公开(公告)号：US06373000B1

公开(公告)日：2002-04-16

申请号：US09735893

申请日：2000-12-14

申请人： Kei Nakamura ,  Masakazu Sugimoto ,  Yasushi Inoue ,  Megumu Nagasawa ,  Takuji Okeyui ,  Masayuki Kaneto ,  Shinya Ota

发明人： Kei Nakamura ,  Masakazu Sugimoto ,  Yasushi Inoue ,  Megumu Nagasawa ,  Takuji Okeyui ,  Masayuki Kaneto ,  Shinya Ota

IPC分类号： H01R2372

摘要： A double-sided circuit board of which a solder conductor is prevented from deformation in a cycling test so as to maintain high connection reliability, comprises an insulating layer 2 made of an organic high molecular weight resin and a circuit 3 provided on each side of the insulating layer 2, the circuits 3 on both sides being electrically connected through via-holes filled with a conductor 4 made of solder having a metal powder 6 dispersed therein.

公开(公告)号：US06335076B1

公开(公告)日：2002-01-01

申请号：US09615761

申请日：2000-07-13

申请人： Kei Nakamura ,  Masakazu Sugimoto ,  Yasushi Inoue ,  Megumu Nagasawa ,  Takuji Okeyui

发明人： Kei Nakamura ,  Masakazu Sugimoto ,  Yasushi Inoue ,  Megumu Nagasawa ,  Takuji Okeyui

IPC分类号： B32B1508

CPC分类号： H05K3/462 ,  H05K3/4038 ,  H05K3/445 ,  H05K2201/0305 ,  H05K2201/09536 ,  Y10S428/901 ,  Y10T156/10 ,  Y10T428/24273 ,  Y10T428/24917 ,  Y10T428/266 ,  Y10T428/31681

摘要： A plurality of double-sided circuit boards 1 in which a circuit 4 is provided on either side of an insulating layer 3 comprising an organic high molecular resin with an alloy foil 2 as a basic substance, and two circuits 4 are electrically connected by a via with a soldered conductor 5a filled therein are laminated via an adhesive layer 6. The adhesive layer 6 has a bore opened at a predetermined position of a portion in direct contact with the circuits 4 of two double-sided circuit boards 1. A bore portion is provided with a soldered conductor 7. The circuits 4 of the two double-sided circuit boards 1 are electrically connected by the soldered conductor 7.

摘要翻译： 多个双面电路板1，其中电路4设置在包含有合成箔2作为基本物质的有机高分子树脂的绝缘层3的两侧，以及两个电路4通过通孔 其中填充有焊接导体5a通过粘合剂层6层压。粘合层6具有在与两个双面电路板1的电路4直接接触的部分的预定位置处开口的孔。孔部分 设置有焊接导体7.两个双面电路板1的电路4由焊接导体7电连接。

公开(公告)号：US06333469B1

公开(公告)日：2001-12-25

申请号：US09353385

申请日：1999-07-15

申请人： Yasushi Inoue ,  Masakazu Sugimoto ,  Megumu Nagasawa ,  Takuji Okeyui ,  Kei Nakamura

发明人： Yasushi Inoue ,  Masakazu Sugimoto ,  Megumu Nagasawa ,  Takuji Okeyui ,  Kei Nakamura

IPC分类号： H05K116

CPC分类号： H01L24/94 ,  H01L23/3114 ,  H01L23/4985 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01061 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/05599

摘要： A wafer-scale package structure in which a circuit board for rearranging electrode pads of a wafer is laminated on the wafer integrally. The circuit board can be divided into individual chip-size packages (CSPS) and which includes a layer of polyimide resin, and connection between the wafer and the circuit board is performed by solder bump, while the circuit board is stuck on the wafer with an adhesive.

摘要翻译： 一种晶片级封装结构，其中用于重新排列晶片的电极焊盘的电路板一体地层压在晶片上。 电路板可分为单个芯片尺寸封装（CSPS），其中包含一层聚酰亚胺树脂，晶圆与电路板之间的连接由焊锡凸块进行，而电路板则以 胶粘剂。

公开(公告)号：US07862954B2

公开(公告)日：2011-01-04

申请号：US10595748

申请日：2004-11-15

申请人： Masaya Yano ,  Masakazu Sugimoto ,  Takuji Okeyui ,  Toshio Araki

发明人： Masaya Yano ,  Masakazu Sugimoto ,  Takuji Okeyui ,  Toshio Araki

IPC分类号： H01M2/08 ,  H01M2/00 ,  H01M2/02

CPC分类号： H01M8/0276 ,  H01M8/0206 ,  H01M8/023 ,  H01M8/026 ,  H01M8/0263 ,  H01M8/028 ,  H01M8/0286 ,  H01M2008/1095 ,  H01M2250/30 ,  Y02B90/18

摘要： The present invention relates to and provides a fuel cell in which sealing can be reliably made for each unit cell, thereby, enabling thinning, facilitating maintenance, and enabling miniaturization and weight reduction, and enabling free shape design. A fuel cell of the present invention is characterized by comprising a sheet-like solid polymer electrolyte 1 and a pair of electrode plates 2, 3 arranged on both sides of the solid polymer electrolyte 1, and further comprising a pair of metallic plates 4, 5 arranged on both sides of the electrode plates 2, 3, and provided flow path grooves 9, and inlets 4c, 5c and outlets communicating with the flow path grooves, wherein the peripheral edges of the metallic plates 4, 5 are mechanically sealed with an insulation material 6 interposed between the metallic plates.

摘要翻译： 本发明涉及并提供一种燃料电池，其中可以可靠地为每个单电池进行密封，从而能够进行减薄，便于维护，并且能够实现小型化和轻量化，并且能够实现自由形状设计。 本发明的燃料电池的特征在于包括片状固体聚合物电解质1和布置在固体聚合物电解质1两侧的一对电极板2,3，还包括一对金属板4,5 设置在电极板2,3的两侧，并且设置有流路槽9和与流路槽连通的入口4c，5c和出口，其中金属板4,5的周边边缘用绝缘体机械密封 介于金属板之间的材料6。

公开(公告)号：US20080248338A1

公开(公告)日：2008-10-09

申请号：US11576677

申请日：2005-09-29

申请人： Masaya Yano ,  Masakazu Sugimoto ,  Taiichi Sugita ,  Takuji Okeyui

发明人： Masaya Yano ,  Masakazu Sugimoto ,  Taiichi Sugita ,  Takuji Okeyui

IPC分类号： H01M8/04 ,  H01M8/00

CPC分类号： H01M8/04089 ,  H01M8/0258 ,  H01M8/026 ,  H01M8/0271 ,  H01M8/04104 ,  H01M8/04231 ,  H01M8/241 ,  H01M8/2457 ,  H01M2008/1095

摘要： A fuel cell having a unit cell formed of a sheet-like solid polymer electrolyte, its cathode-side electrode plate, an anode-side electrode plate, an oxygen-containing gas supply unit for supplying an oxygen-containing gas to the cathode-side electrode plate, and a hydrogen gas flow path unit for supplying a hydrogen gas to the anode-side electrode plate, regarding the unit cell which is to be a final stage of hydrogen gas supply, a flow path sectional area of the hydrogen gas flow path unit is not more than 1% of an area of the anode-side electrode plate and, at the same time, a discharge control mechanism for discharging a gas at 0.02 to 4% by volume relative to a hydrogen gas supplied to the unit cell is provided at an outlet of the hydrogen gas flow path unit.

摘要翻译： 一种具有由片状固体高分子电解质形成的单体电池的燃料电池，其阴极侧电极板，阳极侧电极板，含氧气体供给到阴极侧的含氧气体供给单元 电极板和用于向阳极侧电极板供给氢气的氢气流路单元，关于作为氢气供给的最终阶段的单电池，氢气流路的流路截面积 单元不大于阳极侧电极板的面积的1％，同时，相对于提供给单电池的氢气以0.02〜4体积％排出气体的排放控制机构， 设置在氢气流路单元的出口处。

公开(公告)号：US20090017354A1

公开(公告)日：2009-01-15

申请号：US10595748

申请日：2004-11-15

申请人： Masaya Yano ,  Masakazu Sugimoto ,  Takuji Okeyui ,  Toshio Araki

发明人： Masaya Yano ,  Masakazu Sugimoto ,  Takuji Okeyui ,  Toshio Araki

IPC分类号： H01M8/02 ,  H01M8/10

CPC分类号： H01M8/0276 ,  H01M8/0206 ,  H01M8/023 ,  H01M8/026 ,  H01M8/0263 ,  H01M8/028 ,  H01M8/0286 ,  H01M2008/1095 ,  H01M2250/30 ,  Y02B90/18

摘要： The present invention relates to and provides a fuel cell in which sealing can be reliably made for each unit cell, thereby, enabling thinning, facilitating maintenance, and enabling miniaturization and weight reduction, and enabling free shape design. A fuel cell of the present invention is characterized by comprising a sheet-like solid polymer electrolyte 1 and a pair of electrode plates 2, 3 arranged on both sides of the solid polymer electrolyte 1, and further comprising a pair of metallic plates 4, 5 arranged on both sides of the electrode plates 2, 3, and provided flow path grooves 9, and inlets 4c, 5c and outlets communicating with the flow path grooves, wherein the peripheral edges of the metallic plates 4, 5 are mechanically sealed with an insulation material 6 interposed between the metallic plates.

摘要翻译： 本发明涉及并提供一种燃料电池，其中可以可靠地为每个单电池进行密封，从而能够进行减薄，便于维护，并且能够实现小型化和轻量化，并且能够实现自由形状设计。 本发明的燃料电池的特征在于包括片状固体聚合物电解质1和布置在固体聚合物电解质1两侧的一对电极板2,3，还包括一对金属板4,5 设置在电极板2,3的两侧，并且设置有流路槽9和与流路槽连通的入口4c，5c和出口，其中金属板4,5的周边边缘用绝缘体机械密封 介于金属板之间的材料6。

公开(公告)号：US07943427B2

公开(公告)日：2011-05-17

申请号：US11632131

申请日：2005-07-13

申请人： Chikao Ikenaga ,  Kentarou Seki ,  Kazuhito Hosokawa ,  Takuji Okeyui ,  Keisuke Yoshikawa ,  Kazuhiro Ikemura

发明人： Chikao Ikenaga ,  Kentarou Seki ,  Kazuhito Hosokawa ,  Takuji Okeyui ,  Keisuke Yoshikawa ,  Kazuhiro Ikemura

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  H01L21/4828 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85205 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/20752 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/20305 ,  H01L2924/00012

摘要： A substrate B for use in production of a semiconductor device is used, which substrate includes an adhesive sheet 50 having a base layer 51 and an adhesive layer 52, and a plurality of independently provided electrically conductive portions 20. A semiconductor element having electrodes 11 formed thereon is firmly fixed onto the substrate B, and upper portions of the plurality of electrically conductive portions 20 and the electrodes 11 of the semiconductor element 10 are electrically connected by using wires 30. The semiconductor element 10, wires 30 and electrically conductive portions 20 are sealed by using a sealing resin 40. Each of the electrically conductive portions 20 has overhanging portions 20a, and a side face 60a of the electrically conductive portion 20 is roughened, thus enhancing the joining strength between each electrically conductive portion 20 and the sealing resin 40.

摘要翻译： 使用用于制造半导体器件的基板B，该基板包括具有基底层51和粘合层52的粘合片50以及多个独立设置的导电部分20.具有形成电极11的半导体元件 其上牢固地固定在基板B上，并且多个导电部分20的上部和半导体元件10的电极11通过使用导线30电连接。半导体元件10，导线30和导电部分20是 通过使用密封树脂40密封。每个导电部分20具有突出部分20a，并且导电部分20的侧面60a被粗糙化，从而增强每个导电部分20和密封树脂40之间的接合强度 。

公开(公告)号：US20110031759A1

公开(公告)日：2011-02-10

申请号：US12805320

申请日：2010-07-26

申请人： Yoshiaki Mitsuoka ,  Takehiro Ui ,  Takuji Okeyui

发明人： Yoshiaki Mitsuoka ,  Takehiro Ui ,  Takuji Okeyui

IPC分类号： F03D9/00 ,  F03B3/12 ,  B21K3/04

CPC分类号： B29C44/18 ,  F03D1/0675 ,  F03D80/00 ,  F05B2240/30 ,  F05B2260/96 ,  Y02E10/721 ,  Y02P70/523 ,  Y10T29/49336

摘要： A foam filling material for wind power generator blades is obtained by forming a foam filling composition containing a polymer and a foaming agent into a given shape so as to be positioned in an interior space of a wind power generator blade, and is capable of filling the interior space of the wind power generator blade by foaming.

摘要翻译： 用于风力发电机叶片的泡沫填充材料通过将包含聚合物和发泡剂的泡沫填充组合物形成为给定形状以便定位在风力发电机叶片的内部空间中，并且能够填充 通过发泡风力发电机叶片的内部空间。

公开(公告)号：US07235888B2

公开(公告)日：2007-06-26

申请号：US11032290

申请日：2005-01-10

申请人： Kazuhito Hosokawa ,  Takuji Okeyui ,  Hirofumi Fujii ,  Yasuhiko Yamamoto

发明人： Kazuhito Hosokawa ,  Takuji Okeyui ,  Hirofumi Fujii ,  Yasuhiko Yamamoto

IPC分类号： H01L29/40 ,  H01L21/48

CPC分类号： H01L21/568 ,  H01L21/4832 ,  H01L23/3107 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00014 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/01027 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/20305 ,  H01L2924/00012

摘要： A series of semiconductor devices includes: (i) a plurality of semiconductor elements having electrodes; (ii) a plurality of electrically conductive parts formed around and electrically connected to each of the semiconductor elements; and (iii) a sealing resin in which the plurality of semiconductor elements and the plurality of electrically conductive parts are sealed and an electrode-free side of each semiconductor element and an unwired side of each electrically conductive part are formed on a single flat surface of a removable substrate.

摘要翻译： 一系列半导体器件包括：（i）具有电极的多个半导体元件; （ii）形成在每个所述半导体元件周围并电连接的多个导电部件; 和（iii）密封树脂，其中多个半导体元件和多个导电部件被密封，并且每个导电部件的每个半导体元件的无电极侧和未端部侧形成在单个平坦表面上 可拆卸基板。

公开(公告)号：US08018044B2

公开(公告)日：2011-09-13

申请号：US11632348

申请日：2005-07-13

申请人： Chikao Ikenaga ,  Kentarou Seki ,  Kazuhito Hosokawa ,  Takuji Okeyui ,  Keisuke Yoshikawa ,  Kazuhiro Ikemura

发明人： Chikao Ikenaga ,  Kentarou Seki ,  Kazuhito Hosokawa ,  Takuji Okeyui ,  Keisuke Yoshikawa ,  Kazuhiro Ikemura

IPC分类号： H01L23/48

CPC分类号： H01L21/568 ,  H01L21/4828 ,  H01L21/4832 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L23/62 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L2221/68377 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/838 ,  H01L2224/85001 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512

摘要： A semiconductor device P includes a die pad 20, a semiconductor element 30 which is loaded on the die pad 20, and a sealing resin 40. A plurality of electrically conductive portions 10 each having a layered structure including a metal foil 1 comprising copper or a copper alloy, and electrically conductive portion plating layers 2 provided at both upper and lower ends of the metal foil 1 are arranged around the die pad 20. The die pad 20 has a lower die pad plating layer 2b, and the semiconductor element 30 is loaded on the die pad 20 comprising such a die pad plating layer 2b. Electrodes 30a provided on the semiconductor element 30 are electrically connected with top ends of the electrically conductive portions 10 via wires 3, respectively. The lower electrically conductive portion plating layers 2 of the electrically conductive portions 10 and the die pad plating layer 2b of the die pad 20 are exposed outside from the sealing resin 40 on their back faces.

摘要翻译： 半导体器件P包括管芯焊盘20，负载在管芯焊盘20上的半导体元件30和密封树脂40.多个导电部分10，每个导电部分10具有包括铜或金属箔的金属箔1的层状结构 铜合金和设置在金属箔1的上端和下端的导电部分电镀层2布置在管芯焊盘20周围。管芯焊盘20具有下焊盘镀层2b，并且半导体元件30被加载 在包括这种裸片焊盘镀层2b的芯片焊盘20上。 设置在半导体元件30上的电极30a分别经由导线3与导电部10的顶端电连接。 导电部分10的下部导电部分电镀层2和芯片焊盘20的芯片焊盘镀层2b在其背面从密封树脂40的外部露出。