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    Single wire communication board-to-board interconnect
    1.
    发明授权
    Single wire communication board-to-board interconnect 有权

    公开(公告)号：US10366035B2

    公开(公告)日：2019-07-30

    申请号：US15473330

    申请日：2017-03-29

    Applicant: Intel Corporation

    Inventor： Arvind Sundaram ,  Ramaswamy Parthasarathy ,  Vikas Mishra

    IPC: H01P3/10 ,  G06F13/40 ,  H01P5/08 ,  G06F13/42 ,  H01P5/02

    Abstract: A solution to the technical problem of improving device-to-device connection speeds includes the use of single-wire communication (SWC). Unlike the two differential wires required in transmission lines, SWC includes a transmission method using a single wire for data without requiring a return wire. The use of SWC has the potential to enable low loss channels of increasingly high bandwidth. The SWC improvements in bandwidth and frequency enable a significant reduction of power required for communication. SWC provides significant improvement in speed for each channel, so fewer wires may be used for each device-to-device connection. SWC also provides the ability to convey increased bandwidth and increased power over each wire, which further reduces the number of wires needed to provide power and communication.

    Crystal oscillator interconnect architecture with noise immunity
    2.
    发明授权
    Crystal oscillator interconnect architecture with noise immunity 有权

    公开(公告)号：US10171033B2

    公开(公告)日：2019-01-01

    申请号：US15469499

    申请日：2017-03-25

    Applicant: INTEL CORPORATION

    Inventor： Khang Choong Yong ,  Raymond Chong ,  Ramaswamy Parthasarathy ,  Stephen Hall ,  Chin Lee Kuan

    IPC: H03B5/32 ,  H03L7/06

    Abstract: An apparatus is provided which comprises: a crystal having an input and an output; a first interconnect line having first and second ends, wherein the first end is coupled to the input; a second interconnect line having first and second ends, wherein the first end is coupled to the output; a first capacitor coupled to the input and ground; and a second capacitor coupled to the second end of the second interconnect line. An apparatus is provided which comprises: a high pass filter; a pair of AC coupling capacitors coupled to the high pass filter; a low pass filter coupled to the pair of AC coupling capacitors; and an analog to digital converter (ADC) coupled to the low pass filter.

    Transmission of data over conducting wires
    3.
    发明授权
    Transmission of data over conducting wires 有权

    公开(公告)号：US11450936B2

    公开(公告)日：2022-09-20

    申请号：US16948578

    申请日：2020-09-24

    Applicant: Intel Corporation

    Inventor： Ramaswamy Parthasarathy ,  Punit Ashok Rathod ,  Jayprakash Thakur ,  Arvind Sundaram ,  Ajay Sharma ,  Nikita Bipin Ambasana ,  Satish Ramachandra ,  Vishram Shriram Pandit

    IPC: H01P3/12 ,  H04B3/52

    Abstract: A communication system communicates data elements on a conducting wire. In an embodiment, a sequence of data elements to be transmitted is electrically represented on a pair of terminals, and a transmission element located at a first portion of the conducting wire transmits the sequence in the form of a wave on a surface of the conducting wire. The transmission element includes a first conductor wrapped around the first portion of the conducting wire, a first insulator located between the first conductor and the first portion of the conducting wire, and a conductive structure disposed around the first conductor. The conductive structure has a narrow cross section at one end and extends outwardly to a broader cross section at the other end. A first terminal of the pair of terminals is electrically connected to the first conductor and the second terminal is electrically connected to the conductive structure.

    TRANSMISSION OF DATA OVER CONDUCTING WIRES
    7.
    发明申请
    TRANSMISSION OF DATA OVER CONDUCTING WIRES 有权

    公开(公告)号：US20210203053A1

    公开(公告)日：2021-07-01

    申请号：US16948578

    申请日：2020-09-24

    Applicant: Intel Corporation

    Inventor： Ramaswamy Parthasarathy ,  Punit Ashok Rathod ,  Jayprakash Thakur ,  Arvind Sundaram ,  Ajay Sharma ,  Nikita Bipin Ambasana ,  Satish Ramachandra ,  Vishram Shriram Pandit

    IPC: H01P3/12 ,  H04B3/52

    Abstract: A communication system communicates data elements on a conducting wire. In an embodiment, a sequence of data elements to be transmitted is electrically represented on a pair of terminals, and a transmission element located at a first portion of the conducting wire transmits the sequence in the form of a wave on a surface of the conducting wire. The transmission element includes a first conductor wrapped around the first portion of the conducting wire, a first insulator located between the first conductor and the first portion of the conducting wire, and a conductive structure disposed around the first conductor. The conductive structure has a narrow cross section at one end and extends outwardly to a broader cross section at the other end. A first terminal of the pair of terminals is electrically connected to the first conductor and the second terminal is electrically connected to the conductive structure.

    SINGLE WIRE COMMUNICATION BOARD-TO-BOARD INTERCONNECT
    10.
    发明申请
    SINGLE WIRE COMMUNICATION BOARD-TO-BOARD INTERCONNECT 审中-公开

    公开(公告)号：US20180287239A1

    公开(公告)日：2018-10-04

    申请号：US15473330

    申请日：2017-03-29

    Applicant: Intel Corporation

    Inventor： Arvind Sundaram ,  Ramaswamy Parthasarathy ,  Vikas Mishra

    IPC: H01P3/10 ,  H01P5/08 ,  G06F13/42 ,  G06F13/40

    CPC classification number: G06F13/4068 ,  G06F13/4282 ,  H01P5/026 ,  H01P5/08 ,  Y02D10/14 ,  Y02D10/151

    Abstract: A solution to the technical problem of improving device-to-device connection speeds includes the use of single-wire communication (SWC). Unlike the two differential wires required in transmission lines, SWC includes a transmission method using a single wire for data without requiring a return wire. The use of SWC has the potential to enable low loss channels of increasingly high bandwidth. The SWC improvements in bandwidth and frequency enable a significant reduction of power required for communication. SWC provides significant improvement in speed for each channel, so fewer wires may be used for each device-to-device connection. SWC also provides the ability to convey increased bandwidth and increased power over each wire, which further reduces the number of wires needed to provide power and communication.

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