公开(公告)号：US20220102887A1

公开(公告)日：2022-03-31

申请号：US17033401

申请日：2020-09-25

Applicant: Intel Corporation

Inventor： Feifei CHENG ,  Thomas BOYD ,  Kuang LIU ,  Steven A. KLEIN ,  Daniel NEUMANN ,  Mohanraj PRABHUGOUD

IPC: H01R12/77 ,  H01R12/52 ,  H01R13/629

Abstract: Embodiments disclosed herein include sockets and electronic packages with socket architectures. In an embodiment, a socket comprises a housing with a first surface and a second surface. In an embodiment, a plurality of interconnect pins pass through the housing. In an embodiment, an alignment hole is provided through the housing. In an embodiment, an alignment post extending out from the first surface of the housing is also provided.

公开(公告)号：US20210410328A1

公开(公告)日：2021-12-30

申请号：US17473896

申请日：2021-09-13

Applicant: Intel Corporation

Inventor： Jin YANG ,  David SHIA ,  Mohanraj PRABHUGOUD

IPC: H05K7/20

Abstract: An apparatus is described. The apparatus includes a cold plate having fluidic channels within the cold plate. The fluidic channels have protective material thereon such that when liquid coolant flows through the fluidic channels the protective material is between the liquid coolant and the cold plate's material, wherein, the protective material is to prevent reaction between the liquid coolant and the cold plate's material.

公开(公告)号：US20250071938A1

公开(公告)日：2025-02-27

申请号：US18897955

申请日：2024-09-26

Applicant: Intel Corporation

Inventor： Jin YANG ,  David SHIA ,  Mohanraj PRABHUGOUD ,  Olaotan ELENITOBA-JOHNSON ,  Craig JAHNE ,  Phil GENG

IPC: H05K7/20

Abstract: Examples described herein relate to a cold plate. An example apparatus includes a first layer with one or more channels to receive fluid. The example apparatus further includes a second layer that is more rigid than the first layer. The second layer is to be mounted to the first layer and separated from the first layer by a gasket to reduce corrosion of the second layer.

公开(公告)号：US20250004205A1

公开(公告)日：2025-01-02

申请号：US18216494

申请日：2023-06-29

Applicant: Intel Corporation

Inventor： Dekang CHEN ,  Nicholas PSAILA ,  Zhichao ZHANG ,  Eric J.M. MORET ,  Wesley B. MORGAN ,  Srikant NEKKANTY ,  Sang Yup KIM ,  Mohanraj PRABHUGOUD ,  Chao TIAN

IPC: G02B6/27 ,  G02B6/42

Abstract: Multichannel optical assemblies for optical IO (input output) systems are provided. The optical assemblies comprise an optical isolator. In some examples the optical assemblies also comprise an array of GRIN lenses. In other examples, the optical assemblies also comprise micromirrors.

公开(公告)号：US20210219459A1

公开(公告)日：2021-07-15

申请号：US17195354

申请日：2021-03-08

Applicant: Intel Corporation

Inventor： Jin YANG ,  David SHIA ,  Mohanraj PRABHUGOUD

IPC: H05K7/20 ,  H01L23/427

Abstract: An apparatus is described. The apparatus includes a cold plate having columns of fluidic channels. The fluidic channels have a length such that coolant that flows through the fluidic channels will be composed less of vapor than of liquid and a mix of liquid and vapor over a rated power range of one or more semiconductor chips that are cooled by the cold plate.

公开(公告)号：US20210183737A1

公开(公告)日：2021-06-17

申请号：US17132391

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Jeffory L. SMALLEY ,  Mohanraj PRABHUGOUD ,  Steven A. KLEIN ,  Mengqi LIU

IPC: H01L23/40 ,  H01L23/495

Abstract: An apparatus is described. The apparatus includes a loading frame for mounting a packaged semiconductor chip and a heat sink for the packaged semiconductor chip to a socket. The loading frame is comprised of metal. The loading frame has at least one frame leg where the metal is folded to re-enforce a strength of the frame leg.

公开(公告)号：US20200227362A1

公开(公告)日：2020-07-16

申请号：US16247312

申请日：2019-01-14

Applicant: Intel Corporation

Inventor： Jonathan W. THIBADO ,  Jeffory L. SMALLEY ,  John C. GULICK ,  Phi THANH ,  Mohanraj PRABHUGOUD ,  Chong ZHAO

IPC: H01L23/66 ,  H05K1/18 ,  H01L23/498 ,  H01L23/34 ,  H01B7/04 ,  G02B6/42 ,  H01B3/30 ,  H01B7/08 ,  H01L25/10 ,  H05K1/02

Abstract: Embodiments include interposers for use in high speed applications. In an embodiment, the interposer comprises an interposer substrate, and an array of pads on a first surface of the interposer substrate. In an embodiment, a plurality of vias pass through the interposer substrate, where each via is electrically coupled to one of the pads in the array of pads. In an embodiment a plurality of heating elements are embedded in the interposer substrate. In an embodiment a first cable is over the first surface interposer substrate. In an embodiment, the first cable comprises an array of conductive lines along the first cable, where conductive lines proximate to a first end of the cable are electrically coupled to pads in the array of pads.

公开(公告)号：US20220102889A1

公开(公告)日：2022-03-31

申请号：US17033386

申请日：2020-09-25

Applicant: Intel Corporation

Inventor： Thomas BOYD ,  Feifei CHENG ,  Eric W. BUDDRIUS ,  Mohanraj PRABHUGOUD

IPC: H01R12/91 ,  H01R12/70 ,  H01R12/71 ,  H01R12/88

Abstract: Embodiments disclosed herein include sockets and electronic packages with socket architectures. In an embodiment, a socket comprises a housing with a first surface and a second surface. In an embodiment, a plurality of interconnect pins pass through the housing. In an embodiment, an alignment hole is provided through the housing. In an embodiment, an alignment post extending out from the first surface of the housing is also provided.

公开(公告)号：US20210327787A1

公开(公告)日：2021-10-21

申请号：US17356014

申请日：2021-06-23

Applicant: Intel Corporation

Inventor： Jin YANG ,  Jimmy CHUANG ,  Xicai JING ,  Yuan-Liang LI ,  Yuyang XIA ,  David SHIA ,  Mohanraj PRABHUGOUD ,  Maria de la Luz BELMONT ,  Oscar FARIAS MOGUEL ,  Andres RAMIREZ MACIAS ,  Javier AVALOS GARCIA ,  Jessica GULLBRAND ,  Shaorong ZHOU ,  Chia-Pin CHIU ,  Xiaojin GU

IPC: H01L23/44

Abstract: An apparatus is described. The apparatus includes a packaged semiconductor device. The packaged semiconductor device having an integrated heat spreader, wherein, a boiling enhancement structure exists on the integrated heat spreader without a block mass residing between the boiling enhancement structure and the integrated heat spreader. The boiling enhancement structure has a structured non-planar surface to promote bubble nucleation in an immersion cooling system.

公开(公告)号：US20210105911A1

公开(公告)日：2021-04-08

申请号：US17123760

申请日：2020-12-16

Applicant: Intel Corporation

Inventor： Jin YANG ,  David SHIA ,  Mohanraj PRABHUGOUD ,  Olaotan ELENITOBA-JOHNSON ,  Craig JAHNE ,  Phil GENG

IPC: H05K7/20

Abstract: Examples described herein relate to a cold plate. In some examples, the cold plate includes a surface with fins and at least two channels, wherein a first channel is shaped with a first opening extending towards the surface, a second opening proximate and across a first fin attached to the surface, and a third opening from the surface and extending away from the surface. In some examples, when a fluid is provided to the first opening, the first opening directs the fluid towards the surface, the second opening directs the fluid across the first fin, and the third opening directs the fluid away from the surface. In some examples, the second opening comprises split openings around opposite sides of the first fin.