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    Optical leak detection of liquid cooling components within an electronic system
    1.
    发明授权
    Optical leak detection of liquid cooling components within an electronic system 有权

    公开(公告)号：US12169180B2

    公开(公告)日：2024-12-17

    申请号：US17133563

    申请日：2020-12-23

    Applicant: Intel Corporation

    Inventor： Prabhakar Subrahmanyam ,  Ying-Feng Pang ,  Yi Xia ,  Mark Bianco ,  Victor Polyanko

    IPC: G01N21/952 ,  H05K1/02 ,  H05K7/20

    Abstract: An apparatus is described. The apparatus includes an electronic system having a printed circuit board with electronic components mounted thereon. At least some of the electronic components are coupled to components of a liquid cooling system. The electronic system has a light source and a photosensitive element. The light source is to illuminate an illuminated region of the printed circuit board and/or at least one of the electronic components. The photosensitive element is to detect a change in reflection from the illuminated region in response to the presence of coolant that has leaked from the liquid cooling system within the illuminated region.

    Self cooling adaptive flow branching heat exchanger system for cooling of one or more semiconductor chips
    3.
    发明授权
    Self cooling adaptive flow branching heat exchanger system for cooling of one or more semiconductor chips 有权

    公开(公告)号：US12213288B2

    公开(公告)日：2025-01-28

    申请号：US17134368

    申请日：2020-12-26

    Applicant: Intel Corporation

    Inventor： Prabhakar Subrahmanyam ,  Arun Krishnamoorthy ,  Victor Polyanko ,  Ying-Feng Pang ,  Yi Xia ,  Pooya Tadayon ,  Muhammad Ahmad ,  Rahima K. Mohammed

    IPC: H05K7/20

    Abstract: An apparatus is described. The apparatus includes a liquid cooling system having multiple heat-exchangers and multiple valves. The multiple valves are to enable/disable participation of individual ones of the heat-exchangers within the liquid cooling system. The apparatus includes an information keeping device to store information that correlates a number of the multiple heat exchangers to be enabled to realize one or more semiconductor chips' target temperature for a power consumption of the one or more semiconductor chips for a plurality of combinations of target temperature and power consumption. The controller is coupled to the liquid cooling system and the information keeping device to dynamically determine during runtime of a system having the one or more semiconductor chips an appropriate number of the multiple heat exchangers to enable to realize a particular target temperature for the one or more semiconductor chips for a particular power consumption of the one or more semiconductor chips, and, update the information in the information keeping device with a new correlation that correlates the appropriate number with the particular target temperature and particular power consumption.

    Thermal control for processor-based devices
    4.
    发明授权
    Thermal control for processor-based devices 有权

    公开(公告)号：US11917790B2

    公开(公告)日：2024-02-27

    申请号：US16859202

    申请日：2020-04-27

    Applicant: Intel Corporation

    Inventor： Prabhakar Subrahmanyam ,  Casey Winkel ,  Yingqiong Bu ,  Ming Zhang ,  Yuehong Fan ,  Yi Xia ,  Ying-Feng Pang

    IPC: H05K7/20

    CPC classification number: H05K7/20154 ,  H05K7/209 ,  H05K7/20209 ,  H05K7/20927

    Abstract: The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.

    Reconfigurable cooling assembly for integrated circuitry
    5.
    发明授权
    Reconfigurable cooling assembly for integrated circuitry 有权

    公开(公告)号：US10930575B2

    公开(公告)日：2021-02-23

    申请号：US16337883

    申请日：2016-09-30

    Applicant: Intel Corporation

    Inventor： Prabhakar Subrahmanyam ,  Tong W. Chao ,  Stephanie L. Seaman ,  Ridvan A. Sahan ,  Ying-Feng Pang

    IPC: H01L23/36 ,  H05K7/20 ,  H01L23/427 ,  H01L23/467

    Abstract: Reconfigurable cooling assemblies for thermal management of integrated circuitry are provided. Such assemblies can be modular and can permit or otherwise facilitate scalable thermal performance with respect to power dissipation demands. In some embodiments, a reconfigurable modular cooling assembly can be reversibly configured to adjust reversibly the cooling capacity of the assembly for a defined power dissipation requirement. A form factor of a reconfigurable modular cooling assembly can be based at least on the defined power dissipation requirement. In some embodiments, a reconfigurable modular cooling assembly can include a pedestal member and multiple attachment members that can be reversibly coupled to or reversibly decoupled from the pedestal based at least on a power dissipation condition and/or a change thereof in a dissipative electronic component included in a semiconductor package. Scalability of thermal performance of the reconfigurable modular cooling assembly can be achieved, at least in part, by the addition of attachment members.

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