-
公开(公告)号:US06373000B1
公开(公告)日:2002-04-16
申请号:US09735893
申请日:2000-12-14
申请人: Kei Nakamura , Masakazu Sugimoto , Yasushi Inoue , Megumu Nagasawa , Takuji Okeyui , Masayuki Kaneto , Shinya Ota
发明人: Kei Nakamura , Masakazu Sugimoto , Yasushi Inoue , Megumu Nagasawa , Takuji Okeyui , Masayuki Kaneto , Shinya Ota
IPC分类号: H01R2372
摘要: A double-sided circuit board of which a solder conductor is prevented from deformation in a cycling test so as to maintain high connection reliability, comprises an insulating layer 2 made of an organic high molecular weight resin and a circuit 3 provided on each side of the insulating layer 2, the circuits 3 on both sides being electrically connected through via-holes filled with a conductor 4 made of solder having a metal powder 6 dispersed therein.
-
公开(公告)号:US06333469B1
公开(公告)日:2001-12-25
申请号:US09353385
申请日:1999-07-15
IPC分类号: H05K116
CPC分类号: H01L24/94 , H01L23/3114 , H01L23/4985 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01061 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/15311 , H01L2924/00 , H01L2224/05599
摘要: A wafer-scale package structure in which a circuit board for rearranging electrode pads of a wafer is laminated on the wafer integrally. The circuit board can be divided into individual chip-size packages (CSPS) and which includes a layer of polyimide resin, and connection between the wafer and the circuit board is performed by solder bump, while the circuit board is stuck on the wafer with an adhesive.
摘要翻译: 一种晶片级封装结构,其中用于重新排列晶片的电极焊盘的电路板一体地层压在晶片上。 电路板可分为单个芯片尺寸封装(CSPS),其中包含一层聚酰亚胺树脂,晶圆与电路板之间的连接由焊锡凸块进行,而电路板则以 胶粘剂。
-
公开(公告)号:US06335076B1
公开(公告)日:2002-01-01
申请号:US09615761
申请日:2000-07-13
IPC分类号: B32B1508
CPC分类号: H05K3/462 , H05K3/4038 , H05K3/445 , H05K2201/0305 , H05K2201/09536 , Y10S428/901 , Y10T156/10 , Y10T428/24273 , Y10T428/24917 , Y10T428/266 , Y10T428/31681
摘要: A plurality of double-sided circuit boards 1 in which a circuit 4 is provided on either side of an insulating layer 3 comprising an organic high molecular resin with an alloy foil 2 as a basic substance, and two circuits 4 are electrically connected by a via with a soldered conductor 5a filled therein are laminated via an adhesive layer 6. The adhesive layer 6 has a bore opened at a predetermined position of a portion in direct contact with the circuits 4 of two double-sided circuit boards 1. A bore portion is provided with a soldered conductor 7. The circuits 4 of the two double-sided circuit boards 1 are electrically connected by the soldered conductor 7.
摘要翻译: 多个双面电路板1,其中电路4设置在包含有合成箔2作为基本物质的有机高分子树脂的绝缘层3的两侧,以及两个电路4通过通孔 其中填充有焊接导体5a通过粘合剂层6层压。粘合层6具有在与两个双面电路板1的电路4直接接触的部分的预定位置处开口的孔。孔部分 设置有焊接导体7.两个双面电路板1的电路4由焊接导体7电连接。
-
公开(公告)号:US06462282B1
公开(公告)日:2002-10-08
申请号:US09338659
申请日:1999-06-23
IPC分类号: H05K116
CPC分类号: H05K1/0271 , H01L23/3164 , H01L23/49816 , H01L2924/0002 , H05K3/3436 , H05K3/3452 , H05K2201/068 , H05K2201/10416 , H05K2201/10674 , H01L2924/00
摘要: A circuit board for mounting a bare chip in the form of a flip chip. A metallic foil for protecting circuits in a state insulated therefrom is arranged in an area where the bare chip is located.
摘要翻译: 用于以倒装芯片的形式安装裸芯片的电路板。 用于保护与绝缘的状态的电路的金属箔布置在裸芯片所在的区域中。
-
5.
公开(公告)号:US06310391B1
公开(公告)日:2001-10-30
申请号:US09334631
申请日:1999-06-17
IPC分类号: H01L23053
CPC分类号: H05K3/462 , H01L23/142 , H01L23/3677 , H01L23/5385 , H01L2224/16 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H05K1/0206 , H05K1/0207 , H05K3/28 , H05K3/4038 , H05K3/445 , H05K3/4623 , H05K3/4641 , H05K2201/0305 , H05K2201/068 , H05K2201/09536 , H05K2201/096 , H05K2201/10674 , H01L2924/00 , H01L2224/0401
摘要: The present invention provides a mounted structure of circuit board which can be prepared by a simple method and exhibits a good heat dissipation from chip and undergoes relaxed heat stress and a multi-layer circuit board to be incorporated in the mounted structure. A novel mounted structure of circuit board is provided comprising a core material embedded in an insulating layer, said core material having a metal layer with a heat conductivity of not less than 100 W/m·K provided on at least one side of an Ni—Fe alloy foil, said insulating layer comprising a wire conductor provided and a semiconductor element mounted on at least one side thereof, characterized in that a solder metal member for heat conduction is provided interposed between said semiconductor element and said core material so that said semiconductor element and said core material are connected to each other. The mounted structure of circuit board comprises a 6-layer circuit board 2 having a laminate of three sheets of double-sided circuit boards 1 and a chip 13 connected to a circuit 5 on the uppermost layer. The core material 3 embedded in the intraboard insulating layer 4 in various double-sided circuit board 1 comprises a copper layer 3a having a heat conductivity of 393 W/·K provided on at least one side of an Ni—Fe alloy foil 25. The chip 13 and the underlying core material 3 are connected to each other with a solder metal member 10. The core material 3 on the horizontally adjacent double-sided circuit boards 1 are similarly connected to each other with the solder metal member 10.
摘要翻译: 本发明提供了一种电路板的安装结构,其可以通过简单的方法制备,并且显示出来自芯片的良好散热并经受松弛的热应力,并且将多层电路板并入安装的结构中。 提供一种电路板的新型安装结构,其包括嵌入绝缘层中的芯材,所述芯材具有设置在Ni-Fe合金的至少一侧上的导热率不小于100W / mK的金属层 箔,所述绝缘层包括设置的导线导体和安装在其至少一侧上的半导体元件,其特征在于,设置用于导热的焊料金属构件插入在所述半导体元件和所述芯材之间,使得所述半导体元件和所述 芯材彼此连接。 电路板的安装结构包括具有三片双面电路板1和连接到最上层电路5的芯片13的叠层的6层电路板2。 在各种双面电路板1中嵌入在内部绝缘层4中的芯材3包括设置在Ni-Fe合金箔25的至少一侧上的导热率为393W / K.的铜层3a。 芯片13和下面的芯材3通过焊料金属部件10彼此连接。水平相邻的双面电路板1上的芯材3类似地用焊料金属部件10彼此连接。
-
公开(公告)号:US06258449B1
公开(公告)日:2001-07-10
申请号:US09328485
申请日:1999-06-09
IPC分类号: B32B300
CPC分类号: H01L23/5385 , H01L23/3735 , H01L23/5384 , H01L2924/0002 , H05K1/056 , H05K1/09 , H05K3/4614 , H05K3/462 , H05K3/4623 , H05K2201/0154 , H05K2201/0338 , H05K2201/09536 , Y10S428/901 , Y10T428/24917 , H01L2924/00
摘要: A low-thermal expansion circuit board comprising an insulating layer made of an organic polymer having thereon a wiring conductor for bare chip mounting, wherein the wiring conductor is an iron-nickel-based alloy layer having a copper layer on at least one side thereof; and a low-thermal expansion multilayer circuit board having a plurality of the low-thermal expansion circuit boards via an adhesive layer, the adhesive layer having through-holes filled with solder to connect the circuits layers.
摘要翻译: 一种低热膨胀电路板,包括由有机聚合物制成的绝缘层,其上具有用于裸芯片安装的布线导体,其中所述布线导体是在其至少一侧上具有铜层的铁镍基合金层; 以及通过粘合剂层具有多个低热膨胀电路板的低热膨胀多层电路板,所述粘合剂层具有填充有焊料的通孔,以连接电路层。
-
公开(公告)号:US20090017354A1
公开(公告)日:2009-01-15
申请号:US10595748
申请日:2004-11-15
申请人: Masaya Yano , Masakazu Sugimoto , Takuji Okeyui , Toshio Araki
发明人: Masaya Yano , Masakazu Sugimoto , Takuji Okeyui , Toshio Araki
CPC分类号: H01M8/0276 , H01M8/0206 , H01M8/023 , H01M8/026 , H01M8/0263 , H01M8/028 , H01M8/0286 , H01M2008/1095 , H01M2250/30 , Y02B90/18
摘要: The present invention relates to and provides a fuel cell in which sealing can be reliably made for each unit cell, thereby, enabling thinning, facilitating maintenance, and enabling miniaturization and weight reduction, and enabling free shape design. A fuel cell of the present invention is characterized by comprising a sheet-like solid polymer electrolyte 1 and a pair of electrode plates 2, 3 arranged on both sides of the solid polymer electrolyte 1, and further comprising a pair of metallic plates 4, 5 arranged on both sides of the electrode plates 2, 3, and provided flow path grooves 9, and inlets 4c, 5c and outlets communicating with the flow path grooves, wherein the peripheral edges of the metallic plates 4, 5 are mechanically sealed with an insulation material 6 interposed between the metallic plates.
摘要翻译: 本发明涉及并提供一种燃料电池,其中可以可靠地为每个单电池进行密封,从而能够进行减薄,便于维护,并且能够实现小型化和轻量化,并且能够实现自由形状设计。 本发明的燃料电池的特征在于包括片状固体聚合物电解质1和布置在固体聚合物电解质1两侧的一对电极板2,3,还包括一对金属板4,5 设置在电极板2,3的两侧,并且设置有流路槽9和与流路槽连通的入口4c,5c和出口,其中金属板4,5的周边边缘用绝缘体机械密封 介于金属板之间的材料6。
-
公开(公告)号:US07862954B2
公开(公告)日:2011-01-04
申请号:US10595748
申请日:2004-11-15
申请人: Masaya Yano , Masakazu Sugimoto , Takuji Okeyui , Toshio Araki
发明人: Masaya Yano , Masakazu Sugimoto , Takuji Okeyui , Toshio Araki
CPC分类号: H01M8/0276 , H01M8/0206 , H01M8/023 , H01M8/026 , H01M8/0263 , H01M8/028 , H01M8/0286 , H01M2008/1095 , H01M2250/30 , Y02B90/18
摘要: The present invention relates to and provides a fuel cell in which sealing can be reliably made for each unit cell, thereby, enabling thinning, facilitating maintenance, and enabling miniaturization and weight reduction, and enabling free shape design. A fuel cell of the present invention is characterized by comprising a sheet-like solid polymer electrolyte 1 and a pair of electrode plates 2, 3 arranged on both sides of the solid polymer electrolyte 1, and further comprising a pair of metallic plates 4, 5 arranged on both sides of the electrode plates 2, 3, and provided flow path grooves 9, and inlets 4c, 5c and outlets communicating with the flow path grooves, wherein the peripheral edges of the metallic plates 4, 5 are mechanically sealed with an insulation material 6 interposed between the metallic plates.
摘要翻译: 本发明涉及并提供一种燃料电池,其中可以可靠地为每个单电池进行密封,从而能够进行减薄,便于维护,并且能够实现小型化和轻量化,并且能够实现自由形状设计。 本发明的燃料电池的特征在于包括片状固体聚合物电解质1和布置在固体聚合物电解质1两侧的一对电极板2,3,还包括一对金属板4,5 设置在电极板2,3的两侧,并且设置有流路槽9和与流路槽连通的入口4c,5c和出口,其中金属板4,5的周边边缘用绝缘体机械密封 介于金属板之间的材料6。
-
公开(公告)号:US20080248338A1
公开(公告)日:2008-10-09
申请号:US11576677
申请日:2005-09-29
申请人: Masaya Yano , Masakazu Sugimoto , Taiichi Sugita , Takuji Okeyui
发明人: Masaya Yano , Masakazu Sugimoto , Taiichi Sugita , Takuji Okeyui
CPC分类号: H01M8/04089 , H01M8/0258 , H01M8/026 , H01M8/0271 , H01M8/04104 , H01M8/04231 , H01M8/241 , H01M8/2457 , H01M2008/1095
摘要: A fuel cell having a unit cell formed of a sheet-like solid polymer electrolyte, its cathode-side electrode plate, an anode-side electrode plate, an oxygen-containing gas supply unit for supplying an oxygen-containing gas to the cathode-side electrode plate, and a hydrogen gas flow path unit for supplying a hydrogen gas to the anode-side electrode plate, regarding the unit cell which is to be a final stage of hydrogen gas supply, a flow path sectional area of the hydrogen gas flow path unit is not more than 1% of an area of the anode-side electrode plate and, at the same time, a discharge control mechanism for discharging a gas at 0.02 to 4% by volume relative to a hydrogen gas supplied to the unit cell is provided at an outlet of the hydrogen gas flow path unit.
摘要翻译: 一种具有由片状固体高分子电解质形成的单体电池的燃料电池,其阴极侧电极板,阳极侧电极板,含氧气体供给到阴极侧的含氧气体供给单元 电极板和用于向阳极侧电极板供给氢气的氢气流路单元,关于作为氢气供给的最终阶段的单电池,氢气流路的流路截面积 单元不大于阳极侧电极板的面积的1%,同时,相对于提供给单电池的氢气以0.02〜4体积%排出气体的排放控制机构, 设置在氢气流路单元的出口处。
-
公开(公告)号:US6159586A
公开(公告)日:2000-12-12
申请号:US151520
申请日:1998-09-11
申请人: Yasushi Inoue , Masakazu Sugimoto
发明人: Yasushi Inoue , Masakazu Sugimoto
CPC分类号: H05K3/462 , H01L21/4857 , H01L23/49822 , H01L2924/0002 , H05K3/28 , H05K3/4038 , H05K3/445 , H05K3/4623 , H05K3/4641 , H05K2201/0305 , H05K2201/068 , H05K2201/09536 , Y10S428/901 , Y10T156/10 , Y10T428/24917 , H01L2924/00
摘要: The present invention relates to a multilayer wiring substrate for mounting a semiconductor chip, etc. The multilayer wiring substrate is comprised of a plurality of double-sided circuit substrates, each comprised of an organic high molecular weight insulating layer and wiring conductor. An adhesive is used for laminating the double-sided circuit substrates. A Ni--Fe based alloy foil or a titanium foil is embedded within the organic high molecular weight insulating layer.
摘要翻译: 本发明涉及一种用于安装半导体芯片等的多层布线基板。多层布线基板由多个双面电路基板构成,每个双面电路基板由有机高分子量绝缘层和布线导体构成。 粘合剂用于层压双面电路基板。 在有机高分子量绝缘层内嵌有Ni-Fe系合金箔或钛箔。
-
-
-
-
-
-
-
-
-