公开(公告)号：US20180086627A1

公开(公告)日：2018-03-29

申请号：US15573342

申请日：2015-06-22

Applicant: Intel Corporation

Inventor： Kevin LAI LIN ,  Chytra PAWASHE ,  Raseong KIM ,  Ian A. YOUNG ,  Kanwal Jit SINGH ,  Robert L. BRISTOL

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/007 ,  B81B2203/0109 ,  B81B2203/0118 ,  B81B2207/015 ,  B81B2207/07 ,  B81B2207/092 ,  B81B2207/094 ,  B81B2207/095 ,  B81C1/00246 ,  B81C1/00301 ,  B81C2201/0109 ,  B81C2201/014 ,  B81C2203/0714 ,  B81C2203/0742 ,  B81C2203/0771 ,  H01L21/76807 ,  H01L21/7682 ,  H01L21/76829

Abstract: A conductive layer is deposited into a trench in a sacrificial layer on a substrate. An etch stop layer is deposited over the conductive layer. The sacrificial layer is removed to form a gap. In one embodiment, a beam is over a substrate. An interconnect is on the beam. An etch stop layer is over the beam. A gap is between the beam and the etch stop layer.

公开(公告)号：US20170158501A1

公开(公告)日：2017-06-08

申请号：US15301337

申请日：2014-06-27

Applicant: Intel Corporation

Inventor： Jorge A. MUNOZ ,  Dmitri E. NIKONOV ,  Kelin J. KUHN ,  Patrick THEOFANIS ,  Chytra PAWASHE ,  Kevin LIN ,  Seiyon KIM

IPC: B82B1/00 ,  H01H59/00 ,  B82B3/00 ,  H01L29/66 ,  H01L29/84 ,  H01L29/82

CPC classification number: B82B1/005 ,  B81B3/0016 ,  B81B7/02 ,  B81B2201/014 ,  B81B2203/0118 ,  B82B1/002 ,  B82B3/0023 ,  B82Y15/00 ,  B82Y25/00 ,  B82Y40/00 ,  H01H1/0094 ,  H01H1/54 ,  H01H59/0009 ,  H01L29/66227 ,  H01L29/82 ,  H01L29/84 ,  Y10S977/732 ,  Y10S977/838 ,  Y10S977/888 ,  Y10S977/938

Abstract: Nanoelectromechanical (NEMS) devices having nanomagnets for an improved range of operating voltages and improved control of dimensions of a cantilever are described. For example, in an embodiment, a nanoelectromechanical (NEMS) device includes a substrate layer, a first magnetic layer disposed above the substrate layer, a first dielectric layer disposed above the first magnetic layer, a second dielectric disposed above the first dielectric layer, and a cantilever disposed above the second dielectric layer. The cantilever bends from a first position to a second position towards the substrate layer when a voltage is applied to the cantilever.

公开(公告)号：US20190304784A1

公开(公告)日：2019-10-03

申请号：US15943551

申请日：2018-04-02

Applicant: Intel Corporation

Inventor： Chytra PAWASHE ,  Daniel PANTUSO

IPC: H01L21/18 ,  H01L21/20

Abstract: Embodiments of the present disclosure describe techniques for reducing in-plane distortion from wafer to wafer bonding using a dummy wafer. One embodiment is an apparatus formed using a dummy wafer, the apparatus comprising: a device layer fusion bonded to a first side of a carrier wafer, wherein the dummy wafer comprises a first wafer and the carrier wafer comprises a second wafer that is different than the first wafer; wherein the device layer comprise a portion of a third wafer that is different than the second wafer; and wherein a second opposite side of the carrier wafer includes: a removal process artifact, wherein a distortion signature present in the portion of the second wafer is indicative of the use of the dummy wafer fusion bonded to the second side of the carrier wafer, or a remainder of the dummy wafer. Other embodiments may be disclosed and/or claimed.

公开(公告)号：US20230367204A1

公开(公告)日：2023-11-16

申请号：US17743499

申请日：2022-05-13

Applicant: Intel Corporation

Inventor： Lance C. HIBBELER ,  John Ferdinand MAGANA ,  Chytra PAWASHE

IPC: G03F1/64 ,  G01L1/14 ,  G01P13/00 ,  G01L1/16 ,  G01P15/00

CPC classification number: G03F1/64 ,  G01L1/142 ,  G01P13/00 ,  G01L1/16 ,  G01P15/00

Abstract: The present disclosure is directed to a reinforcement system including: a framed pellicle including: a center part of a pellicle surrounded by a peripheral part of the pellicle, wherein the peripheral part is adhered to a pellicle frame; and an edge reinforcement for reinforcing the framed pellicle, positioned at a boundary between the center part of the framed pellicle and the pellicle frame.

公开(公告)号：US20200303191A1

公开(公告)日：2020-09-24

申请号：US16356402

申请日：2019-03-18

Applicant: Intel Corporation

Inventor： Anant JAHAGIRDAR ,  Chytra PAWASHE ,  Aaron LILAK ,  Myra MCDONNELL ,  Brennen MUELLER ,  Mauro KOBRINSKY

IPC: H01L21/20 ,  H01L21/02 ,  H01L21/56

Abstract: Embodiments herein describe techniques for bonded wafers that includes a first wafer bonded with a second wafer, and a stress compensation layer in contact with the first wafer or the second wafer. The first wafer has a first stress level at a first location, and a second stress level different from the first stress level at a second location. The stress compensation layer includes a first material at a first location of the stress compensation layer that induces a third stress level at the first location of the first wafer, a second material different from the first material at a second location of the stress compensation layer that induces a fourth stress level different from the third stress level at the second location of the first wafer. Other embodiments may be described and/or claimed.