公开(公告)号：US4256377A

公开(公告)日：1981-03-17

申请号：US907003

申请日：1978-05-18

申请人： Hans Krueger ,  Hans Pink

发明人： Hans Krueger ,  Hans Pink

IPC分类号： G02F1/1337 ,  G02F1/13

CPC分类号： G02F1/133719 ,  Y10S359/90

摘要： A homeotropic orientation layer for a liquid crystal cell is produced by forming an organic liquid solution containing a suitable amount of Si and Me to provide a necessary ratio of such elements to correspond to a chemical composition defined by the formula:(Me.sub.2 O.sub.3).sub.1-x (SiO.sub.y).sub.xwherein Me is an element selected from the group consisting of Al and Cr, x is a numeral at least equal to 0 and smaller than 1, and y is a numeral at least equal to 1.9 and not more than 2; applying a layer of such organic solution onto at least one face of a liquid crystal cell substrate, which may have a conductive layer thereon, and transferring such layer of organic solution into a solid homeotropically orientating layer by thermal decomposition of the organic solution, as by heating the solution-coated substrate at a temperature in the range of about 100.degree. to 550.degree. C. for a period of time ranging from about 10 to 30 minutes.

摘要翻译： 通过形成含有适当量的Si和Me的有机液体溶液来制备液晶单元的垂直取向层，以提供这样的元素所需的比例，以符合由下式定义的化学组成：（Me 2 O 3）1-x （SiO y）x其中Me是选自Al和Cr的元素，x是至少等于0且小于1的数，y是至少等于1.9且不大于2的数字; 将这样的有机溶液层施加到可以在其上具有导电层的液晶单元基板的至少一个表面上，并且通过有机溶液的热分解将这种有机溶液层转移到固体垂直取向层中，如通过 在约100℃至550℃的温度范围内将溶液涂覆的基材加热约10至30分钟的时间。

公开(公告)号：US08865499B2

公开(公告)日：2014-10-21

申请号：US13805630

申请日：2011-07-07

申请人： Wolfgang Pahl ,  Hans Krueger ,  Gregor Feiertag ,  Alois Stelzl ,  Anton Leidl ,  Stefan Seitz

发明人： Wolfgang Pahl ,  Hans Krueger ,  Gregor Feiertag ,  Alois Stelzl ,  Anton Leidl ,  Stefan Seitz

IPC分类号： H01L21/00

CPC分类号： B81B7/0061 ,  B81B2201/0257 ,  B81B2207/096 ,  B81C1/00309 ,  H01L2224/16225 ,  H01L2924/15151 ,  H01L2924/16151 ,  H04R1/086 ,  H04R1/38 ,  H04R19/005 ,  H04R19/04 ,  H04R29/004 ,  H04R31/006

摘要： The invention relates to a method for producing a microphone, in which a transducer element (WE) is mounted on a carrier (TR); a cover is arranged over the transducer element (WE) and the carrier (TR) such that the transducer element (WE) is enclosed between the cover and the carrier (TR); a first sound inlet opening (S01) is produced in the carrier (TR); a functional test of the microphone is carried out; the first sound inlet opening (S01) is closed; and a second sound inlet opening (S02) is created in the cover. The present invention further relates to a microphone resulting from the method, in which the first sound inlet opening (S01) is prepared but closed.

摘要翻译： 本发明涉及一种用于制造麦克风的方法，其中换能器元件（WE）安装在载体（TR）上; 换能器元件（WE）和载体（TR）之间布置有覆盖物，使得换能器元件（WE）被封闭在盖体和载体（TR）之间; 在载体（TR）中产生第一声音入口（S01）; 进行麦克风的功能测试; 第一声​​音入口（S01）关闭; 并且在盖中产生第二声音入口（S02）。 本发明还涉及由该方法产生的麦克风，其中第一声音入口开口（S01）准备但关闭。

公开(公告)号：US08759677B2

公开(公告)日：2014-06-24

申请号：US12993299

申请日：2009-05-26

申请人： Christian Bauer ,  Hans Krueger ,  Juergen Portmann ,  Alois Stelzl

发明人： Christian Bauer ,  Hans Krueger ,  Juergen Portmann ,  Alois Stelzl

IPC分类号： H01J5/00 ,  H01J15/00 ,  H05K5/06 ,  H05H1/00 ,  H05K7/00 ,  H05K7/10 ,  H05K7/12

CPC分类号： H01L23/06 ,  B81B7/0077 ,  B81C2203/0136 ,  H01L23/053 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/3011 ,  H01L2924/00

摘要： Frames (3) applied on a wafer (1) are leveled and covered with a covering film, such that gas-tight housings are formed for component structures (5), in particular for filter or MEMS structures. Inner columns (4) can be provided for supporting the housing and for the ground connection; outer columns (4) can be provided for the electrical connection and are connected to the component structures by means of conductor tracks (6) that are electrically insulated from the frames (3).

摘要翻译： 施加在晶片（1）上的框架（3）被平整并用覆盖膜覆盖，使得形成用于组件结构（5）的气密壳体，特别是用于过滤器或MEMS结构。 可以提供内柱（4）用于支撑壳体和接地连接; 可以为电连接提供外柱（4），并且通过与框架（3）电绝缘的导体轨道（6）连接到部件结构。

公开(公告)号：US20120159778A1

公开(公告)日：2012-06-28

申请号：US13330422

申请日：2011-12-19

申请人： Hans Krueger ,  Alexander Schmajew ,  Alois Stelzl

发明人： Hans Krueger ,  Alexander Schmajew ,  Alois Stelzl

IPC分类号： H05K3/36

CPC分类号： H01L24/94 ,  B81B7/007 ,  B81B2207/098 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24147 ,  H01L2224/24991 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06551 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1068 ,  H01L2924/14 ,  H01L2924/1461 ,  Y10T29/49126 ,  H01L2224/81 ,  H01L2224/82

摘要： A plurality of unpackaged substrates connected to one another is disclosed. The stepped structures on and/or in a first main area of a first substrate include a plurality of integrated circuits. The stepped structures run between the integrated circuits. The first conductor tracks extend from at least some contact connections of the respective integrated circuits as far as the stepped structures. The first substrate is connected on the side of the first main area to a further substrate. The first substrate is severed from a second main area opposite to the first main area such that the first substrate is divided into a plurality of substrate pieces. Each substrate piece has one of the integrated circuits. The first conductor tracks are accessible in interspaces between the substrate pieces. The second conductor tracks are formed from the second main area. At least some of the second conductor tracks lead from the second main area over side walls of the substrate pieces as far as the first conductor tracks.

摘要翻译： 公开了彼此连接的多个未封装的基板。 第一基板的第一主区域和/或第一主区域中的阶梯结构包括多个集成电路。 阶梯式结构在集成电路之间运行。 第一导体轨道从各个集成电路的至少一些接触连接延伸到阶梯式结构。 第一基板在第一主区域的一侧连接到另一基板。 第一基板从与第一主区域相对的第二主区域切断，使得第一基板被分成多个基板块。 每个衬底片具有一个集成电路。 第一导体轨迹可在基片之间的间隙中接近。 第二导体轨道由第二主区域形成。 至少一些第二导体轨道从第二主区域超过衬底片的侧壁延伸，直到第一导体轨迹。

公开(公告)号：US20120061778A1

公开(公告)日：2012-03-15

申请号：US13228971

申请日：2011-09-09

申请人： Michael Gerner ,  Hans Krueger ,  Alois Stelzl

发明人： Michael Gerner ,  Hans Krueger ,  Alois Stelzl

IPC分类号： H01L29/84 ,  H01L21/50

CPC分类号： B81C1/00333

摘要： A chip device is produced providing at least one wafer having a plurality of chip components. The wafer or wafers are separated into the individual chip components and/or into groups of chip components. The individual chip components and/or the groups of chip components are applied to a carrier element, in such a way that interspaces having a predetermined width are formed between the individual chip components and/or the groups of chip components. A polymer is introduced into the interspaces in order to form a composite element composed of the chip components and a polymer matrix. The composite element is separated in such a way that chip devices composed of in each case one of the chip components and at least one section of the polymer matrix are formed. The invention furthermore relates to a chip device produced by means of the method.

摘要翻译： 制造提供具有多个芯片部件的至少一个晶片的芯片器件。 将晶片或晶片分离成各个芯片组件和/或分组成芯片组件。 单个芯片组件和/或芯片组件组被施加到载体元件，使得在各个芯片组件和/或芯片组件组之间形成具有预定宽度的间隙。 将聚合物引入到间隙中以形成由芯片部件和聚合物基体组成的复合元件。 复合元件以这样的方式分离，即在每种情况下由芯片部件和聚合物基体的至少一个部分组成的芯片器件形成。 本发明还涉及通过该方法制造的芯片器件。

公开(公告)号：US08110962B2

公开(公告)日：2012-02-07

申请号：US12642357

申请日：2009-12-18

申请人： Christian Bauer ,  Hans Krueger ,  Werner Ruile ,  Alois Stelzl

发明人： Christian Bauer ,  Hans Krueger ,  Werner Ruile ,  Alois Stelzl

IPC分类号： H01L29/84

CPC分类号： H03H9/02866 ,  H03H9/14538

摘要： A MEMS component includes a chip that has a rear side having a low roughness of less than one tenth of the wavelength at the center frequency of an acoustic wave propagating in the component. Metallic structures for scattering bulk acoustic waves are provided on the rear side of the chip and a material of the metallic structures is acoustically matched to a material of the chip.

摘要翻译： MEMS部件包括芯片，该芯片的后侧具有小于在部件中传播的声波的中心频率处波长的十分之一的粗糙度。 用于散射体声波的金属结构设置在芯片的后侧，并且金属结构的材料与芯片的材料声学匹配。

公开(公告)号：US20110214905A1

公开(公告)日：2011-09-08

申请号：US12997867

申请日：2009-06-08

申请人： Wolfgang Pahl ,  Hans Krueger ,  Peter Demmer

发明人： Wolfgang Pahl ,  Hans Krueger ,  Peter Demmer

IPC分类号： H05K1/02 ,  H05K3/00

CPC分类号： H05K1/189 ,  H01L2224/16225 ,  H05K3/4691 ,  H05K2201/0394 ,  H05K2201/09081 ,  H05K2201/09109 ,  H05K2203/308 ,  Y10T29/49124 ,  Y10T428/24322

摘要： A circuit board comprising a circuit carrier, a cover layer composed of a nonconductive material, comprising an organic substance, arranged on the circuit carrier, a first metallization layer at least partly arranged on the cover layer, wherein the first metallization layer has a flexible region.

摘要翻译： 一种电路板，包括电路载体，由非导电材料构成的覆盖层，包括布置在电路载体上的有机物质，至少部分地布置在覆盖层上的第一金属化层，其中第一金属化层具有柔性区域 。

公开(公告)号：US20110114355A1

公开(公告)日：2011-05-19

申请号：US12993299

申请日：2009-05-26

申请人： Christian Bauer ,  Hans Krueger ,  Juergen Portmann ,  Alois Stelzl

发明人： Christian Bauer ,  Hans Krueger ,  Juergen Portmann ,  Alois Stelzl

IPC分类号： H05K5/06

CPC分类号： H01L23/06 ,  B81B7/0077 ,  B81C2203/0136 ,  H01L23/053 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/3011 ,  H01L2924/00

摘要： Frames (3) applied on a wafer (1) are leveled and covered with a covering film, such that gas-tight housings are formed for component structures (5), in particular for filter or MEMS structures. Inner columns (4) can be provided for supporting the housing and for the ground connection; outer columns (4) can be provided for the electrical connection and are connected to the component structures by means of conductor tracks (6) that are electrically insulated from the frames (3).

摘要翻译： 施加在晶片（1）上的框架（3）被平整并用覆盖膜覆盖，使得形成用于组件结构（5）的气密壳体，特别是用于过滤器或MEMS结构。 可以提供内柱（4）用于支撑壳体和接地连接; 可以为电连接提供外柱（4），并且通过与框架（3）电绝缘的导体轨道（6）连接到部件结构。

公开(公告)号：US20090104415A1

公开(公告)日：2009-04-23

申请号：US12258301

申请日：2008-10-24

申请人： Alexander Schmajew ,  Hans Krueger ,  Alois Stelzl

发明人： Alexander Schmajew ,  Hans Krueger ,  Alois Stelzl

IPC分类号： B32B7/06 ,  B32B3/10 ,  H01L21/311 ,  B44C1/22

CPC分类号： H01L23/544 ,  B41M5/24 ,  H01L23/3171 ,  H01L23/3192 ,  H01L2223/54406 ,  H01L2223/5448 ,  H01L2924/0002 ,  Y10T428/24802 ,  Y10T428/24893 ,  Y10T428/24901 ,  H01L2924/00

摘要： A layer combination with a marking is proposed, for example, for a miniaturized electrical component. The layer combination includes a first layer and a different release layer, which is applied on it, on which a pattern is formed by a released pattern-like area. The release area is formed from an inorganic, semiconducting, insulating material, where the pattern produced thereon is machine-readable.

摘要翻译： 提出了具有标记的层组合，例如，用于小型化电气部件。 层组合包括施加在其上的第一层和不同的剥离层，其上由释放的图案状区域形成图案。 释放区域由无机半导体绝缘材料形成，其中在其上产生的图案是机器可读的。

公开(公告)号：US07518249B2

公开(公告)日：2009-04-14

申请号：US11659146

申请日：2005-06-08

申请人： Hans Krueger ,  Karl Nicolaus ,  Juergen Portmann ,  Peter Selmeier

发明人： Hans Krueger ,  Karl Nicolaus ,  Juergen Portmann ,  Peter Selmeier

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L23/49838 ,  H01L23/50 ,  H01L23/562 ,  H01L24/14 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/10135 ,  H01L2224/14132 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A component includes a carrier substrate having a coefficient of thermal expansion αp and a chip mounted on the carrier substrate by a plurality of bumps. The chip has a first coefficient of thermal expansion α1 in a first direction x1 and a first expansion difference, Δα1 equal to the absolute value of αp−α1. The chip also has a second coefficient of thermal expansion α2 in a second direction x2 and a second expansion difference Δα2 is equal to the absolute value of αp−α2,. The bumps are arranged such that a first distance, Δx1, corresponding to a normal projection of a line between centers of terminally situated bumps in the first direction onto an axis running parallel to direction x1 is less than a second distance corresponding to a normal projection of a line between centers of terminally situated bumps in the second direction onto an axis parallel to direction x2.

摘要翻译： 组件包括具有热膨胀系数的载体衬底和通过多个凸块安装在载体衬底上的芯片。 芯片在第一方向x1具有第一热膨胀系数α1和第一膨胀差，Δalpha1等于alphap-α1的绝对值。 该芯片还具有第二方向x2的第二热膨胀系数α2，第二扩张差Δalpha2等于alphap-α2的绝对值。 凸块被布置成使得对应于在第一方向上的终端位置的凸块的中心之间的线的正常投影的平行于方向x1的轴线的第一距离Deltax1小于对应于方向x1的正常投影的第二距离 在第二方向上的终端位置的中心之间的线与平行于方向x2的轴线之间的线。