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1.发明申请公开(公告)号：US20190005629A1
公开(公告)日：2019-01-03
申请号：US16019422
申请日：2018-06-26
Applicant: KLA-Tencor Corporation
Inventor： Saurabh Sharma , Amitoz Singh Dandiana , Mohan Mahadevan , Chao Fang , Amir Azordegan , Brian Duffy
IPC: G06T5/00
CPC classification number: G06T5/007 , G06T3/4053 , G06T2207/20084 , G06T2207/20208
Abstract: Methods and systems for generating a high resolution image for a specimen from a low resolution image of the specimen are provided. One system includes one or more computer subsystems configured for acquiring a low resolution image of a specimen. The system also includes one or more components executed by the one or more computer subsystems. The one or more components include a deep convolutional neural network that includes one or more first layers configured for generating a representation of the low resolution image. The deep convolutional neural network also includes one or more second layers configured for generating a high resolution image of the specimen from the representation of the low resolution image. The second layer(s) include a final layer configured to output the high resolution image and configured as a sub-pixel convolutional layer.
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2.发明申请Using Wafer Geometry to Improve Scanner Correction Effectiveness for Overlay Control 有权使用晶片几何来提高覆盖控制的扫描仪校正有效性公开(公告)号：US20150212429A1
公开(公告)日：2015-07-30
申请号：US14683880
申请日：2015-04-10
Applicant: KLA-Tencor Corporation
Inventor： Craig MacNaughton , Sathish Veeraraghavan , Pradeep Vukkadala , Jaydeep Sinha , Amir Azordegan
IPC: G03F7/20 , H01J37/317
CPC classification number: G03F7/70616 , G03F7/70633 , G03F7/70783 , G03F9/7003 , H01J37/28 , H01J37/304 , H01J37/3172 , H01J37/3174 , H01J2237/221 , H01J2237/2814 , H01J2237/30472 , H01J2237/30483 , H01J2237/31701
Abstract: Systems and methods for providing improved scanner corrections are disclosed. Scanner corrections provided in accordance with the present disclosure may be referred to as wafer geometry aware scanner corrections. More specifically, wafer geometry and/or wafer shape signature information are utilized to improve scanner corrections. By removing the wafer geometry as one of the error sources that may affect the overlay accuracy, better scanner corrections can be obtained because one less contributing factor needs to be modeled.
Abstract translation: 公开了用于提供改进的扫描仪校正的系统和方法。 根据本公开提供的扫描仪校正可以被称为晶片几何感知扫描仪校正。 更具体地，利用晶片几何形状和/或晶片形状签名信息来改进扫描器校正。 通过将晶片几何作为可能影响覆盖精度的错误源之一，可以获得更好的扫描仪校正，因为需要对一个较少的因素进行建模。
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3.发明授权公开(公告)号：US10769761B2
公开(公告)日：2020-09-08
申请号：US16019422
申请日：2018-06-26
Applicant: KLA-Tencor Corporation
Inventor： Saurabh Sharma , Amitoz Singh Dandiana , Mohan Mahadevan , Chao Fang , Amir Azordegan , Brian Duffy
Abstract: Methods and systems for generating a high resolution image for a specimen from a low resolution image of the specimen are provided. One system includes one or more computer subsystems configured for acquiring a low resolution image of a specimen. The system also includes one or more components executed by the one or more computer subsystems. The one or more components include a deep convolutional neural network that includes one or more first layers configured for generating a representation of the low resolution image. The deep convolutional neural network also includes one or more second layers configured for generating a high resolution image of the specimen from the representation of the low resolution image. The second layer(s) include a final layer configured to output the high resolution image and configured as a sub-pixel convolutional layer.
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公开(公告)号：US09513565B2
公开(公告)日：2016-12-06
申请号：US14683880
申请日：2015-04-10
Applicant: KLA-Tencor Corporation
Inventor： Craig MacNaughton , Sathish Veeraraghavan , Pradeep Vukkadala , Jaydeep Sinha , Amir Azordegan
IPC: H01L21/66 , G01B9/02 , G03F7/20 , H01J37/317 , H01J37/28 , H01J37/304
CPC classification number: G03F7/70616 , G03F7/70633 , G03F7/70783 , G03F9/7003 , H01J37/28 , H01J37/304 , H01J37/3172 , H01J37/3174 , H01J2237/221 , H01J2237/2814 , H01J2237/30472 , H01J2237/30483 , H01J2237/31701
Abstract: Systems and methods for providing improved scanner corrections are disclosed. Scanner corrections provided in accordance with the present disclosure may be referred to as wafer geometry aware scanner corrections. More specifically, wafer geometry and/or wafer shape signature information are utilized to improve scanner corrections. By removing the wafer geometry as one of the error sources that may affect the overlay accuracy, better scanner corrections can be obtained because one less contributing factor needs to be modeled.
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5.发明授权Statistical overlay error prediction for feed forward and feedback correction of overlay errors, root cause analysis and process control 有权反馈前馈和反馈校正的统计叠加误差预测，根本原因分析和过程控制公开(公告)号：US09087176B1
公开(公告)日：2015-07-21
申请号：US14220665
申请日：2014-03-20
Applicant: KLA-Tencor Corporation
Inventor： Wei Chang , Krishna Rao , Joseph Gutierrez , Ramon Olavarria , Craig Macnaughton , Amir Azordegan , Prasanna Dighe , Jaydeep Sinha
CPC classification number: G03F7/705 , G03F1/144 , G03F1/36 , G03F7/70633 , G06F17/5068 , G06F17/5081 , G06F2217/12 , G06N5/04 , G06N99/005 , Y02P90/265
Abstract: A method to collect data and train, validate and deploy statistical models to predict overlay errors using patterned wafer geometry data and other relevant information includes selecting a training wafer set, measuring at multiple lithography steps and calculating geometry differences, applying a plurality of predictive models to the training wafer geometry differences and comparing predicted overlay to the measured overlay on the training wafer set. The most accurate predictive model is identified and the results fed-forward to the lithography scanner tool which can correct for these effects and reduce overlay errors during the wafer scan-and-expose processes.
Abstract translation: 收集数据和训练，验证和部署统计模型以使用图案化晶片几何数据和其他相关信息来预测覆盖误差的方法包括选择训练晶片组，在多个光刻步骤测量并计算几何差异，将多个预测模型应用于 训练晶片几何差异并将预测覆盖与训练晶片组上测量的覆盖层进行比较。 识别最准确的预测模型，并将结果反馈到光刻扫描仪工具，可以校正这些影响并减少晶片扫描和曝光过程中的重叠误差。
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Patent Agency Ranking
公开(公告)号：US10276346B1
公开(公告)日：2019-04-30
申请号：US15281934
申请日：2016-09-30
Applicant: KLA-Tencor Corporation
Inventor： Brian Duffy , Amir Azordegan , Christopher Sears
IPC: H01J37/28 , H01J37/244 , H01J37/147
Abstract: A multi-beam inspection system includes one or more particle beam sources to generate two or more particle beams, a set of particle control elements configured to independently direct the two or more particle beams to a sample, one or more detectors positioned to receive particles emanating from the sample in response to the two or more particle beams, and a controller communicatively coupled to the one or more detectors. The controller includes one or more processors to generate two or more inspection datasets associated with the particles received by the one or more detectors.
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7.发明授权Enhanced patterned wafer geometry measurements based design improvements for optimal integrated chip fabrication performance 有权增强的图案化晶圆几何测量基于设计改进，以实现最佳集成芯片制造性能公开(公告)号：US09373165B2
公开(公告)日：2016-06-21
申请号：US14520998
申请日：2014-10-22
Applicant: KLA-Tencor Corporation
Inventor： Amir Azordegan , Pradeep Vukkadala , Craig MacNaughton , Jaydeep Sinha
CPC classification number: G01N21/9501 , G01B11/24 , G01N21/956 , G06T3/4069
Abstract: Methods and systems enabling ultra-high resolution topography measurements of patterned wafers are disclosed. Measurements obtained utilizing the ultra-high resolution metrology may be utilized to improve wafer metrology measurement accuracies. Additionally, measurements obtained utilizing the ultra-high resolution metrology may also be utilized to provide feedback and/or calibration control to improve fabrication and design of wafers.
Abstract translation: 公开了能够对图案化晶片进行超高分辨率地形测量的方法和系统。 可以利用超高分辨率测量获得的测量来提高晶片度量测量精度。 此外，利用超高分辨率度量获得的测量结果也可用于提供反馈和/或校准控制以改善晶片的制造和设计。
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8.发明授权Using wafer geometry to improve scanner correction effectiveness for overlay control 有权使用晶圆几何来提高扫描仪校正功能，实现覆盖控制公开(公告)号：US09029810B2
公开(公告)日：2015-05-12
申请号：US14287746
申请日：2014-05-27
Applicant: KLA-Tencor Corporation
Inventor： Craig MacNaughton , Sathish Veeraraghavan , Pradeep Vukkadala , Jaydeep Sinha , Amir Azordegan
IPC: G03F7/20 , H01J37/317 , H01J37/28 , H01J37/304
CPC classification number: G03F7/70616 , G03F7/70633 , G03F7/70783 , G03F9/7003 , H01J37/28 , H01J37/304 , H01J37/3172 , H01J37/3174 , H01J2237/221 , H01J2237/2814 , H01J2237/30472 , H01J2237/30483 , H01J2237/31701
Abstract: Systems and methods for providing improved scanner corrections are disclosed. Scanner corrections provided in accordance with the present disclosure may be referred to as wafer geometry aware scanner corrections. More specifically, wafer geometry and/or wafer shape signature information are utilized to improve scanner corrections. By removing the wafer geometry as one of the error sources that may affect the overlay accuracy, better scanner corrections can be obtained because one less contributing factor needs to be modeled.
Abstract translation: 公开了用于提供改进的扫描仪校正的系统和方法。 根据本公开提供的扫描仪校正可以被称为晶片几何感知扫描仪校正。 更具体地，利用晶片几何形状和/或晶片形状签名信息来改进扫描器校正。 通过将晶片几何作为可能影响覆盖精度的错误源之一，可以获得更好的扫描仪校正，因为需要对一个较少的因素进行建模。
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9.发明申请Using Wafer Geometry to Improve Scanner Correction Effectiveness for Overlay Control 有权使用晶片几何来提高覆盖控制的扫描仪校正有效性公开(公告)号：US20140353527A1
公开(公告)日：2014-12-04
申请号：US14287746
申请日：2014-05-27
Applicant: KLA-Tencor Corporation
Inventor： Craig MacNaughton , Sathish Veeraraghavan , Pradeep Vukkadala , Jaydeep Sinha , Amir Azordegan
IPC: G03F7/20 , H01J37/317
CPC classification number: G03F7/70616 , G03F7/70633 , G03F7/70783 , G03F9/7003 , H01J37/28 , H01J37/304 , H01J37/3172 , H01J37/3174 , H01J2237/221 , H01J2237/2814 , H01J2237/30472 , H01J2237/30483 , H01J2237/31701
Abstract: Systems and methods for providing improved scanner corrections are disclosed. Scanner corrections provided in accordance with the present disclosure may be referred to as wafer geometry aware scanner corrections. More specifically, wafer geometry and/or wafer shape signature information are utilized to improve scanner corrections. By removing the wafer geometry as one of the error sources that may affect the overlay accuracy, better scanner corrections can be obtained because one less contributing factor needs to be modeled.
Abstract translation: 公开了用于提供改进的扫描仪校正的系统和方法。 根据本公开提供的扫描仪校正可以被称为晶片几何感知扫描仪校正。 更具体地，利用晶片几何形状和/或晶片形状签名信息来改进扫描器校正。 通过将晶片几何作为可能影响覆盖精度的错误源之一，可以获得更好的扫描仪校正，因为需要对一个较少的因素进行建模。
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公开(公告)号：US10545412B2
公开(公告)日：2020-01-28
申请号：US15123980
申请日：2015-03-05
Applicant: KLA-Tencor Corporation
Inventor： Wei Chang , Krishna Rao , Joseph Gutierrez , Ramon Olavarria , Craig MacNaughton , Amir Azordegan , Prasanna Dighe
Abstract: A method to collect data and train, validate and deploy statistical models to predict overlay errors using patterned wafer geometry data and other relevant information includes selecting a training wafer set, measuring at multiple lithography steps and calculating geometry differences, applying a plurality of predictive models to the training wafer geometry differences and comparing predicted overlay to the measured overlay on the training wafer set. The most accurate predictive model is identified and the results fed-forward to the lithography scanner tool which can correct for these effects and reduce overlay errors during the wafer scan-and-expose processes.
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