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公开(公告)号：US09511220B2
公开(公告)日：2016-12-06
申请号：US14600401
申请日：2015-01-20
Applicant: Greatbatch Ltd.
Inventor： Thomas Marzano , Keith W. Seitz , Robert A. Stevenson , Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Richard L. Brendel , Jason Woods , Steven W. Winn , Dominick J. Frustaci , Bruehl E. Truex , Donald H. Hickel, Jr.
IPC: A61N1/00 , A61N1/08 , A61N1/05 , H01G4/35 , H01G2/10 , H01R43/00 , H01G4/005 , H01G4/12 , H01G4/40 , H02G3/22 , A61N1/372 , A61N1/375 , C22C29/12
CPC classification number: A61N1/3754 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , B23K35/3013 , C22C29/12 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01R43/00 , H02G3/22 , Y10T156/1052
Abstract: An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.
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2.发明申请公开(公告)号：US20150134039A1
公开(公告)日：2015-05-14
申请号：US14600401
申请日：2015-01-20
Applicant: Greatbatch Ltd.
Inventor： Thomas Marzano , Keith W. Seitz , Robert A. Stevenson , Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Richard L. Brendel , Jason Woods , Steven W. Winn , Dominick J. Frustaci , Bruehl E. Truex , Donald H. Hickel, JR.
CPC classification number: A61N1/3754 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , B23K35/3013 , C22C29/12 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01R43/00 , H02G3/22 , Y10T156/1052
Abstract: An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.
Abstract translation: 升高的馈通可附接到有源可植入医疗装置的顶部或侧面。 馈通包括导电套圈和电介质基片。 电介质基板被定义为包括体液侧和设置在导电套圈内的器件侧。 电介质基片包括通常在导电套圈上方升高的体液侧提升部分。 至少一个通孔穿过电介质基底从体液侧设置到器件侧。 导电填料设置在至少一个通孔内，形成气密密封并在体液侧和装置侧之间导电。 引线连接特征在体液侧电耦合到导电填充物并且邻近电介质基底的升高部分设置。
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3.发明申请CO-FIRED HERMETICALLY SEALED FEEDTHROUGH WITH ALUMINA SUBSTRATE AND PLATINUM FILLED VIA FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE 有权通过用于活性可植入医疗装置填充的氧化铝基底和铂填充物进行密封公开(公告)号：US20130184797A1
公开(公告)日：2013-07-18
申请号：US13743254
申请日：2013-01-16
Applicant: Greatbatch Ltd.
Inventor： Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Keith W. Seitz , Robert A. Stevenson , Richard L. Brendel , Thomas Marzano , Jason Woods , Dominick J. Frustaci , Steven W. Winn
IPC: A61N1/05
CPC classification number: A61N1/3754 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , B23K35/3013 , C22C29/12 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01R43/00 , H02G3/22 , Y10T156/1052
Abstract: A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.
Abstract translation: 共同燃烧的密封馈通可附接到主动植入式医疗装置。 馈通包括包含至少96或99％的氧化铝的氧化铝介电衬底。 通孔穿过氧化铝电介质基板从体液侧设置到器件侧。 在通孔内设置基本封闭的无孔和基本上纯的铂填充物，其在体液侧和装置侧之间形成通过导电的铂填充通孔。 铂填充物和氧化铝电介质基底之间的气密密封，其中气密密封包括在氧化铝电介质基底和铂填充物之间的曲折且相互共形的界面。
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公开(公告)号：US20190207199A1
公开(公告)日：2019-07-04
申请号：US16295518
申请日：2019-03-07
Applicant: Greatbatch Ltd.
Inventor： Robert S. Rubino , William C. Thiebolt , Marcus J. Palazzo , Joseph M. Lehnes , Ho-Chul Yun , Mark J. Roy
IPC: H01M4/04 , H01M4/66 , H01M4/1393 , H01M4/1391 , H01M10/0569 , H01M10/0568 , H01M4/133 , H01M4/136 , H01M4/131 , H01M4/62 , H01M4/36 , H01M10/052 , H01M4/1397
CPC classification number: H01M4/0404 , H01M4/131 , H01M4/133 , H01M4/136 , H01M4/1391 , H01M4/1393 , H01M4/1397 , H01M4/366 , H01M4/623 , H01M4/624 , H01M4/661 , H01M10/052 , H01M10/0568 , H01M10/0569 , H01M2220/30
Abstract: A lithium electrochemical cell with increased energy density is described. The electrochemical cell comprises an improved sandwich cathode design with a second cathode active material of a relatively high energy density but of a relatively low rate capability sandwiched between two current collectors and with a first cathode active material having a relatively low energy density but of a relatively high rate capability in contact with the opposite sides of the two current collectors. In addition, a cathode fabrication process is described that increases manufacturing efficiency. The cathode fabrication process comprises a process in which first and second cathode active materials are directly applied to opposite surfaces of a perforated current collector and laminated together. The present cathode design is useful for powering an implantable medical device requiring a high rate discharge application.
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公开(公告)号：US10263240B2
公开(公告)日：2019-04-16
申请号：US15290595
申请日：2016-10-11
Applicant: Greatbatch Ltd.
Inventor： Robert S. Rubino , William C. Thiebolt , Marcus J. Palazzo , Joseph M. Lehnes , Ho-Chul Yun , Mark J. Roy
IPC: H01M4/04 , H01M4/131 , H01M4/66 , H01M4/133 , H01M10/0568 , H01M10/0569 , H01M4/1391 , H01M4/1393 , H01M4/36 , H01M4/62 , H01M4/136 , H01M4/1397 , H01M10/052
Abstract: A lithium electrochemical cell with increased energy density is described. The electrochemical cell comprises an improved sandwich cathode design with a second cathode active material of a relatively high energy density but of a relatively low rate capability sandwiched between two current collectors and with a first cathode active material having a relatively low energy density but of a relatively high rate capability in contact with the opposite sides of the two current collectors. In addition, a cathode fabrication process is described that increases manufacturing efficiency. The cathode fabrication process comprises a process in which first and second cathode active materials are directly applied to opposite surfaces of a perforated current collector and laminated together. The present cathode design is useful for powering an implantable medical device requiring a high rate discharge application.
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Patent Agency Ranking
公开(公告)号：US09687662B2
公开(公告)日：2017-06-27
申请号：US14797123
申请日：2015-07-11
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Keith W. Seitz , Richard L. Brendel , Thomas Marzano , Jason Woods , Dominick J. Frustaci , Steven W. Winn
Abstract: A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.
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公开(公告)号：US09583271B1
公开(公告)日：2017-02-28
申请号：US13932034
申请日：2013-07-01
Applicant: Greatbatch Ltd.
Inventor： Donald F. Kaiser , William C. Thiebolt , Jason T. Hahl
CPC classification number: H01G9/0029 , B02C19/186 , H01G9/042 , H01G9/052 , H01G9/0525 , H01G9/06 , H01G9/08 , H01G9/145
Abstract: An electrolytic capacitor comprising an anode comprised of cryogenically milled anode material is described. The cryogenic milling process prepares the active anode material for anode fabrication. The capacitor further comprises a casing of first and second casing members secured to each other to provide an enclosure. A feedthrough electrically insulated from the casing and from the casing and extending there from through a glass-to-metal seal, at least one anode electrically connected within the casing, a cathode, and an electrolyte. The cathode is of a cathode active material deposited on planar faces of the first and second casing members.
Abstract translation: 描述包括由低温法研磨的阳极材料构成的阳极的电解电容器。 低温研磨工艺制备用于阳极制造的活性阳极材料。 电容器还包括彼此固定以提供外壳的第一和第二壳体构件的壳体。 一种馈电线，其与所述壳体和所述壳体电绝缘，并通过玻璃 - 金属密封件延伸，至少一个阳极电连接在所述壳体内，阴极和电解质。 阴极是沉积在第一和第二壳体构件的平面上的阴极活性材料。
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公开(公告)号：US09514886B1
公开(公告)日：2016-12-06
申请号：US15220345
申请日：2016-07-26
Applicant: Greatbatch Ltd.
Inventor： Donald F. Kaiser , William C. Thiebolt , Jason T. Hahl
CPC classification number: H01G9/0029 , B02C19/186 , H01G9/042 , H01G9/052 , H01G9/0525 , H01G9/06 , H01G9/08 , H01G9/145
Abstract: An electrolytic capacitor comprising an anode comprised of cryogenically milled anode material is described. The cryogenic milling process prepares the active anode material for anode fabrication. The capacitor further comprises a casing of first and second casing members secured to each other to provide an enclosure. A feedthrough electrically insulated from the casing and from the casing and extending there from through a glass-to-metal seal, at least one anode electrically connected within the casing, a cathode, and an electrolyte. The cathode is of a cathode active material deposited on planar faces of the first and second casing members.
Abstract translation: 描述包括由低温法研磨的阳极材料构成的阳极的电解电容器。 低温研磨工艺制备用于阳极制造的活性阳极材料。 电容器还包括彼此固定以提供外壳的第一和第二壳体构件的壳体。 一种馈电线，其与所述壳体和所述壳体电绝缘，并通过玻璃 - 金属密封件延伸，至少一个阳极电连接在所述壳体内，阴极和电解质。 阴极是沉积在第一和第二壳体构件的平面上的阴极活性材料。
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公开(公告)号：US10857368B2
公开(公告)日：2020-12-08
申请号：US15936495
申请日：2018-03-27
Applicant: Greatbatch Ltd.
Inventor： Keith W. Seitz , Xiaohong Tang , William C. Thiebolt , Jonathan Calamel , Thomas Shi , Thomas Marzano
Abstract: Disclosed herein are electrically conductive and hermetic vias disposed within an insulator substrate of a feedthrough assembly and methods for making and using the same. Such aspects of the present invention consequently provide for the miniaturization of feedthrough assemblies inasmuch as the feedthrough components of the present invention are capable of supporting very small and hermetic conductively filled via holes in the absence of additional components, such as, for example, terminal pins, leadwires, and the like.
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公开(公告)号：US20180272137A1
公开(公告)日：2018-09-27
申请号：US15936495
申请日：2018-03-27
Applicant: Greatbatch Ltd.
Inventor： Keith W. Seitz , Xiaohong Tang , William C. Thiebolt , Jonathan Calamel , Thomas Shi , Thomas Marzano
CPC classification number: A61N1/3754 , C03C8/14 , C04B2237/343 , C04B2237/348 , C04B2237/361 , C04B2237/363 , C04B2237/365 , C04B2237/403 , C04B2237/408 , H01L23/10 , H01L23/15 , H01L24/26 , H01L2924/01006 , H01L2924/01022 , H01L2924/01029 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H05K1/0306 , H05K3/0047 , H05K5/0095
Abstract: Disclosed herein are electrically conductive and hermetic vias disposed within an insulator substrate of a feedthrough assembly and methods for making and using the same. Such aspects of the present invention consequently provide for the miniaturization of feedthrough assemblies inasmuch as the feedthrough components of the present invention are capable of supporting very small and hermetic conductively filled via holes in the absence of additional components, such as, for example, terminal pins, leadwires, and the like.
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