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公开(公告)号：US20080116567A1
公开(公告)日：2008-05-22
申请号：US11562537
申请日：2006-11-22
IPC分类号： H01L23/34
CPC分类号： H05K1/0204 , H01L21/563 , H01L23/13 , H01L23/3677 , H01L24/17 , H01L2224/0401 , H01L2224/05124 , H01L2224/05155 , H01L2224/05647 , H01L2224/0603 , H01L2224/13099 , H01L2224/14 , H01L2224/1403 , H01L2224/16 , H01L2224/1703 , H01L2224/32188 , H01L2224/73203 , H01L2224/73204 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K3/0061 , H05K3/3436 , H05K2201/09054 , H05K2201/10674 , H05K2203/041 , H01L2924/00012 , H01L2224/29099 , H01L2924/00014 , H01L2924/013
摘要： An assembly comprises a stiffener, a circuit substrate and an IC chip. The stiffener has a surface with a first region and a second region. The circuit substrate covers at least a portion of the first region of the stiffener, while the IC chip overlies at least a portion of each of the first and second regions of the stiffener. The assembly further comprises a signal solder bump and a thermally conductive feature. The signal solder bump contacts the IC chip and the circuit substrate. The thermally conductive feature is disposed between, and is metallurgically bonded to, the integrated circuit chip and the second region of the stiffener. The thermally conductive feature provides an efficient thermal conductivity pathway between the IC chip and the stiffener.
摘要翻译： 组件包括加强件，电路基板和IC芯片。 加强件具有带有第一区域和第二区域的表面。 电路基板覆盖加强件的第一区域的至少一部分，而IC芯片覆盖加强件的第一和第二区域的每一个的至少一部分。 组件还包括信号焊料凸块和导热特征。 信号焊料凸块接触IC芯片和电路基板。 导热特征被布置在集成电路芯片和加强件的第二区域之间并且被冶金结合。 导热特征提供了IC芯片和加强件之间的有效的热导通路。
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2.发明授权Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate 有权集成电路芯片组件，其具有布置在电路基板的孔中的导热特征阵列公开(公告)号：US07982307B2
公开(公告)日：2011-07-19
申请号：US11562537
申请日：2006-11-22
IPC分类号： H01L23/34
CPC分类号： H05K1/0204 , H01L21/563 , H01L23/13 , H01L23/3677 , H01L24/17 , H01L2224/0401 , H01L2224/05124 , H01L2224/05155 , H01L2224/05647 , H01L2224/0603 , H01L2224/13099 , H01L2224/14 , H01L2224/1403 , H01L2224/16 , H01L2224/1703 , H01L2224/32188 , H01L2224/73203 , H01L2224/73204 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K3/0061 , H05K3/3436 , H05K2201/09054 , H05K2201/10674 , H05K2203/041 , H01L2924/00012 , H01L2224/29099 , H01L2924/00014 , H01L2924/013
摘要： An assembly comprises a stiffener, a circuit substrate and an IC chip. The stiffener has a surface with a first region and a second region. The circuit substrate covers at least a portion of the first region of the stiffener, while the IC chip overlies at least a portion of each of the first and second regions of the stiffener. The assembly further comprises a signal solder bump and a thermally conductive feature. The signal solder bump contacts the IC chip and the circuit substrate. The thermally conductive feature is disposed between, and is metallurgically bonded to, the integrated circuit chip and the second region of the stiffener. The thermally conductive feature provides an efficient thermal conductivity pathway between the IC chip and the stiffener.
摘要翻译： 组件包括加强件，电路基板和IC芯片。 加强件具有带有第一区域和第二区域的表面。 电路基板覆盖加强件的第一区域的至少一部分，而IC芯片覆盖加强件的第一和第二区域的每一个的至少一部分。 组件还包括信号焊料凸块和导热特征。 信号焊料凸块接触IC芯片和电路基板。 导热特征被布置在集成电路芯片和加强件的第二区域之间并且被冶金结合。 导热特征提供了IC芯片和加强件之间的有效的热导通路。
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3.发明授权Soldering method and related device for improved resistance to brittle fracture with an intermetallic compound region coupling a solder mass to an Ni layer which has a low concentration of P, wherein the amount of P in the underlying Ni layer is controlled as a function of the expected volume of the solder mass 有权焊接方法及相关装置，用于将金属间化合物区域连接到具有低浓度P的Ni层的金属间化合物区域，其中下层Ni层中的P的量作为预期的函数被控制 焊料体积公开(公告)号：US08242378B2
公开(公告)日：2012-08-14
申请号：US12160553
申请日：2007-09-21
申请人： Ahmed Amin , Frank Baiocchi , John Delucca , John Osenbach , Brian T. Vaccaro
发明人： Ahmed Amin , Frank Baiocchi , John Delucca , John Osenbach , Brian T. Vaccaro
CPC分类号： H05K3/244 , H01L2224/16225 , H05K3/3463
摘要： A lead-free solder joint is formed between a tin-silver-copper solder alloy (SAC), SACX, or other commonly used Pb-free solder alloys, and a metallization layer of a substrate. Interaction of the SAC with the metallization layer forms an intermetallic compound (IMC) that binds the solder mass to the metallization layer. The IMC region is substantially free of any phosphorous-containing layers or regions.
摘要翻译： 在锡 - 银 - 铜焊料合金（SAC），SACX或其它通常使用的无铅焊料合金和基板的金属化层之间形成无铅焊点。 SAC与金属化层的相互作用形成将焊料质量结合到金属化层的金属间化合物（IMC）。 IMC区域基本上不含任何含磷层或区域。
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4.发明申请SOLDERING METHOD AND RELATED DEVICE FOR IMPROVED RESISTANCE TO BRITTLE FRACTURE 审中-公开焊接方法及相关装置，用于改善耐磨性公开(公告)号：US20120280023A1
公开(公告)日：2012-11-08
申请号：US13552266
申请日：2012-07-18
申请人： Ahmed Amin , Frank Baiocchi , John Delucca , John Osenbach , Brian T. Vaccaro
发明人： Ahmed Amin , Frank Baiocchi , John Delucca , John Osenbach , Brian T. Vaccaro
CPC分类号： B23K1/0016 , B23K1/008 , B23K1/20 , B23K1/203 , B23K3/0623 , B23K2101/42
摘要： A lead-free solder joint is formed between a tin-silver-copper solder alloy (SAC), SACX, or other commonly used Pb-free solder alloys, and a metallization layer of a substrate. Interaction of the SAC with the metallization layer forms an intermetallic compound (IMC) that binds the solder mass to the metallization layer. The IMC region is substantially free of any phosphorous-containing layers or regions.
摘要翻译： 在锡 - 银 - 铜焊料合金（SAC），SACX或其它通常使用的无铅焊料合金和基板的金属化层之间形成无铅焊点。 SAC与金属化层的相互作用形成将焊料质量结合到金属化层的金属间化合物（IMC）。 IMC区域基本上不含任何含磷层或区域。
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5.发明申请Soldering Method and Related Device for Improved Resistance to Brittle Fracture 有权焊接方法及相关装置，用于改善脆性断裂公开(公告)号：US20100243300A1
公开(公告)日：2010-09-30
申请号：US12160553
申请日：2007-09-21
申请人： Ahmed Amin , Frank Baiocchi , John Delucca , John Osenbach , Brian T. Vaccaro
发明人： Ahmed Amin , Frank Baiocchi , John Delucca , John Osenbach , Brian T. Vaccaro
CPC分类号： H05K3/244 , H01L2224/16225 , H05K3/3463
摘要： A lead-free solder joint is formed between a tin-silver-copper solder alloy (SAC), SACX, or other commonly used Pb-free solder alloys, and a metallization layer of a substrate. Interaction of the SAC with the metallization layer forms an intermetallic compound (IMC) that binds the solder mass to the metallization layer. The IMC region is substantially free of any phosphorous-containing layers or regions.
摘要翻译： 在锡 - 银 - 铜焊料合金（SAC），SACX或其它通常使用的无铅焊料合金和基板的金属化层之间形成无铅焊点。 SAC与金属化层的相互作用形成将焊料质量结合到金属化层的金属间化合物（IMC）。 IMC区域基本上不含任何含磷层或区域。
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公开(公告)号：US20100319967A1
公开(公告)日：2010-12-23
申请号：US12666437
申请日：2007-06-28
申请人： Ahmed Amin , Mark Adam Bachman , Frank A. Baiocchi , John A. Delucca , John W. Osenbach , Zhengpeng Xiong
发明人： Ahmed Amin , Mark Adam Bachman , Frank A. Baiocchi , John A. Delucca , John W. Osenbach , Zhengpeng Xiong
CPC分类号： H05K3/244 , H01L2224/05001 , H01L2224/05023 , H01L2224/0508 , H01L2224/05124 , H01L2224/05166 , H01L2224/05568 , H01L2224/056 , H01L2224/16 , H01L2924/01327 , H01L2924/3025 , H05K3/3463 , H05K2203/1105 , Y10T428/12715 , H01L2924/00 , H01L2924/00014
摘要： A device fabrication method, according to which a tin-copper-alloy layer is formed adjacent to a copper-plated pad or pin that is used to electrically connect the device to external wiring. Advantageously, the tin-copper-alloy layer inhibits copper dissolution during a solder reflow process because that layer is substantially insoluble in liquid Sn—Ag—Cu (tin-silver-copper) solder alloys under typical solder reflow conditions and therefore shields the copper plating from direct physical contact with the liquefied solder.
摘要翻译： 一种器件制造方法，根据该器件制造方法，与用于将器件电连接到外部布线的镀铜焊盘或引脚相邻形成锡 - 铜合金层。 有利地，锡 - 铜合金层在焊料回流过程中抑制铜溶解，因为该层在典型的回流焊条件下基本上不溶于液体Sn-Ag-Cu（锡 - 银 - 铜）焊料合金，因此屏蔽铜电镀 与液化焊料直接接触。
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公开(公告)号：US08395301B1
公开(公告)日：2013-03-12
申请号：US12962834
申请日：2010-12-08
申请人： Kenji Uchino , Yuan Zhuang , Seyit O Ural , Ahmed Amin
发明人： Kenji Uchino , Yuan Zhuang , Seyit O Ural , Ahmed Amin
IPC分类号： H01L41/047
CPC分类号： H01L41/107 , H01L41/18
摘要： A piezoelectric transformer includes a single crystal relaxor ferroelectric element poled along a [0 11] direction and selected from the group consisting of PZN-PT, PMN-PZT, PZN-PT and PMN-PT. The element has two opposed surfaces substantially perpendicular to the [0 11] direction with an input electrode and an output electrode positioned on one surface. The output electrode is isolated from electrical communication with the input electrode. A ground electrode is positioned on the second, opposed surface. Input electrical energy results in piezoelectric change in the element that is mechanically coupled through the element to generate piezoelectric output energy.
摘要翻译： 压电变压器包括沿[011]方向极化并选自PMN-PZT，PZN-PT和PMN-PT的单晶弛豫铁电元件。 元件具有基本上垂直于[011]方向的两个相对表面，输入电极和位于一个表面上的输出电极。 输出电极与输入电极电连接隔离。 接地电极位于第二相对表面上。 输入电能导致通过元件机械耦合的元件的压电变化，以产生压电输出能量。
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