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公开(公告)号：US11658390B2
公开(公告)日：2023-05-23
申请号：US16750861
申请日：2020-01-23
发明人： Christian W. Baks , Daniel J. Friedman , Xiaoxiong Gu , Duixian Liu , Alberto Valdes Garcia , Joakim Hallin , Ola Ragnar Tageman
CPC分类号： H01Q1/2283 , H01Q1/38 , H01Q1/48 , H01Q1/526 , H01Q9/045 , H01Q9/0407 , H01Q21/065 , H01Q21/24
摘要： Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes multilayer package substrate, a planar antenna array, antenna feed lines, and resistive transmission lines. The planar antenna array includes an array of active antenna elements and dummy antenna elements surrounding the array of active antenna elements. Each active antenna element is coupled to a corresponding one of the antenna feed lines, and each dummy antenna element is coupled to a corresponding one of the resistive transmission lines. Each resistive transmission line extends through the multilayer package substrate and is terminated in a same metallization layer of the multilayer package substrate.
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公开(公告)号：US20200161744A1
公开(公告)日：2020-05-21
申请号：US16750861
申请日：2020-01-23
发明人： Christian W. Baks , Daniel J. Friedman , Xiaoxiong Gu , Duixian Liu , Alberto Valdes Garcia , Joakim Hallin , Ola Ragnar Tageman
摘要： Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes multilayer package substrate, a planar antenna array, antenna feed lines, and resistive transmission lines. The planar antenna array includes an array of active antenna elements and dummy antenna elements surrounding the array of active antenna elements. Each active antenna element is coupled to a corresponding one of the antenna feed lines, and each dummy antenna element is coupled to a corresponding one of the resistive transmission lines. Each resistive transmission line extends through the multilayer package substrate and is terminated in a same metallization layer of the multilayer package substrate.
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公开(公告)号：US10594019B2
公开(公告)日：2020-03-17
申请号：US15368600
申请日：2016-12-03
发明人： Christian W. Baks , Daniel J. Friedman , Xiaoxiong Gu , Duixian Liu , Alberto Valdes Garcia , Joakim Hallin , Ola Ragnar Tageman
摘要： Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes multilayer package substrate, a planar antenna array, antenna feed lines, and resistive transmission lines. The planar antenna array includes an array of active antenna elements and dummy antenna elements surrounding the array of active antenna elements. Each active antenna element is coupled to a corresponding one of the antenna feed lines, and each dummy antenna element is coupled to a corresponding one of the resistive transmission lines. Each resistive transmission line extends through the multilayer package substrate and is terminated in a same metallization layer of the multilayer package substrate.
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公开(公告)号：US20180159203A1
公开(公告)日：2018-06-07
申请号：US15368600
申请日：2016-12-03
发明人： Christian W. Baks , Daniel J. Friedman , Xiaoxiong Gu , Duixian Liu , Alberto Valdes Garcia , Joakim Hallin , Ola Ragnar Tageman
CPC分类号： H01Q1/2283 , H01Q1/38 , H01Q1/48 , H01Q1/526 , H01Q9/0407 , H01Q9/045 , H01Q21/065 , H01Q21/24
摘要： Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes multilayer package substrate, a planar antenna array, antenna feed lines, and resistive transmission lines. The planar antenna array includes an array of active antenna elements and dummy antenna elements surrounding the array of active antenna elements. Each active antenna element is coupled to a corresponding one of the antenna feed lines, and each dummy antenna element is coupled to a corresponding one of the resistive transmission lines. Each resistive transmission line extends through the multilayer package substrate and is terminated in a same metallization layer of the multilayer package substrate.
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公开(公告)号：US11189905B2
公开(公告)日：2021-11-30
申请号：US15953075
申请日：2018-04-13
IPC分类号： H01Q1/22 , H01L23/66 , H01Q21/06 , H01L21/66 , H01L23/367 , H01L23/538 , H01L23/00 , H01L21/48 , H01Q21/00
摘要： An apparatus includes an antenna array package cover comprising a radiating surface, a mating surface disposed opposite the radiating surface, and an array of antenna array sub-patterns wherein each antenna array sub-pattern comprises at least one antenna element. The antenna array package also includes an array of sub-pattern interface packages mated to the mating surface of the antenna array package cover. Each sub-pattern interface package of the array of sub-pattern interface packages comprises a package carrier, a sub-pattern integrated circuit electrically and mechanically coupled to the package carrier, and a set of interface lines corresponding to the antenna elements of the antenna array sub-pattern that corresponds to the sub-pattern interface package. Methods for mounting the above apparatus into a host circuit are also disclosed herein.
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公开(公告)号：US11177843B2
公开(公告)日：2021-11-16
申请号：US16362639
申请日：2019-03-23
发明人： Bodhisatwa Sadhu , Duixian Liu , Arun Paidimarri
摘要： A device includes a transmitter. A main antenna is coupled to the transmitter. A matching network coupled to the transmitter and configured to match an impedance of the main antenna, wherein one or more components of the matching network provide a desired radiation.
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公开(公告)号：US10784563B2
公开(公告)日：2020-09-22
申请号：US15901371
申请日：2018-02-21
IPC分类号： H01L21/00 , H01Q1/22 , H01L23/66 , H01L23/00 , H05K1/18 , H01Q23/00 , H01Q21/00 , H01Q21/06 , H01L23/367
摘要： Techniques regarding a scalable phased array are provided. For example, various embodiments described herein can comprise a plurality of integrated circuits having respective flip chip pads, and an antenna-in-package substrate having a ball grid array terminal and a plurality of transmission lines. The plurality of transmission lines can be embedded within the antenna-in-package substrate and can operatively couple the respective flip chip pads to the ball grid array terminal. In one or more embodiments, a die can comprise the plurality of integrated circuits. Further, in one or more embodiments a combiner can also be embedded in the antenna-in-package substrate. The combiner can join the plurality of transmission lines.
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公开(公告)号：US20180076526A1
公开(公告)日：2018-03-15
申请号：US14796062
申请日：2015-07-10
发明人： Alberto V. Garcia , Xiaoxiong Gu , Duixian Liu
CPC分类号： H01Q9/0407 , G06K19/077 , G06K19/07749 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/33 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/17517 , H01L2224/32013 , H01L2224/32014 , H01L2224/32225 , H01L2224/33181 , H01L2224/73204 , H01L2224/73253 , H01L2924/15192 , H01L2924/15321 , H01L2924/15322 , H01Q1/38 , H01Q19/30 , H01Q21/28 , H01Q23/00 , H01L2924/014 , H01L2924/00012 , H01L2924/00
摘要： Package structures are provided having antenna-in-packages that are integrated with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter wave (mmWave) frequency range with radiation in broadside and end-fire directions.
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公开(公告)号：US09660345B1
公开(公告)日：2017-05-23
申请号：US15157841
申请日：2016-05-18
摘要： A millimeter-wave (MMW) communication system may include an antenna array structure operating within a MMW band, having both a first antenna coupling point and a second antenna coupling point, whereby the first and the second location of the antenna coupling points are within a coplanar surface on which the antenna array structure is formed. The system may further include a single MMW transmitter device having a power splitter that splits a data modulated MMW signal into a first MMW data modulated signal and a second MMW data modulated signal identical to the first MMW data modulated signal, such that the first data modulated MMW signal is coupled to the first antenna coupling point for radio propagation at a first direction, and the second data modulated MMW signal is coupled to the second antenna coupling point for radio propagation at a second direction.
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公开(公告)号：US09577314B2
公开(公告)日：2017-02-21
申请号：US13796404
申请日：2013-03-12
IPC分类号： H01Q1/22 , H01Q1/36 , H01L21/50 , H01L23/522 , H01L21/302 , H01L21/48 , H01L23/66
CPC分类号： H01Q15/142 , H01L21/302 , H01L21/486 , H01L21/50 , H01L23/5227 , H01L23/66 , H01L25/50 , H01L2223/6677 , H01L2224/0401 , H01L2224/04042 , H01L2224/0557 , H01L2224/16225 , H01Q1/2283 , H01Q1/36 , H01Q1/38 , H01Q9/0407
摘要： Antenna devices, antenna systems and methods of their fabrication are disclosed. One such antenna device includes a semiconductor chip and a chip package. The semiconductor chip includes at least one antenna that is integrated into a dielectric layer of the semiconductor chip and is configured to transmit electromagnetic waves. In addition, the chip package includes at least one ground plane, where the semiconductor chip is mounted on the chip package such that the ground plane(s) is disposed at a predetermined distance from the antenna to implement a reflection of at least a portion of the electromagnetic waves.
摘要翻译： 公开了天线装置，天线系统及其制造方法。 一种这样的天线装置包括半导体芯片和芯片封装。 半导体芯片包括集成到半导体芯片的电介质层中的至少一个天线，并被配置为传输电磁波。 此外，芯片封装包括至少一个接地平面，其中半导体芯片安装在芯片封装上，使得接地平面设置在离天线预定距离处，以实现至少一部分 电磁波。
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