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公开(公告)号：US07408246B2
公开(公告)日：2008-08-05
申请号：US11095929
申请日：2005-03-31
IPC分类号： H01L23/495
CPC分类号： H01L23/3735 , H01L24/32 , H01L2924/10253 , H01L2924/12044 , H01L2924/14 , H01L2924/3511 , H01L2924/00
摘要： Techniques for integrated circuit device fabrication are provided. In one aspect, an integrated circuit device comprises a base, at least one die attached to the base, and a counterbalancing layer on at least a portion of at least one side of the base adapted to compensate for at least a portion of a thermal expansion difference existing between the base and the die. In another aspect, warping of an integrated circuit device comprising at least one die attached to a base is controlled by applying a counterbalancing layer to at least a portion of at least one side of the base adapted to compensate for at least a portion of a thermal expansion difference existing between the base and the die.
摘要翻译： 提供了集成电路器件制造技术。 在一个方面，一种集成电路装置包括基座，至少一个连接到基座的管芯，以及基座的至少一侧的至少一部分上的平衡层，其适于补偿至少一部分热膨胀 基座和模具之间存在差异。 在另一方面，包括至少一个连接到基座的管芯的集成电路器件的翘曲通过将平衡层施加到所述基底的至少一个侧面的至少一部分上来进行控制，该至少一个侧面适于补偿至少一部分热 基地和死亡之间存在扩张差异。
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公开(公告)号：US20110250742A1
公开(公告)日：2011-10-13
申请号：US13041674
申请日：2011-03-07
IPC分类号： H01L21/3205
CPC分类号： H01L23/3735 , H01L24/32 , H01L2924/10253 , H01L2924/12044 , H01L2924/14 , H01L2924/3511 , H01L2924/00
摘要： Techniques for integrated circuit device fabrication are provided. In one aspect, an integrated circuit device comprises a base, at least one die attached to the base, and a counterbalancing layer on at least a portion of at least one side of the base adapted to compensate for at least a portion of a thermal expansion difference existing between the base and the die. In another aspect, warping of an integrated circuit device comprising at least one die attached to a base is controlled by applying a counterbalancing layer to at least a portion of at least one side of the base adapted to compensate for at least a portion of a thermal expansion difference existing between the base and the die.
摘要翻译： 提供了集成电路器件制造技术。 在一个方面，一种集成电路装置包括基座，至少一个连接到基座的管芯，以及基座的至少一侧的至少一部分上的平衡层，其适于补偿至少一部分热膨胀 基座和模具之间存在差异。 在另一方面，包括至少一个连接到基座的管芯的集成电路器件的翘曲通过将平衡层施加到所述基底的至少一个侧面的至少一部分上来进行控制，该至少一个侧面适于补偿至少一部分热 基地和死亡之间存在扩张差异。
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公开(公告)号：US20090311853A1
公开(公告)日：2009-12-17
申请号：US12546083
申请日：2009-08-24
IPC分类号： H01L21/3205
CPC分类号： H01L23/3735 , H01L24/32 , H01L2924/10253 , H01L2924/12044 , H01L2924/14 , H01L2924/3511 , H01L2924/00
摘要： Techniques for integrated circuit device fabrication are provided. In one aspect, an integrated circuit device comprises a base, at least one die attached to the base, and a counterbalancing layer on at least a portion of at least one side of the base adapted to compensate for at least a portion of a thermal expansion difference existing between the base and the die. In another aspect, warping of an integrated circuit device comprising at least one die attached to a base is controlled by applying a counterbalancing layer to at least a portion of at least one side of the base adapted to compensate for at least a portion of a thermal expansion difference existing between the base and the die.
摘要翻译： 提供了集成电路器件制造技术。 在一个方面，一种集成电路装置包括基座，至少一个连接到基座的管芯，以及基座的至少一侧的至少一部分上的平衡层，其适于补偿至少一部分热膨胀 基座和模具之间存在差异。 在另一方面，包括至少一个连接到基座的管芯的集成电路器件的翘曲通过将平衡层施加到所述基底的至少一个侧面的至少一部分上来进行控制，该至少一个侧面适于补偿至少一部分热 基地和死亡之间存在扩张差异。
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公开(公告)号：US08133799B2
公开(公告)日：2012-03-13
申请号：US13041674
申请日：2011-03-07
CPC分类号： H01L23/3735 , H01L24/32 , H01L2924/10253 , H01L2924/12044 , H01L2924/14 , H01L2924/3511 , H01L2924/00
摘要： Techniques for integrated circuit device fabrication are provided. In one aspect, an integrated circuit device comprises a base, at least one die attached to the base, and a counterbalancing layer on at least a portion of at least one side of the base adapted to compensate for at least a portion of a thermal expansion difference existing between the base and the die. In another aspect, warping of an integrated circuit device comprising at least one die attached to a base is controlled by applying a counterbalancing layer to at least a portion of at least one side of the base adapted to compensate for at least a portion of a thermal expansion difference existing between the base and the die.
摘要翻译： 提供了集成电路器件制造技术。 在一个方面，一种集成电路装置包括基座，至少一个连接到基座的管芯，以及基座的至少一侧的至少一部分上的平衡层，其适于补偿至少一部分热膨胀 基座和模具之间存在差异。 在另一方面，包括至少一个连接到基座的管芯的集成电路器件的翘曲通过将平衡层施加到所述基底的至少一个侧面的至少一部分上来进行控制，该至少一个侧面适于补偿至少一部分热 基地和死亡之间存在扩张差异。
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公开(公告)号：US07923347B2
公开(公告)日：2011-04-12
申请号：US12546083
申请日：2009-08-24
CPC分类号： H01L23/3735 , H01L24/32 , H01L2924/10253 , H01L2924/12044 , H01L2924/14 , H01L2924/3511 , H01L2924/00
摘要： Techniques for integrated circuit device fabrication are provided. In one aspect, an integrated circuit device comprises a base, at least one die attached to the base, and a counterbalancing layer on at least a portion of at least one side of the base adapted to compensate for at least a portion of a thermal expansion difference existing between the base and the die. In another aspect, warping of an integrated circuit device comprising at least one die attached to a base is controlled by applying a counterbalancing layer to at least a portion of at least one side of the base adapted to compensate for at least a portion of a thermal expansion difference existing between the base and the die.
摘要翻译： 提供了集成电路器件制造技术。 在一个方面，一种集成电路装置包括基座，至少一个连接到基座的管芯，以及基座的至少一侧的至少一部分上的平衡层，其适于补偿至少一部分热膨胀 基座和模具之间存在差异。 在另一方面，包括至少一个连接到基座的管芯的集成电路器件的翘曲通过将平衡层施加到所述基底的至少一个侧面的至少一部分上来进行控制，该至少一个侧面适于补偿至少一部分热 基地和死亡之间存在扩张差异。
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公开(公告)号：US07598602B2
公开(公告)日：2009-10-06
申请号：US12163453
申请日：2008-06-27
IPC分类号： H01L23/495
CPC分类号： H01L23/3735 , H01L24/32 , H01L2924/10253 , H01L2924/12044 , H01L2924/14 , H01L2924/3511 , H01L2924/00
摘要： Techniques for integrated circuit device fabrication are provided. In one aspect, an integrated circuit device comprises a base, at least one die attached to the base, and a counterbalancing layer on at least a portion of at least one side of the base adapted to compensate for at least a portion of a thermal expansion difference existing between the base and the die. In another aspect, warping of an integrated circuit device comprising at least one die attached to a base is controlled by applying a counterbalancing layer to at least a portion of at least one side of the base adapted to compensate for at least a portion of a thermal expansion difference existing between the base and the die.
摘要翻译： 提供了集成电路器件制造技术。 在一个方面，一种集成电路装置包括基座，至少一个连接到基座的管芯，以及基座的至少一侧的至少一部分上的平衡层，其适于补偿至少一部分热膨胀 基座和模具之间存在差异。 在另一方面，包括至少一个连接到基座的管芯的集成电路器件的翘曲通过将平衡层施加到所述基底的至少一个侧面的至少一部分上来进行控制，该至少一个侧面适于补偿至少一部分热 基地和死亡之间存在扩张差异。
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公开(公告)号：US20080258275A1
公开(公告)日：2008-10-23
申请号：US12163453
申请日：2008-06-27
IPC分类号： H01L23/495 , H01L21/50
CPC分类号： H01L23/3735 , H01L24/32 , H01L2924/10253 , H01L2924/12044 , H01L2924/14 , H01L2924/3511 , H01L2924/00
摘要： Techniques for integrated circuit device fabrication are provided. In one aspect, an integrated circuit device comprises a base, at least one die attached to the base, and a counterbalancing layer on at least a portion of at least one side of the base adapted to compensate for at least a portion of a thermal expansion difference existing between the base and the die. In another aspect, warping of an integrated circuit device comprising at least one die attached to a base is controlled by applying a counterbalancing layer to at least a portion of at least one side of the base adapted to compensate for at least a portion of a thermal expansion difference existing between the base and the die.
摘要翻译： 提供了集成电路器件制造技术。 在一个方面，一种集成电路装置包括基座，至少一个连接到基座的管芯，以及基座的至少一侧的至少一部分上的平衡层，其适于补偿至少一部分热膨胀 基座和模具之间存在差异。 在另一方面，包括至少一个连接到基座的管芯的集成电路器件的翘曲通过将平衡层施加到所述基底的至少一个侧面的至少一部分上来进行控制，该至少一个侧面适于补偿至少一部分热 基地和死亡之间存在扩张差异。
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8.发明授权Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate 有权集成电路芯片组件，其具有布置在电路基板的孔中的导热特征阵列公开(公告)号：US07982307B2
公开(公告)日：2011-07-19
申请号：US11562537
申请日：2006-11-22
IPC分类号： H01L23/34
CPC分类号： H05K1/0204 , H01L21/563 , H01L23/13 , H01L23/3677 , H01L24/17 , H01L2224/0401 , H01L2224/05124 , H01L2224/05155 , H01L2224/05647 , H01L2224/0603 , H01L2224/13099 , H01L2224/14 , H01L2224/1403 , H01L2224/16 , H01L2224/1703 , H01L2224/32188 , H01L2224/73203 , H01L2224/73204 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K3/0061 , H05K3/3436 , H05K2201/09054 , H05K2201/10674 , H05K2203/041 , H01L2924/00012 , H01L2224/29099 , H01L2924/00014 , H01L2924/013
摘要： An assembly comprises a stiffener, a circuit substrate and an IC chip. The stiffener has a surface with a first region and a second region. The circuit substrate covers at least a portion of the first region of the stiffener, while the IC chip overlies at least a portion of each of the first and second regions of the stiffener. The assembly further comprises a signal solder bump and a thermally conductive feature. The signal solder bump contacts the IC chip and the circuit substrate. The thermally conductive feature is disposed between, and is metallurgically bonded to, the integrated circuit chip and the second region of the stiffener. The thermally conductive feature provides an efficient thermal conductivity pathway between the IC chip and the stiffener.
摘要翻译： 组件包括加强件，电路基板和IC芯片。 加强件具有带有第一区域和第二区域的表面。 电路基板覆盖加强件的第一区域的至少一部分，而IC芯片覆盖加强件的第一和第二区域的每一个的至少一部分。 组件还包括信号焊料凸块和导热特征。 信号焊料凸块接触IC芯片和电路基板。 导热特征被布置在集成电路芯片和加强件的第二区域之间并且被冶金结合。 导热特征提供了IC芯片和加强件之间的有效的热导通路。
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公开(公告)号：US20080116567A1
公开(公告)日：2008-05-22
申请号：US11562537
申请日：2006-11-22
IPC分类号： H01L23/34
CPC分类号： H05K1/0204 , H01L21/563 , H01L23/13 , H01L23/3677 , H01L24/17 , H01L2224/0401 , H01L2224/05124 , H01L2224/05155 , H01L2224/05647 , H01L2224/0603 , H01L2224/13099 , H01L2224/14 , H01L2224/1403 , H01L2224/16 , H01L2224/1703 , H01L2224/32188 , H01L2224/73203 , H01L2224/73204 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K3/0061 , H05K3/3436 , H05K2201/09054 , H05K2201/10674 , H05K2203/041 , H01L2924/00012 , H01L2224/29099 , H01L2924/00014 , H01L2924/013
摘要： An assembly comprises a stiffener, a circuit substrate and an IC chip. The stiffener has a surface with a first region and a second region. The circuit substrate covers at least a portion of the first region of the stiffener, while the IC chip overlies at least a portion of each of the first and second regions of the stiffener. The assembly further comprises a signal solder bump and a thermally conductive feature. The signal solder bump contacts the IC chip and the circuit substrate. The thermally conductive feature is disposed between, and is metallurgically bonded to, the integrated circuit chip and the second region of the stiffener. The thermally conductive feature provides an efficient thermal conductivity pathway between the IC chip and the stiffener.
摘要翻译： 组件包括加强件，电路基板和IC芯片。 加强件具有带有第一区域和第二区域的表面。 电路基板覆盖加强件的第一区域的至少一部分，而IC芯片覆盖加强件的第一和第二区域的每一个的至少一部分。 组件还包括信号焊料凸块和导热特征。 信号焊料凸块接触IC芯片和电路基板。 导热特征被布置在集成电路芯片和加强件的第二区域之间并且被冶金结合。 导热特征提供了IC芯片和加强件之间的有效的热导通路。
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公开(公告)号：US07433192B2
公开(公告)日：2008-10-07
申请号：US11055712
申请日：2005-02-10
申请人： Timothy B. Bambridge , Juan A. Herbsommer , Osvaldo Lopez , Joel M. Lott , Hugo F. Safar , Thomas H. Shilling
发明人： Timothy B. Bambridge , Juan A. Herbsommer , Osvaldo Lopez , Joel M. Lott , Hugo F. Safar , Thomas H. Shilling
IPC分类号： H05K7/20
CPC分类号： H05K1/021 , H01L23/13 , H01L23/3677 , H01L23/49816 , H01L23/66 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L2224/32188 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49175 , H01L2924/00014 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01074 , H01L2924/014 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15311 , H01L2924/3011 , H01L2924/30111 , H05K1/141 , H05K1/182 , H05K3/0061 , H05K3/3436 , H05K2201/10734 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： An electronic module has a non-conducting substrate having at least one opening and a die/carrier assembly mounted within the opening in the substrate. The assembly has a conducting carrier and one or more integrated circuit (IC) dies mounted to the carrier. The invention may be implemented as an electronic system comprising a circuit board (CB) and at least one such electronic module mounted to the CB.
摘要翻译： 电子模块具有至少一个开口的非导电衬底和安装在衬底的开口内的模具/载体组件。 组件具有导电载体和安装到载体上的一个或多个集成电路（IC）管芯。 本发明可以被实现为包括电路板（CB）和安装到CB的至少一个这样的电子模块的电子系统。
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