公开(公告)号：US10380477B2

公开(公告)日：2019-08-13

申请号：US15406832

申请日：2017-01-16

Applicant: Infineon Technologies AG

Inventor： Frank Pueschner ,  Peter Stampka ,  Siegfried Hoffner ,  Jens Pohl

IPC: G06K19/00 ,  G06K19/077

Abstract: A chip card is provided. The chip card may include a chip card substrate and an antenna structure disposed in or over the chip card substrate, the antenna structure including a wire arranged to form a first antenna portion configured to contactlessly couple to a chip card external device and a second antenna portion configured to couple to a chip antenna, wherein the wire may include an electrically conductive material coated with an electrically insulating material, wherein the wire of the first antenna portion may be arranged such that a direction of laying progress of the wire of at least some adjacent wire portions are opposite to each other, such that the at least some adjacent wire portions may form a capacitor, wherein the isolation material of the at least some adjacent wire portions may be physically contacting each other.

公开(公告)号：US20170206448A1

公开(公告)日：2017-07-20

申请号：US15406832

申请日：2017-01-16

Applicant: Infineon Technologies AG

Inventor： Frank Pueschner ,  Peter Stampka ,  Siegfried Hoffner ,  Jens Pohl

IPC: G06K19/077

CPC classification number: G06K19/07775 ,  G06K19/0776 ,  G06K19/07779 ,  G06K19/07794

Abstract: A chip card is provided. The chip card may include a chip card substrate and an antenna structure disposed in or over the chip card substrate, the antenna structure including a wire arranged to form a first antenna portion configured to contactlessly couple to a chip card external device and a second antenna portion configured to couple to a chip antenna, wherein the wire may include an electrically conductive material coated with an electrically insulating material, wherein the wire of the first antenna portion may be arranged such that a direction of laying progress of the wire of at least some adjacent wire portions are opposite to each other, such that the at least some adjacent wire portions may form a capacitor, wherein the isolation material of the at least some adjacent wire portions may be physically contacting each other.

公开(公告)号：US20180032854A1

公开(公告)日：2018-02-01

申请号：US15650994

申请日：2017-07-17

Applicant: Infineon Technologies AG

Inventor： Frank Pueschner ,  Siegfried Hoffner ,  Jens Pohl

IPC: G06K19/077 ,  G06K19/07

CPC classification number: G06K19/07775 ,  G06K19/0723 ,  G06K19/07747 ,  G06K19/0775 ,  G06K19/07754 ,  H01L21/56 ,  H01L23/49855 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/131 ,  H01L2224/1601 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15321 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A chip card module is provided. The chip card module may include a carrier having a first side and an opposite second side, a chip arranged over the carrier, the chip having a first chip contact, a first and a second antenna contact formed over the first side, a metal-free area formed over the first side between the first antenna contact and the second antenna contact, wherein the metal-free area extends between a first edge portion and a second edge portion of the carrier, and a first chip connection electrically connecting the first chip contact to the first antenna contact, wherein the first chip connection is at least partially arranged over the second side in a region opposite the metal-free area.

公开(公告)号：US20200065641A1

公开(公告)日：2020-02-27

申请号：US16110590

申请日：2018-08-23

Applicant: Infineon Technologies AG

Inventor： Walther Pachler ,  Siegfried Hoffner

IPC: G06K19/077 ,  G06K19/02

Abstract: A chip card body, including a first metal layer having a first aperture, and an opening or recess configured to receive a coil-chip combination; a second metal layer having a second aperture; and a booster antenna inlay laminated between the first and second metal layers and configured to couple with the coil-chip combination.

公开(公告)号：US10282655B2

公开(公告)日：2019-05-07

申请号：US15650994

申请日：2017-07-17

Applicant: Infineon Technologies AG

Inventor： Frank Pueschner ,  Siegfried Hoffner ,  Jens Pohl

IPC: G06K19/07 ,  G06K19/077 ,  H01L23/498 ,  H01L21/56 ,  H01L23/00

Abstract: A chip card module is provided. The chip card module may include a carrier having a first side and an opposite second side, a chip arranged over the carrier, the chip having a first chip contact, a first and a second antenna contact formed over the first side, a metal-free area formed over the first side between the first antenna contact and the second antenna contact, wherein the metal-free area extends between a first edge portion and a second edge portion of the carrier, and a first chip connection electrically connecting the first chip contact to the first antenna contact, wherein the first chip connection is at least partially arranged over the second side in a region opposite the metal-free area.

公开(公告)号：US09533473B2

公开(公告)日：2017-01-03

申请号：US14243970

申请日：2014-04-03

Applicant: Infineon Technologies AG

Inventor： Siegfried Hoffner ,  Mohammed Reza Hussein ,  Frank Pueschner ,  Thomas Spoettl

IPC: B32B27/08 ,  B32B27/36 ,  B32B37/24 ,  B32B27/30 ,  B32B27/32 ,  B32B3/26 ,  B32B7/12 ,  B32B37/12 ,  B32B27/20 ,  B32B37/14

CPC classification number: B32B27/08 ,  B32B3/26 ,  B32B7/12 ,  B32B27/20 ,  B32B27/304 ,  B32B27/32 ,  B32B27/322 ,  B32B27/36 ,  B32B27/365 ,  B32B37/12 ,  B32B37/142 ,  B32B37/24 ,  B32B2037/243 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2264/105 ,  B32B2307/202 ,  B32B2329/04 ,  B32B2379/08 ,  B32B2425/00 ,  Y10T156/10 ,  Y10T428/24998

Abstract: A chip card substrate is provided that includes a first polymer layer including a first polymer material. The chip card substrate further includes an intermediate layer disposed over the first polymer layer and including polyolefin including a plurality of micro pores, an adhesive layer disposed over the intermediate layer and including an adhesive, and a second polymer layer disposed over the adhesive layer and including a second polymer material different from the first polymer material.

Abstract translation: 提供了包括第一聚合物层的芯片卡基材，该第一聚合物层包括第一聚合物材料。 芯片卡基板还包括设置在第一聚合物层上并包括包含多个微孔的聚烯烃的中间层，设置在中间层上方并包括粘合剂的粘合剂层和设置在粘合剂层上的第二聚合物层，并且包括 与第一聚合物材料不同的第二聚合物材料。

公开(公告)号：US20140084070A1

公开(公告)日：2014-03-27

申请号：US13625888

申请日：2012-09-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Frank Pueschner ,  Siegfried Hoffner ,  Peter Stampka ,  Wolfgang Schindler ,  Stephan Rampetzreiter

IPC: G06K19/02 ,  H05K13/00 ,  G06K19/077

CPC classification number: G06K7/10178 ,  Y10T29/49018

Abstract: According to one embodiment, a chip card is provided comprising a booster antenna wherein the booster antenna comprises a material having an electrical resistivity of at least 0.05 Ohm*mm2/m.

Abstract translation: 根据一个实施例，提供了包括增强天线的芯片卡，其中所述增强天线包括具有至少0.05欧姆* mm 2 / m的电阻率的材料。