公开(公告)号：US20210294384A1

公开(公告)日：2021-09-23

申请号：US16481465

申请日：2017-12-14

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Wei-Chung Chen ,  Chien-Ting Lin

IPC: G06F1/16 ,  F16F1/36

Abstract: In example implementations, a housing is provided. The housing includes a display housing portion, an input housing portion, and an energy absorbing material that is inserted along an edge of the input housing portion. The input housing portion is movably coupled to the display portion. A top surface of the energy absorbing material lies on a same plane as a top surface of the input housing portion.

公开(公告)号：US20200292246A1

公开(公告)日：2020-09-17

申请号：US16481460

申请日：2017-12-08

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Chi-Hao Chang ,  Chien-Ting Lin

IPC: F28D15/04

Abstract: Devices and methods of heat transfer are provided. In an example, a thermo-reversible hydrogel is provided in a first portion of a casing of a device. A wicking surface is provided in an inner surface of the casing between the first portion and the second portion.

公开(公告)号：US11502389B2

公开(公告)日：2022-11-15

申请号：US16976495

申请日：2018-04-24

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Ting Lin ,  Chi Hao Chang ,  Kuan-Ting Wu

IPC: H01Q1/22 ,  H01Q1/36 ,  H01Q1/48

Abstract: In example implementations, an enclosure is provided. The enclosure includes a first layer of carbon fiber and a second layer of a carbon fiber pattern fabricated from a plastic. The first layer of carbon fiber is formed in a shape of a portable electronic device. An antenna window is formed in the first layer of the carbon fiber. The second layer of the carbon fiber pattern has a same shape and a same size as the first layer of carbon fiber.

公开(公告)号：US20220137680A1

公开(公告)日：2022-05-05

申请号：US17297146

申请日：2019-07-25

Applicant: Hewlett- Packard Development Company, L.P.

Inventor： Chien-Ting Lin ,  Kuan-Ting Wu ,  Chi Hao Chang

IPC: G06F1/18 ,  B29C63/02 ,  C23C28/02 ,  C25D7/00 ,  C25D3/12 ,  C23C18/16 ,  C23C18/18

Abstract: The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include a substrate having an opening therethrough, or an outer edge, or both. A thermoplastic insert molding can include a metal oxide dopant, the thermoplastic insert molding positioned on the substrate. A paint coating can be included on the thermoplastic insert molding. A chamfered edge can be present on the substrate at a location that defines the opening, the outer edge, or both, wherein the chamfered edge cuts through the paint coating and partially through the thermoplastic insert molding to expose a portion of the metal oxide dopant at the chamfered edge. A metal layer can be formed using laser direct structuring masking a portion of the metal oxide dopant exposed at the chamfered edge. A second metal layer can be formed over the metal layer.

公开(公告)号：US20210143524A1

公开(公告)日：2021-05-13

申请号：US16976495

申请日：2018-04-24

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Ting Lin ,  Chi Hao Chang ,  Kuan-Ting Wu

IPC: H01Q1/22 ,  H01Q1/48 ,  H01Q1/36

Abstract: In example implementations, an enclosure is provided. The enclosure includes a first layer of carbon fiber and a second layer of a carbon fiber pattern fabricated from a plastic. The first layer of carbon fiber is formed in a shape of a portable electronic device. An antenna window is formed in the first layer of the carbon fiber. The second layer of the carbon fiber pattern has a same shape and a same size as the first layer of carbon fiber.

公开(公告)号：US20230031605A1

公开(公告)日：2023-02-02

申请号：US17788361

申请日：2020-01-08

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Chi Hao Chang ,  Chien-Ting Lin

IPC: C25D11/30 ,  H04M1/02 ,  C25D11/02 ,  C25D11/24

Abstract: This application describes covers for electronic devices, electronic devices, and methods for making the covers. In one example, described herein is a cover for an electronic device comprising: a substrate comprising a metal; a passivation layer or a micro-arc oxidation layer deposited on at least one surface of the substrate; a primer coating layer on the passivation layer or the micro-arc oxidation layer; an optional base coating layer on the primer coating layer; a top coating layer on the optional base coating layer or on the primer coating layer; and a hydrophobic coating layer.

公开(公告)号：US20210050279A1

公开(公告)日：2021-02-18

申请号：US16980518

申请日：2018-05-07

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Chi Hao Chang ,  Chien-Ting Lin

IPC: H01L23/373 ,  B32B9/00 ,  B32B9/04 ,  B32B7/12

Abstract: The present subject matter relates to composite films for heat dissipation. In an example implementation of the present subject matter, a composite film for heat dissipation comprises a conductive material layer for thermal conduction of heat; and a polymer layer disposed over the conductive material layer to provide insulation from the heat.

公开(公告)号：US10537939B2

公开(公告)日：2020-01-21

申请号：US15519693

申请日：2015-01-21

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chi Hao Chang ,  Chien-Ting Lin ,  Kuan-Ting Wu

IPC: H05K3/36 ,  B22F3/11 ,  B22F3/105 ,  B33Y10/00 ,  B33Y80/00 ,  H05K5/03 ,  H05K5/04

Abstract: One example provides a method of manufacturing. The method comprises printing multiple layers comprising a metal material by an additive manufacturing technique, wherein each of the multiple layers comprises an array of cavities each having a cross-section of a polygon; and assembling at least two of the multiple layers to form an article having an array of three-dimensional hollow cells collectively having a honeycomb structure.

公开(公告)号：US20220016869A1

公开(公告)日：2022-01-20

申请号：US17054565

申请日：2019-03-27

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Ting Lin ,  Kuan-Ting Wu ,  Chi Hao Chang

IPC: B32B7/12 ,  C09K5/14 ,  C08J5/18 ,  C09J11/04 ,  C09J5/00 ,  B32B5/02 ,  B32B17/06 ,  B32B15/20 ,  B32B27/36 ,  B32B27/30 ,  B32B27/40 ,  B32B27/38 ,  B32B27/06

Abstract: The present disclosure is drawn to covers for electronic devices, coating sets for covers of electronic devices, and methods for making these covers. In one example, described herein is a cover for an electronic device comprising: a substrate; an adhesive layer on a surface of the substrate; a first thermally conductive layer on the adhesive layer; a first oxide layer on the first thermally conductive layer; an aluminum foil layer on the first oxide layer; a second oxide layer on the aluminum foil layer; and a second thermally conductive layer on the second oxide layer.

公开(公告)号：US10331165B2

公开(公告)日：2019-06-25

申请号：US15114105

申请日：2014-04-02

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Yao-Wen Fan ,  Kuan-Ting Wu ,  Cheng-Feng Liao ,  Chien-Ting Lin

IPC: G06F1/00 ,  G06F1/16 ,  E05D3/02 ,  E05D5/04 ,  E05D11/08

Abstract: A hinge assembly includes a first bracket and a second bracket. The first bracket includes a first attachment member, a pin member and an elastomer member. The second bracket includes a second attachment member and a hollow cylinder member.