公开(公告)号：US20240429358A1

公开(公告)日：2024-12-26

申请号：US18429571

申请日：2024-02-01

Applicant: InnoLux Corporation

Inventor： Shun-Yuan HU ,  Chin-Lung TING ,  Ker-Yih KAO ,  Li-Wei MAO ,  Kung-Chen KUO ,  Yi-Hua HSU ,  Ming-Chun TSENG

IPC: H01L33/62 ,  H01L25/075 ,  H01L25/10 ,  H01L25/13 ,  H01L25/16

Abstract: An electronic device is provided. The electronic device includes a first substrate and a plurality of light-emitting elements disposed on the first substrate. The plurality of light-emitting elements include a contact pad; an intermediate substrate disposed on the contact pad; and a light-emitting unit disposed on the intermediate substrate. The electronic device further includes a second substrate and a first thin-film transistor array disposed on the second substrate for driving at least a portion of the plurality of light-emitting elements. The light-emitting unit is electrically connected to the contact pad through a via hole that penetrates the intermediate substrate.

公开(公告)号：US20240339074A1

公开(公告)日：2024-10-10

申请号：US18745597

申请日：2024-06-17

Applicant: InnoLux Corporation

Inventor： Yi-Hua HSU ,  Ker-Yih KAO ,  Ming-Chun TSENG ,  Mu-Fan CHANG ,  Wen-Lin HUANG

IPC: G09G3/32

CPC classification number: G09G3/32 ,  G09G2300/026 ,  G09G2300/0408 ,  G09G2300/0426

Abstract: An electronic device includes: a circuit substrate; a first substrate overlapped with the circuit substrate; a first electronic unit attached on the first substrate; a second substrate disposed between the first substrate and the circuit substrate; a first transistor attached on the second substrate and electrically connected to the first electronic unit; and a first conductive element penetrating the second substrate, wherein the first transistor is electrically connected to the circuit substrate through the first conductive element.

公开(公告)号：US20240332158A1

公开(公告)日：2024-10-03

申请号：US18598066

申请日：2024-03-07

Applicant: InnoLux Corporation

Inventor： Ker-Yih KAO ,  Yen-Fu LIU ,  Wen-Hsiang LIAO ,  Te-Hsun LIN ,  Ju-Li WANG ,  Dong-Yan YANG ,  Ming-Hsien SHIH ,  Cheng-Tse TSAI

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  H01L25/16 ,  H01L25/18

CPC classification number: H01L23/49838 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/16 ,  H01L25/18 ,  H01L2221/68345 ,  H01L2224/13105 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2224/92125

Abstract: An electronic device is provided. The electronic device includes a chip, a redistribution structure, a contact pad, a buffer layer, and a first connection pad. The redistribution structure is electrically connected to the chip. The redistribution structure includes a metal pad, and the metal pad is disposed opposite to the chip. The contact pad is disposed on the metal pad. The buffer layer is disposed on the redistribution structure and includes an opening. The opening exposes at least a portion of the contact pad. The first connection pad is disposed on the contact pad and extends in the opening. Moreover, in a normal direction of the chip, the metal pad, the contact pad and the first connection pad overlap. A method of manufacturing an electronic device is also provided.

公开(公告)号：US20210184077A1

公开(公告)日：2021-06-17

申请号：US17097045

申请日：2020-11-13

Applicant: InnoLux Corporation

Inventor： Shun-Yuan HU ,  Li-Wei MAO ,  Ker-Yih KAO

IPC: H01L33/20 ,  H01L33/62 ,  H01L33/52

Abstract: An optical element driving system is provided. The optical element driving system includes an optical element driving mechanism and a control assembly. The optical element driving mechanism includes a movable portion, a fixed portion, a driving assembly, and a position sensing assembly. The movable portion connects to an optical element. The movable portion is movable relative to the fixed portion. The movable portion is in an accommodating space in the fixed portion. The driving assembly is used for driving the movable portion to move relative to the fixed portion. The control assembly provides a driving signal to the driving assembly to control the driving assembly. The position sensing assembly is used for detecting the movement of the movable portion relation to the fixed portion and providing a motion sensing signal to the control assembly.

公开(公告)号：US20210028073A1

公开(公告)日：2021-01-28

申请号：US17034965

申请日：2020-09-28

Applicant: InnoLux Corporation

Inventor： Ker-Yih KAO ,  Liang-Lu CHEN ,  Chin-Lung TING

IPC: H01L21/66 ,  H01L25/075 ,  H01L33/62 ,  H01L27/12

Abstract: An electronic device is provided. The electronic device includes a substrate and an electronic unit disposed on the substrate. The electronic unit includes a light-emitting diode, a conductive structure, a first driving circuit, and a second driving circuit. The conductive structure is disposed between the light-emitting diode and the substrate. The first driving circuit includes a first output wire. The second driving circuit includes a second output wire. The first driving circuit is electrically connected to the light-emitting diode by the conductive structure. The second driving circuit is electrically insulated from the light-emitting diode. In addition, the conductive structure at least partially overlaps the first output wire and the second output wire in a normal direction of the substrate.

公开(公告)号：US20200350295A1

公开(公告)日：2020-11-05

申请号：US16861412

申请日：2020-04-29

Applicant: InnoLux Corporation

Inventor： Shun-Yuan HU ,  Chin-Lung TING ,  Ker-Yih KAO ,  Li-Wei MAO

IPC: H01L25/075 ,  H01L33/52 ,  H01L33/60 ,  H01L33/58 ,  H01L33/36 ,  H01L33/50

Abstract: A light-emitting device is provided, including a light-emitting unit and an optical layer. The light-emitting unit includes a light-emitting chip and an encapsulation disposed thereon. The optical layer is disposed on the light-emitting unit, the optical layer having a first region overlapping the light-emitting chip in a top view direction of the light-emitting device and a second region not overlapping the light-emitting chip in the top view direction of the light-emitting device, wherein the transmittance of the first region is less than the transmittance of the second region.

公开(公告)号：US20190097180A1

公开(公告)日：2019-03-28

申请号：US16199041

申请日：2018-11-23

Applicant: INNOLUX CORPORATION

Inventor： Wei-Yen WU ,  Yu-Yao CHEN ,  Jiun-Ru TZENG ,  Chi-Che TSAI ,  Ker-Yih KAO

IPC: H01L51/56 ,  B32B37/00 ,  H01L51/00 ,  B32B17/00 ,  B32B38/18 ,  H01L27/32 ,  H01L51/52 ,  G06F3/044 ,  G02F1/1333 ,  G02F1/13 ,  G02F1/1341 ,  B32B37/12

Abstract: A substrate unit, a display device, and a method for manufacturing the display device are disclosed. The substrate unit includes a carrier plate, a glass substrate and an interlayer disposed between the carrier plate and the glass substrate. The thickness of the glass substrate is less than that of the carrier plate, and the thickness of the interlayer is less than that of the glass substrate. The display device includes a first glass substrate, a second glass substrate, a device layer and a sealing layer. The device layer and the sealing layer are disposed between the first glass substrate and the second glass substrate, wherein the sealing layer, the first glass substrate and the second glass substrate form an enclosed space, and the device layer is disposed in the enclosed space. The thickness of the first glass substrate is between 0.05 mm and 0.3 mm.

公开(公告)号：US20180026374A1

公开(公告)日：2018-01-25

申请号：US15657345

申请日：2017-07-24

Applicant: InnoLux Corporation

Inventor： Huei-Ying CHEN ,  I-Yin LI ,  Chia-Chi HO ,  Hsu-Kuan HSU ,  Ker-Yih KAO ,  Chung-Kuang WEI ,  Chin-Lung TING ,  Cheng-Chi WANG ,  Chien-Hsing LEE

IPC: H01Q9/06 ,  H01Q9/04 ,  H01Q1/38

Abstract: An antenna device includes a first dielectric substrate, a first radiator disposed on the first dielectric substrate, a second dielectric substrate disposed on the first radiator, a second radiator disposed between the first dielectric substrate and the second dielectric substrate, a main radiator, disposed on the second dielectric substrate, and a modulation structure located between a first radiation portion of the first radiator and a second radiation portion of the second radiator. The first radiation portion, the modulation structure, and the second radiation portion are located in a central area.

公开(公告)号：US20140377906A1

公开(公告)日：2014-12-25

申请号：US14478124

申请日：2014-09-05

Applicant: InnoLux Corporation

Inventor： Hsin-Hung LIN ,  Jung-Fang CHANG ,  Ker-Yih KAO

IPC: H01L29/66 ,  H01L21/4757 ,  H01L21/47 ,  H01L21/471 ,  H01L27/12 ,  H01L21/441

CPC classification number: H01L27/1225 ,  H01L21/441 ,  H01L21/47 ,  H01L21/471 ,  H01L21/47573 ,  H01L23/3171 ,  H01L23/481 ,  H01L27/1259 ,  H01L29/41733 ,  H01L29/41775 ,  H01L29/517 ,  H01L29/518 ,  H01L29/66742 ,  H01L29/66969 ,  H01L29/78606 ,  H01L29/7869 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Disclosed is a thin film transistor including a gate electrode on a substrate. A gate dielectric layer is disposed on the gate electrode and the substrate, and source/drain electrodes are disposed on the gate dielectric layer overlying two edge parts of the gate electrode. A channel layer is disposed on the gate dielectric layer overlying a center part of the gate electrode, and the channel region contacts the source/drain electrodes. An insulating capping layer overlies the channel layer, wherein the channel layer includes an oxide semiconductor.

Abstract translation: 公开了一种在基板上包括栅电极的薄膜晶体管。 栅极电介质层设置在栅电极和衬底上，源极/漏电极设置在覆盖栅电极的两个边缘部分的栅极电介质层上。 沟道层设置在覆盖栅极电极的中心部分的栅极电介质层上，沟道区域与源极/漏极接触。 绝缘覆盖层覆盖在沟道层上，其中沟道层包括氧化物半导体。

公开(公告)号：US20250014956A1

公开(公告)日：2025-01-09

申请号：US18741160

申请日：2024-06-12

Applicant: InnoLux Corporation

Inventor： Ker-Yih KAO ,  Ju-Li WANG ,  Zi-Zhong WANG ,  Yen-Fu LIU

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/367 ,  H01L23/58

Abstract: An electronic device includes an electronic unit having a first side and a second side; an encapsulation layer surrounding the electronic unit and having a plurality of openings exposing the second side of the electronic unit; a first circuit structure disposed on the first side of the electronic unit and electrically connected to the electronic unit; a second circuit structure disposed on the second side of the electronic unit; a via penetrating the encapsulation layer and electrically connecting the first circuit structure to the second circuit structure; and a heat dissipation layer disposed on the second side of the electronic unit, wherein the heat dissipation layer contacts the electronic unit through the plurality of openings.