摘要:
A method for wiring a power supply for a large-scale integrated circuit. The power supply wires define a power supply grid surrounding lattice openings with fixed longitudinal and transverse lattice dimensions. The wire width is determined based on the integrated circuit chip size, the number of function circuits to be on the integrated circuit, the electrical power requirements of the function circuits, and the fixed longitudinal and transverse lattice dimensions. Longitudinal and transverse locations of the power supply wires chips are determined based on the determined wire width and the fixed longitudinal and transverse dimensions of the lattice openings. Alternatively, the wire width may be fixed and the dimensions of the lattice openings determined based on the integrated circuit chip size, the number of function circuits, the electrical power requirements of the function circuits and that wire width. When the electrical power requirement of a function circuit is significantly larger than that of another function circuit, the wire width may be increased in the vicinity of the one function circuit. When the function circuits include a large-scale function block, a wire width around a region of the integrated circuit chip in which the large-scale block is to be disposed may be selected which results in a wire area equal to the wire area of the power supply wire that would occupy the particular region for usual function circuits.
摘要:
A data processing apparatus, including a number of electronic circuit units, in which high-speed data can be transmitted among the electronic circuit units. When data is transmitted from one electronic circuit unit to another electronic circuit unit, a clock signal to fetch the data in the sink side electronic circuit unit is transmitted from the source side electronic circuit unit via a clock signal line having the same signal propagation delay characteristics as those of the data signal line.
摘要:
Multi-phase clock signals are delivered to a large number of load circuits scattered on a chip from clock signal input pins through at least three stage buffer circuits. The first stage buffer circuits are arranged in the neighborhood of the input pins, and the second stage buffer circuits are arranged on the central portion of the chip. Equivalent-length wirings are made between the successive two stage buffer circuits and the same number of subsequent stage buffer circuit are connected with each of certain stage buffer circuits for the respective phases so as to provide equal resistances and equal capacitances. Equivalent-length wirings are also made between final stage buffer circuits and the corresponding load circuits, and the same number of load circuits are connected with each final stage buffer circuit. Thus, equal delay times are provided in the clock signal paths from the input pins to the load circuits at the respective phases.
摘要:
A variable delay circuit including delay devices each having a plurality of delay units connected successively, only some of the delay units of the delay devices being connected to a signal transmission line, wherein a delay time is controlled by activating or inactivating the plurality of delay units according to control signals applied to control input terminals provided respectively for said plurality of delay units. A clock signal supply device for supplying a second clock signal to a logic circuit block, said clock signal supply device having a clock signal generator for generating a first clock signal and a reference signal and a phase adjusting means for adjusting the phase of the first clock signal phased on a phase difference between the first clock signal and the reference signal and outputting the phase-adjusted signal as a second clock signal, wherein the phase adjusting unit comprises a first variable delay circuit capable of delay operation in initial adjustment of the first clock signal, a second variable delay circuit, disposed in series with the first variable delay circuit, for performing the delay operation after the initial adjustment, and control circuits for controlling delay times of the first and second variable delay circuits.
摘要:
This invention discloses a clock distribution system which distributes a first clock signal as a reference clock as the reference for the phase and frequency to each processing unit (e.g. LSI) and generates a multi-phase second clock signal to be used in each processing unit by a delay circuit group whose delay time is adjusted. The clock distribution system comprises a clock generation block for generating a one-phase reference clock; a first control loop for comparing the phase of the reference clock with the phase of a feedback signal and adjusting the phase of the reference clock so that their phases are in agreement; and a second control loop including a delay circuit group consisting of a plurality of variable delay circuits to which the reference clock phase-adjusted by the first control loop is inputted and which are connected in series, and means for generating a multi-phase clock signal by use of the output signal of each of the plurality of variable delay circuits and the phase-adjusted referencde clock, controlling the delay time of the plurality of variable delay circuits so as to accomplish a predetermined relation with the period of the phase-adjusted reference clock and applying one of the multi-phase clock signals as the feedback signal described above to the first control loop.
摘要:
The present invention relates to a solid electrolytic capacitor having a masking structure in which the insulation between the anode part and the cathode part can be ensured without fail, to its production method, to a method for coating a masking agent on a solid electrolytic capacitor substrate, and to apparatus therefore. According to the present invention, the masking material covers the dielectric film on the metal material having valve action and sufficiently infiltrates into the core metal made of a metal having valve action while the solid electrolyte is masked by the masking material without fail, so that a solid electrolytic capacitor can be produced that has a reduced leakage current and a reduced stress generated at the reflow treatment or the like.
摘要:
The present invention relates to a solid electrolytic capacitor having a masking structure in which the insulation between the anode part and the cathode part can be ensured without fail, to its production method, to a method for coating a masking agent on a solid electrolytic capacitor substrate, and to apparatus therefore. According to the present invention, the masking material covers the dielectric film on the metal material having valve action and sufficiently infiltrates into the core metal made of a metal having valve action while the solid electrolyte is masked by the masking material without fail, so that a solid electrolytic capacitor can be produced that has a reduced leakage current and a reduced stress generated at the reflow treatment or the like.
摘要:
The present invention relates to an integrated circuit comprising a semiconductor chip having thereon a logical function portion for realizing logical function and at least one power supply point for supplying electric power to the logical function portion, and at least one first, second and third power trunk line are arranged on the chip for supplying electric power from the power supply point to the logical function portion. The second power trunk line is disposed in an area in which the logical function portion of the chip is disposed. The first power trunk line is disposed between the power supply point and the second power trunk line to connect the second power trunk line with the power supply point. The third trunk line is connected at at least one end to the second trunk line and is disposed in the logical function portion for supplying electric power to the logical function portion.
摘要:
The present invention relates to an apparatus for producing a comb-like capacitor element member including a guide member and a plurality of rectangular metal foil pieces bonded to the guide member, comprising an automatic feed mechanism for feeding tape-like metal foil by a constant length toward the guide member, a bonding mechanism for bonding the metal foil to the guide member, and a cutting mechanism for cutting the bonded metal foil. According to the apparatus of the present invention, a comb-like capacitor element member having a plurality of rectangular metal foil pieces bonded can be produced efficiently, by bonding the elongated tape-like metal foil without damaging it.
摘要:
The present invention relates to a solid electrolytic capacitor having a masking structure in which the insulation between the anode part and the cathode part can be ensured without fail, to its production method, to a method for coating a masking agent on a solid electrolytic capacitor substrate, and to an apparatus therefor. According to the present invention, the masking material covers the dielectric film on the metal material having valve action and sufficiently infiltrates into the core metal made of a metal having valve action while the solid electrolyte is masked by the masking material without fail, so that a solid electrolytic capacitor can be produced that has a reduced leakage current and a reduced stress generated at the reflow treatment or the like.