公开(公告)号：US20230299851A1

公开(公告)日：2023-09-21

申请号：US17700043

申请日：2022-03-21

Applicant: Intel Corporation

Inventor： Joshua B. FRYMAN ,  Khaled AHMED ,  Sergey SHUMARAYEV ,  Thomas LILJEBERG ,  Divya PRATAP ,  James E. JAUSSI

IPC: H04B10/25 ,  G02B6/42 ,  H04B10/50

CPC classification number: H04B10/25891 ,  G02B6/4246 ,  G02B6/4202 ,  G02B6/423 ,  H04B10/502

Abstract: A system enables optical communication with direct conversion of the electrical signal into an optical signal with an array of optical sources. The use of the array of optical sources can eliminate the need for a large serializer/deserializer (SERDES). With an array of optical sources, the optical communication can occur at lower power and lower frequency per optical source, with multiple parallel optical sources combining to provide a signal.

公开(公告)号：US20220196935A1

公开(公告)日：2022-06-23

申请号：US17131682

申请日：2020-12-22

Applicant: Intel Corporation

Inventor： Xiaoqian LI ,  Nitin DESHPANDE ,  Omkar KARHADE ,  Asako TODA ,  Divya PRATAP ,  Zhichao ZHANG

IPC: G02B6/42

Abstract: Embodiments disclosed herein include photonics packages. In an embodiment, a photonics package comprises a package substrate, and a compute die over the package substrate. In an embodiment, a photonics die is also over the package substrate, and the photonics die overhangs an edge of the package substrate. In an embodiment, an integrated heat spreader (IHS) is over the compute die and the photonics die, and a fiber connector is coupled to the photonics die. In an embodiment, the fiber connector is attached to the IHS

公开(公告)号：US20220308294A1

公开(公告)日：2022-09-29

申请号：US17214035

申请日：2021-03-26

Applicant: Intel Corporation

Inventor： Wesley MORGAN ,  Srikant NEKKANTY ,  Todd R. COONS ,  Gregorio R. MURTAGIAN ,  Xiaoqian LI ,  Nitin DESHPANDE ,  Divya PRATAP

IPC: G02B6/42

Abstract: Embodiments disclosed herein include photonics packages and systems. In an embodiment, a photonics package comprises a package substrate, where the package substrate comprises a cutout along an edge of the package substrate. In an embodiment, a photonics die is coupled to the package substrate, and the photonics die is positioned adjacent to the cutout. In an embodiment, the photonics package further comprises a receptacle for receiving a pluggable optical connector. In an embodiment, the receptacle is over the cutout.

公开(公告)号：US20220196942A1

公开(公告)日：2022-06-23

申请号：US17132955

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Divya PRATAP ,  Srikant NEKKANTY

IPC: G02B6/42

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to active optical couplers that provide optical coupling at or proximate to an edge of a silicon photonics package, to allow the package to optically couple with other devices or peripherals. In embodiments, the active optical coupler is optically coupled with a photonics IC (PIC) inside the photonics package, and provides an optical coupling mechanism for optical pathways outside the photonics package. The active optical coupler may include electrical circuitry and may be coupled to the package substrate to provide data related to the operation of the active optical coupler. Other embodiments may be described and/or claimed.

公开(公告)号：US20220308293A1

公开(公告)日：2022-09-29

申请号：US17213131

申请日：2021-03-25

Applicant: Intel Corporation

Inventor： Xiaoqian LI ,  Wesley MORGAN ,  Nitin DESHPANDE ,  Divya PRATAP

IPC: G02B6/42

Abstract: Embodiments disclosed herein include photonics packages. In an embodiment, a photonics package comprises a photonics die and a plurality of v-grooves on the photonics die. In an embodiment, a lens array is optically coupled to a spot size converter on the photonics die. In an embodiment, the lens array comprises a main body and a plurality of lenses extending out from the main body.

公开(公告)号：US20220291462A1

公开(公告)日：2022-09-15

申请号：US17199335

申请日：2021-03-11

Applicant: Intel Corporation

Inventor： Divya PRATAP ,  Xiaoqian LI ,  Chia-Pin CHIU

IPC: G02B6/42

Abstract: Embodiments disclosed herein include photonics systems and packages. In an embodiment, a photonics package comprises a package substrate and a photonics die overhanging an edge of the package substrate. In an embodiment, the photonics die comprises a v-groove for receiving an optical fiber. In an embodiment, the photonics package further comprises an integrated heat spreader (IHS) over the photonics die. In an embodiment, the IHS comprises a foot, and a hole through the foot is aligned with the v-groove.

公开(公告)号：US20220187548A1

公开(公告)日：2022-06-16

申请号：US17122340

申请日：2020-12-15

Applicant: Intel Corporation

Inventor： Brandon C. MARIN ,  Divya PRATAP ,  Hiroki TANAKA ,  Nitin DESHPANDE ,  Omkar KARHADE ,  Robert Alan MAY ,  Sri Ranga Sai BOYAPATI ,  Srinivas V. PIETAMBARAM ,  Xiaoqian LI ,  Sai VADLAMANI ,  Jeremy ECTON

IPC: G02B6/42 ,  G02F1/01 ,  G02F1/09

Abstract: Embodiments disclosed herein include optical systems with Faraday rotators in order to enhance efficiency. In an embodiment, a photonics package comprises an interposer and a patch over the interposer. In an embodiment, the patch overhangs an edge of the interposer. In an embodiment, the photonics package further comprises a photonics die on the patch and a Faraday rotator passing through a thickness of the patch. In an embodiment, the Faraday rotator is below the photonics die.

公开(公告)号：US20220155539A1

公开(公告)日：2022-05-19

申请号：US16953146

申请日：2020-11-19

Applicant: Intel Corporation

Inventor： Srinivas V. PIETAMBARAM ,  Brandon C. MARIN ,  Sameer PAITAL ,  Sai VADLAMANI ,  Rahul N. MANEPALLI ,  Xiaoqian LI ,  Suresh V. POTHUKUCHI ,  Sujit SHARAN ,  Arnab SARKAR ,  Omkar KARHADE ,  Nitin DESHPANDE ,  Divya PRATAP ,  Jeremy ECTON ,  Debendra MALLIK ,  Ravindranath V. MAHAJAN ,  Zhichao ZHANG ,  Kemal AYGÜN ,  Bai NIE ,  Kristof DARMAWIKARTA ,  James E. JAUSSI ,  Jason M. GAMBA ,  Bryan K. CASPER ,  Gang DUAN ,  Rajesh INTI ,  Mozhgan MANSURI ,  Susheel JADHAV ,  Kenneth BROWN ,  Ankar AGRAWAL ,  Priyanka DOBRIYAL

IPC: G02B6/42

Abstract: Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, and a photonics die coupled to the package substrate. In an embodiment, a compute die is coupled to the package substrate, where the photonics die is communicatively coupled to the compute die by a bridge in the package substrate. In an embodiment, the optical package further comprises an optical waveguide embedded in the package substrate. In an embodiment, a first end of the optical waveguide is below the photonics die, and a second end of the optical waveguide is substantially coplanar with an edge of the package substrate.