrane that is formed on at least a portion of the second surface of the semiconductor substrate and that extends over the second opening, and a pair of actuator elements coupled to the flexible membranes and aligned with the cavity to selectively cause displacement of the first and second flexible membranes.

    Abstract translation: 微机电（MEM）合成射流致动器包括具有延伸穿过其中的空腔的半导体衬底，使得第一开口形成在半导体衬底的第一表面中，并且第二开口形成在半导体的第二表面中 基质。 第一柔性膜形成在半导体衬底的前表面的至少一部分上并在第一开口上延伸。 第一柔性膜还包括与第一开口对准的孔口。 MEM合成射流致动器还包括第二柔性膜，其形成在半导体衬底的第二表面的至少一部分上并且在第二开口上延伸，以及一对致动器元件，其耦合到柔性膜并与 以选择性地引起第一和第二柔性膜的位移。

    Cooling systems employing fluidic jets, methods for their use and methods for cooling
    5.
    再颁专利
    Cooling systems employing fluidic jets, methods for their use and methods for cooling 有权
    采用流体喷射的冷却系统，其使用方法和冷却方法

    公开(公告)号：USRE45376E1

    公开(公告)日：2015-02-17

    申请号：US14072903

    申请日：2013-11-06

    Applicant: General Electric Company

    Inventor： Mehmet Arik ,  Todd Garrett Wetzel ,  Stephen Adam Solovitz

    IPC: F28F13/02 ,  F28F13/12 ,  H05K7/20 ,  F28F13/08 ,  F28F13/10

    CPC classification number: H01L23/4735 ,  H01L2924/0002 ,  Y10S165/908 ,  H01L2924/00

    Abstract: In one embodiment, a cooling system is disclosed. The cooling system comprises: a cooling channel for receiving a cooling media, a substrate disposed near the cooling channel, and a fluidic jet disposed within the substrate and in fluid communication with the cooling channel. The cooling channel is for thermal communication with a component to be cooled. The cooling channel has a height of less than or equal to about 3 mm and a width of less than or equal to 2 mm. The fluidic jet comprises a cavity defined by a well and a membrane. In one embodiment, a method of cooling an electrical component comprises: passing a cooling media through a cooling channel, drawing the cooling media into one or more of the fluidic jets, expelling the cooling media from the one or more fluidic jets into the cooling channel, and removing thermal energy from the electrical component.

    Abstract translation: 在一个实施例中，公开了一种冷却系统。 冷却系统包括：用于接收冷却介质的冷却通道，设置在冷却通道附近的基板以及设置在基板内并与冷却通道流体连通的流体射流。 冷却通道用于与要冷却的部件进行热连通。 冷却通道的高度小于或等于约3mm，宽度小于或等于2mm。 流体射流包括由阱和膜限定的空腔。 在一个实施例中，一种冷却电气部件的方法包括：使冷却介质通过冷却通道，将冷却介质拉入一个或多个流体喷流中，将冷却介质从一个或多个流体喷流排出到冷却通道 并且从电气部件去除热能。

    SYSTEM AND METHOD FOR MINIATURIZATION OF SYNTHETIC JETS
    6.
    发明申请
    SYSTEM AND METHOD FOR MINIATURIZATION OF SYNTHETIC JETS 有权

    公开(公告)号：US20130230934A1

    公开(公告)日：2013-09-05

    申请号：US13862616

    申请日：2013-04-15

    Applicant: GENERAL ELECTRIC COMPANY

    Inventor： Mehmet Arik ,  Stanton Earl Weaver

    IPC: B81C1/00

    CPC classification number: B81B7/0093 ,  B81B2201/036 ,  B81B2201/058 ,  B81B2203/0127 ,  B81C1/00158 ,  F04B45/047 ,  H01L23/467 ,  H01L41/0973 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A micro-electromechanical (MEM) synthetic jet actuator includes a semiconductor substrate having a cavity extending therethrough, such that a first opening is formed in a first surface of the semiconductor substrate and such that a second opening is formed in a second surface of the semiconductor substrate. A first flexible membrane is formed on at least a portion of the front surface of the semiconductor substrate and extends over the first opening. The first flexible membrane also includes an orifice formed therein aligned with the first opening. The MEM synthetic jet actuator also includes a second flexible membrane that is formed on at least a portion of the second surface of the semiconductor substrate and that extends over the second opening, and a pair of actuator elements coupled to the flexible membranes and aligned with the cavity to selectively cause displacement of the first and second flexible membranes.

    Method and apparatus for improved cooling of a heat sink using a synthetic jet
    7.
    发明授权
    Method and apparatus for improved cooling of a heat sink using a synthetic jet 有权

    公开(公告)号：US10274264B2

    公开(公告)日：2019-04-30

    申请号：US14302613

    申请日：2014-06-12

    Applicant: General Electric Company

    Inventor： Mehmet Arik ,  Yogen Vishwas Utturkar

    IPC: F28F3/02 ,  H01L23/467

    Abstract: A system for cooling a device includes a heat sink comprising a substrate having a plurality of fins arranged thereon, a fan positioned to direct an ambient fluid in a first direction across the heat sink, and a first synthetic jet assembly comprising one of a multi-orifice synthetic jet and a plurality of single orifice synthetic jets. The first synthetic jet assembly is configured to direct the ambient fluid in a second direction across the heat sink, wherein the second direction is approximately perpendicular to the first direction.

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