3D Integrated Circuit
    1.
    发明公开

    公开(公告)号:US20240119998A1

    公开(公告)日:2024-04-11

    申请号:US18482263

    申请日:2023-10-06

    Abstract: The disclosed 3D IC includes a plurality of vertically stacked device tiers, each device tier comprising an SRAM circuit, each SRAM circuit comprising an SRAM bit cell, wherein the bit cells are stacked on top of each other to define a stack of bit cells and wherein and each bit cell comprises first and second pass transistors, first pull-up and pull-down transistors, and second pull-up and pull-down transistors. The SRAM circuits have an identical layout and each SRAM circuit comprises: a single active layer forming an active semiconductor pattern of the transistors of the bit cell, and a single routing layer of horizontally routed conductive lines comprising a complementary pair of first and second bit lines connected to the bit cell of the SRAM circuit, gate lines defining gates of the transistors of the bit cell of the SRAM circuit, and wiring lines forming interconnections of the bit cell of the SRAM circuit.

    Data distribution for holographic projection

    公开(公告)号:US11847944B2

    公开(公告)日:2023-12-19

    申请号:US16972838

    申请日:2019-06-03

    Applicant: IMEC VZW

    Abstract: A system and for distributing data for 3D light field projection and a method thereof. The system comprises input terminals and output terminals that are connectable to pixel elements of a display. Data paths are established between input terminals and output terminals, and are controlled by data switches. The system also comprises a control plane adapted for applying control variables to the data switches. Control switches of the control plane select the control variables which are applied to the data switches. Sequences of control variables and enable variables propagate along at least one first delay line and along at least one second delay line, respectively. Delay units of the at least one first delay line and of the at least one second delay line have a synchronous relationship. During system run-time patterns contained in the stream of input data are detected for determining the sequences of control variables.

    3D integrated count
    3.
    发明授权

    公开(公告)号:US11677401B2

    公开(公告)日:2023-06-13

    申请号:US17740759

    申请日:2022-05-10

    Applicant: IMEC VZW

    CPC classification number: H03K19/17744 H01L27/0688

    Abstract: According to an aspect of the present inventive concept there is provided 3D IC, comprising:



    a plurality of logic cells stacked on top of each other, each logic cell forming part of one of a plurality of vertically stacked device tiers of the 3D IC, and each logic cell comprising a network of logic gates, each logic gate comprising a network of horizontal channel transistors,
    wherein a layout of the network of logic gates of each logic cell is identical among said logic cells such that each logic gate of any one of said logic cells has a corresponding logic gate in each other one of said logic cells, and
    wherein each logic cell comprises:

    a single active layer forming an active semiconductor pattern of the transistors of the logic gates of the logic cell, and
    a single layer of horizontally extending conductive lines comprising gate lines defining transistor gates of the transistors, and wiring lines forming interconnections in the network of transistors and in the network of logic gates of said logic cell.

    Method for Disseminating Scaling Information and Application Thereof in VLSI Implementation of Fixed-Point FFT

    公开(公告)号:US20230179315A1

    公开(公告)日:2023-06-08

    申请号:US18049932

    申请日:2022-10-26

    CPC classification number: H04J11/00

    Abstract: Example embodiments relate to methods for disseminating scaling information and applications thereof in very large scale integration (VLSI) implementations of fixed-point fast Fourier transforms (FFTs). One embodiment includes a method for disseminating scaling information in a system. The system includes a linear decomposable transformation process and an inverse process of the linear decomposable transformation process. The inverse process of the linear decomposable transformation process is defined, in time or space, as an inverse linear decomposable transformation process. The linear decomposable transformation process is separated from the inverse linear decomposable transformation process. The linear decomposable transformation process or the inverse linear decomposable transformation process is able to be performed first and is defined as a linear decomposable transformation I. The other remaining process is performed subsequently and is defined as a linear decomposable transformation II. The method for disseminating scaling information is used for a bit width-optimized and energy-saving hardware implementation.

    COMPLEXITY-REDUCED SIMULATION OF CIRCUIT RELIABILITY
    7.
    发明申请
    COMPLEXITY-REDUCED SIMULATION OF CIRCUIT RELIABILITY 审中-公开
    电路可靠性的复杂减少仿真

    公开(公告)号:US20160283629A1

    公开(公告)日:2016-09-29

    申请号:US15081635

    申请日:2016-03-25

    CPC classification number: G06F17/5036 G06F2217/76 G06F2217/80 G06F2217/82

    Abstract: A system and method for simulating an electronic circuit is disclosed. The method includes creating a finite set of circuit or device parameter points selected from within an n-dimensional parameter space. The method includes determining, for each circuit or device parameter point of the set, a corresponding response value of the performance metric and a corresponding probability of occurrence. The method includes determining, for a predetermined value of the performance metric, the total probability of occurrence.

    Abstract translation: 公开了一种用于模拟电子电路的系统和方法。 该方法包括创建从n维参数空间内选择的电路或设备参数点的有限集合。 该方法包括针对该组的每个电路或设备参数点确定性能度量的对应响应值和相应的发生概率。 该方法包括针对性能度量的预定值确定总出现概率。

    3D integrated circuit
    8.
    发明授权

    公开(公告)号:US11381242B2

    公开(公告)日:2022-07-05

    申请号:US17063003

    申请日:2020-10-05

    Applicant: IMEC VZW

    Abstract: According to an aspect of the present inventive concept there is provided 3D IC, comprising: a plurality of logic cells stacked on top of each other, each logic cell forming part of one of a plurality of vertically stacked device tiers of the 3D IC, and each logic cell comprising a network of logic gates, each logic gate comprising a network of horizontal channel transistors, wherein a layout of the network of logic gates of each logic cell is identical among said logic cells such that each logic gate of any one of said logic cells has a corresponding logic gate in each other one of said logic cells, and wherein each logic cell comprises: a single active layer forming an active semiconductor pattern of the transistors of the logic gates of the logic cell, and a single layer of horizontally extending conductive lines comprising gate lines defining transistor gates of the transistors, and wiring lines forming interconnections in the network of transistors and in the network of logic gates of said logic cell.

    Data Distribution for Holographic Projection

    公开(公告)号:US20210247720A1

    公开(公告)日:2021-08-12

    申请号:US16972838

    申请日:2019-06-03

    Applicant: IMEC VZW

    Abstract: A system and for distributing data for 3D light field projection and a method thereof. The system comprises input terminals and output terminals that are connectable to pixel elements of a display. Data paths are established between input terminals and output terminals, and are controlled by data switches. The system also comprises a control plane adapted for applying control variables to the data switches. Control switches of the control plane select the control variables which are applied to the data switches. Sequences of control variables and enable variables propagate along at least one first delay line and along at least one second delay line respectively. Delay units of the at least one first delay line and of the at least one second delay line have a synchronous relationship. During system run-time patterns contained in the stream of input data are detected for determining the sequences of control variables.

    Simulation of Photovoltaic Systems
    10.
    发明申请

    公开(公告)号:US20190197203A1

    公开(公告)日:2019-06-27

    申请号:US16215216

    申请日:2018-12-10

    Abstract: A method for generating/updating a database of current-voltage characteristic curves is disclosed. This method includes simulating for at least one combination of a topology of a photovoltaic cell group, an internal cell temperature(s) and a cell irradiation(s), a model of the photovoltaic cell group to provide a representative current-voltage characteristic curve, and clustering the current-voltage characteristic curves to identify at least one plurality of similar current-voltage characteristic curves. The method also includes generating a many-to-one mapping in the database to map query requests corresponding to each of the at least one plurality of similar current-voltage characteristic curves onto a single representative current-voltage characteristic curve for that plurality, each query request identifying a topology of a photovoltaic cell group, at least one internal temperature for the photovoltaic cells in the photovoltaic cell group and at least one cell irradiation for the photovoltaic cells in the photovoltaic cell group.

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