摘要:
A semiconductor memory device including a memory cell array, bit lines, and sense amplifier groups. The memory cell array is composed of a plurality of memory cells arranged roughly in a matrix pattern. A plurality of the memory cells arranged in a row are activated in response to a row address decode signal. A pair of the bit lines are provided for each column. The data of the corresponding activated memory cells are transmitted to the bit line pair. Each of the sense amplifier groups has n-units of sense amplifiers each connected to the bit line pair, to sense and amplify data read to the bit line pair connected thereto. The respective reference potential terminals of the sense amplifiers of each of the sense amplifier groups are connected to a single common node which can be connected to a reference potential via a sense amplifier activating transistor turned on in response to a row address signal. The sense amplifiers can be operated at high speed, while preventing erroneous operation, because the wiring resistances and the parasitic capacitances of the common source node of the sense amplifiers can be reduced.
摘要:
A semiconductor memory device including a memory cell array, bit lines, and sense amplifier groups. The memory cell array is composed of a plurality of memory cells arranged roughly in a matrix pattern. A plurality of the memory cells arranged in a row are activated in response to a row address decode signal. A pair of the bit lines are provided for each column. The data of the corresponding activated memory cells are transmitted to the bit line pair. Each of the sense amplifier groups has n-units of sense amplifiers each connected to the bit line pair, to sense and amplify data read to the bit line pair connected thereto. The respective reference potential terminals of the sense amplifiers of each of the sense amplifier groups are connected to a single common node which can be connected to a reference potential via a sense amplifier activating transistor turned on in response to a row address signal. The sense amplifiers can be operated at high speed, while preventing erroneous operation, because the wiring resistances and the parasitic capacitances of the common source node of the sense amplifiers can be reduced.
摘要:
An improved semiconductor memory having a plurality of sense amplifier circuits corresponding to each bit line of a plurality of columns. A first common line is connected in common to the sense amplifier circuits, and a second common line is connected to the first common line. A first switching element is connected between the second common line and a reference voltage potential terminal, and a second switching element is connected to the first common line and the reference voltage potential. The second switching element corresponding to the first common line connected to one of the sense amplifier circuits is made conductive in response to a selection of the sense amplifier is disclosed.
摘要:
A semiconductor integrated circuit includes memory cell blocks having memory cells arranged in matrix, sense amplifiers, each located adjacent to the memory cells, and sense amplifier control circuits, each of the sense amplifier control circuit being located on outside of the memory cell block. The sense amplifier control circuit has a standard voltage generating circuit and a control circuit for receiving the standard voltage and for transferring a driver signal to the sense amplifier to control the charging ability of the sense amplifier. The source voltage has three voltage regions, first, intermediate, and second regions. In the first voltage region, the potential of the driver signal increases with the increase of the source voltage. In the intermediate voltage region (2.7 to 3 Volt), the potential of the driver signal is changed oppose to the change of the source voltage, and in the second voltage region, the potential of the driver signal decreases with the increase of the source voltage.
摘要:
In the semiconductor device according to the present invention, bonding pads are arranged on the periphery of the semiconductor chip and power supply inner leads are disposed inwardly of signal inner leads. Since bonding wires for connecting the signal lead to signal pads corresponding thereto do not extend astride of the power supply inner lead, a package of a semiconductor device can be thereby thinned as much as possible.
摘要:
In a semiconductor memory device having plural pairs of bit lines and plural sense amplifiers, a gate electrode of a sense amplifier transistor for sensing potential of a first side of a first bit line pair is formed with an extension portion extending under and along the first side of a second bit line pair. A capacitance C.sub.B formed between the extension of the gate electrode and the first side of the second bit line pair is determined to be equal or larger than capacitance C.sub.A formed between the first side of the first bit line pair and the gate electrode. Since the potential of the first side of the bit line pair fluctuates roughly in phase with that of the second side of the same bit line pair, a harmful influence due to interference noise can be reduced, without increasing the chip layout area, by only modifying the shapes of the gate electrodes of the sense amplifier transistors.
摘要:
The semiconductor device comprises: an internal supply voltage deboosting circuit for inputting an external supply voltage, deboosting the inputted external supply voltage, and outputting a deboosted voltage as an internal supply voltage; a first control circuit for deactivating the internal supply voltage deboosting circuit when the external supply voltage is lower than a predetermined value; and a second control circuit for outputting the external supply voltage as the internal supply voltage when the external supply voltage is lower than the predetermined value. When the external supply voltage is lower than a predetermined value, since the internal supply voltage deboosting circuit is deactivated by the first control circuit, the current consumption can be reduced. Further, since the external supply voltage is outputted as the internal supply voltage by the second control circuit, the deboosting operation is not required. The device is usable for different external supply voltages in spite of the same circuit configuration, while preventing the operational margin from being deteriorated.
摘要:
According to one embodiment, a level shift circuit includes a plurality of level shift units which are connected to each other and in which the delay time of the rising edge of an output voltage is different from the delay time of the falling edge of the output voltage. The delay time of the rising edge of the output voltage from the previous level shift unit is compensated by the delay time of the falling edge of the output voltage from the next level shift unit, and the delay time of the falling edge of the output voltage from the previous level shift unit is compensated by the delay time of the rising edge of the output voltage from the next level shift unit.
摘要:
An output buffer circuit in accordance with an embodiment comprises a plurality of buffer circuits, each of the buffer circuits including a transistor operative to change an output signal of an output terminal in response to a change in an input signal, the output buffer circuit being configured to enable the plurality of buffer circuits to be driven selectively. Each of the plurality of buffer circuits includes a plurality of output transistors having respective current paths formed in parallel to one another between a fixed voltage terminal supplying a certain fixed voltage and an output terminal, and being selectively rendered in an operable state in accordance with a control signal provided from external. The plurality of output transistors included in each of the plurality of buffer circuits are formed having a certain size ratio.
摘要:
According to one embodiment, a semiconductor integrated circuit includes first and second level shift circuits. The first level shifter includes a plurality of transistors and is connected to a power source voltage supply node of a first power source system and to which a first signal of a second power source system and a level inversion signal of the first signal are input. The second level shifter includes a plurality of transistors and is connected to the power source voltage supply node of the first power source system and to which the level inversion signal of the first signal of the second power source system and an output signal of the first level shifter are input. The first and second level shifters have substantially the same circuit configuration and driving abilities of corresponding ones of the transistors in the first and second level shifters are substantially set equal.