公开(公告)号：US11276401B2

公开(公告)日：2022-03-15

申请号：US16561618

申请日：2019-09-05

Applicant: Infineon Technologies AG

Inventor： Johann Kosub ,  Roman Peters

IPC: G10L15/22 ,  G01S13/04 ,  G01S13/06

Abstract: A method for a virtual assistant is provided. The method includes controlling, in a first operation mode, at least one sensor to sense a physical quantity. Further, the method includes receiving, in the first operation mode, sensor data indicative of the physical quantity from the at least one sensor. Additionally, the method includes processing, in the first operation mode, the sensor data to detect whether the sensor data exhibit a predetermined characteristic. If the predetermined characteristic is detected in the sensor data, the method includes setting the operation mode of the virtual assistant to a second operation mode assigned to the predetermined characteristic.

公开(公告)号：US09202753B2

公开(公告)日：2015-12-01

申请号：US13754382

申请日：2013-01-30

Applicant: Infineon Technologies AG

Inventor： Johann Kosub ,  Michael Ledutke

IPC: H01L29/06 ,  H01L21/78 ,  H01L21/02 ,  H01L23/32 ,  H01L23/498 ,  H01L23/00 ,  H01L21/683 ,  H01L23/538 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L21/78 ,  H01L21/02697 ,  H01L21/561 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/3121 ,  H01L23/32 ,  H01L23/49838 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/19 ,  H01L2224/24137 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/83005 ,  H01L2224/92244 ,  H01L2224/94 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2924/014

Abstract: A method includes applying a reinforcing wafer to a semiconductor wafer, thereby forming a composite wafer. Further the method includes dividing the composite wafer, thereby generating a plurality of composite chips each including a semiconductor chip and a reinforcing chip.

Abstract translation: 一种方法包括将加强晶片应用于半导体晶片，由此形成复合晶片。 此外，该方法包括分割复合晶片，从而生成各自包括半导体芯片和增强芯片的多个复合芯片。

公开(公告)号：US20140374023A1

公开(公告)日：2014-12-25

申请号：US14481725

申请日：2014-09-09

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Johann Kosub

IPC: H01L21/67

CPC classification number: H01L21/67051 ,  C23F1/08 ,  C23F1/18 ,  C23F3/06 ,  C25D3/38 ,  C25D5/52 ,  H01L21/02052 ,  H01L21/32115 ,  H01L21/32134 ,  H01L21/67023 ,  H01L21/6708 ,  H01L21/68728 ,  H01L21/6875 ,  H01L21/76808 ,  H01L21/7684

Abstract: In accordance with an embodiment of the present invention, a method of polishing a device includes providing a layer having a non-uniform top surface. The non-uniform top surface includes a plurality of protrusions. The method further includes removing the plurality of protrusions by exposing the layer to a fluid that has gas bubbles and a liquid.

Abstract translation: 根据本发明的实施例，抛光装置的方法包括提供具有不均匀顶表面的层。 不均匀的顶表面包括多个突起。 该方法还包括通过将层暴露于具有气泡和液体的流体来移除多个突起。

公开(公告)号：US20200082821A1

公开(公告)日：2020-03-12

申请号：US16561618

申请日：2019-09-05

Applicant: Infineon Technologies AG

Inventor： Johann Kosub ,  Roman Peters

IPC: G10L15/22 ,  G01S13/06 ,  G01S13/04

Abstract: A method for a virtual assistant is provided. The method includes controlling, in a first operation mode, at least one sensor to sense a physical quantity. Further, the method includes receiving, in the first operation mode, sensor data indicative of the physical quantity from the at least one sensor. Additionally, the method includes processing, in the first operation mode, the sensor data to detect whether the sensor data exhibit a predetermined characteristic. If the predetermined characteristic is detected in the sensor data, the method includes setting the operation mode of the virtual assistant to a second operation mode assigned to the predetermined characteristic.

公开(公告)号：US10204804B2

公开(公告)日：2019-02-12

申请号：US14481725

申请日：2014-09-09

Applicant: Infineon Technologies AG

Inventor： Johann Kosub

IPC: H01L21/67 ,  C25D3/38 ,  C25D5/52 ,  C23F1/18 ,  H01L21/02 ,  H01L21/321 ,  H01L21/3213 ,  H01L21/687 ,  C23F1/08 ,  C23F3/06 ,  H01L21/768

Abstract: In accordance with an embodiment of the present invention, a method of polishing a device includes providing a layer having a non-uniform top surface. The non-uniform top surface includes a plurality of protrusions. The method further includes removing the plurality of protrusions by exposing the layer to a fluid that has gas bubbles and a liquid.

公开(公告)号：US20140210054A1

公开(公告)日：2014-07-31

申请号：US13754382

申请日：2013-01-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Johann Kosub ,  Michael Ledutke

IPC: H01L21/78 ,  H01L21/02 ,  H01L23/498 ,  H01L23/32

CPC classification number: H01L21/78 ,  H01L21/02697 ,  H01L21/561 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/3121 ,  H01L23/32 ,  H01L23/49838 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/19 ,  H01L2224/24137 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/83005 ,  H01L2224/92244 ,  H01L2224/94 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2924/014

Abstract: A method includes applying a reinforcing wafer to a semiconductor wafer, thereby forming a composite wafer. Further the method includes dividing the composite wafer, thereby generating a plurality of composite chips each including a semiconductor chip and a reinforcing chip.

Abstract translation: 一种方法包括将加强晶片应用于半导体晶片，由此形成复合晶片。 此外，该方法包括分割复合晶片，从而生成各自包括半导体芯片和增强芯片的多个复合芯片。