公开(公告)号：US20080258266A1

公开(公告)日：2008-10-23

申请号：US12029969

申请日：2008-02-12

申请人： Koji TAKEMURA ,  Hiroshige HIRANO ,  Yutaka ITOH ,  Hikari SANO ,  Koji KOIKE

发明人： Koji TAKEMURA ,  Hiroshige HIRANO ,  Yutaka ITOH ,  Hikari SANO ,  Koji KOIKE

IPC分类号： H01L23/00 ,  H01L21/71

CPC分类号： H01L23/585 ,  H01L23/562 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device includes: an interlayer insulating film formed on a substrate; a wiring formed in the interlayer insulating film in a chip region of the substrate; a seal ring formed in the interlayer insulating film in a periphery of the chip region and continuously surrounding the chip region; and a first protective film formed on the interlayer insulating film having the wiring and the seal ring formed therein. A first opening is formed in the first protective film in a region located outside the seal ring when viewed from the chip region, and the interlayer insulating film is exposed in the first opening.

摘要翻译： 半导体器件包括：形成在衬底上的层间绝缘膜; 在衬底的芯片区域中的层间绝缘膜中形成的布线; 密封环，形成在所述芯片区域的周围的所述层间绝缘膜中，并且连续地围绕所述芯片区域; 以及形成在其上形成有布线和密封环的层间绝缘膜上的第一保护膜。 当从芯片区域观察时，在位于密封环外侧的区域中的第一保护膜中形成第一开口，并且层间绝缘膜在第一开口中露出。

公开(公告)号：US20110147904A1

公开(公告)日：2011-06-23

申请号：US13037615

申请日：2011-03-01

申请人： Hikari SANO

发明人： Hikari SANO

IPC分类号： H01L23/58 ,  H01L21/50

CPC分类号： H01L31/0203 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/481 ,  H01L27/14618 ,  H01L27/14627 ,  H01L31/02327 ,  H01L2924/0002 ,  H01L2924/00

摘要： This invention provides a semiconductor device with increased moisture resistance. The semiconductor device includes: a semiconductor substrate; an optical element provided in a front surface of the semiconductor substrate; a light-transmissive substrate provided above the front surface of the semiconductor substrate; an adhesive layer provided between the front surface of the semiconductor substrate and a front surface of the light-transmissive substrate, and fixing the light-transmissive substrate to the semiconductor substrate; and an insulating film covering a lateral surface of said adhesive layer which is not in contact with the light-transmissive substrate and the semiconductor substrate.

摘要翻译： 本发明提供了具有增加的耐湿性的半导体器件。 半导体器件包括：半导体衬底; 设置在所述半导体衬底的前表面中的光学元件; 设置在所述半导体衬底的前表面上方的透光衬底; 设置在所述半导体衬底的前表面和所述透光衬底的前表面之间的粘合层，并将所述透光衬底固定到所述半导体衬底; 以及覆盖所述粘合剂层的不与所述透光性基板和所述半导体基板接触的侧面的绝缘膜。

公开(公告)号：US20110147782A1

公开(公告)日：2011-06-23

申请号：US13037626

申请日：2011-03-01

申请人： Hikari SANO ,  Takahiro NAKANO

发明人： Hikari SANO ,  Takahiro NAKANO

IPC分类号： H01L33/58 ,  H01L21/78

CPC分类号： H04N5/2254 ,  H01L21/76898 ,  H01L24/05 ,  H01L24/13 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14683 ,  H01L27/14687 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/94 ,  H01L2924/0002 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/014 ,  H01L2224/05552 ,  H01L2924/00

摘要： Provided is an optical device which has an increased rate of an area occupied by an effective optical region to an light-transmissive substrate and less noise due to reflection from a peripheral end face of the light-transmissive substrate. The optical device includes a semiconductor substrate in which a light-receiving element is formed and a light-transmissive substrate provided above the semiconductor substrate so as to cover the light-receiving element and fixed to the semiconductor substrate with an adhesive layer. The light-transmissive substrate has, in a peripheral end face, a curved surface which slopes so as to flare from an upper surface toward a lower surface.

摘要翻译： 提供了一种光学器件，其具有对透光性基板的有效光学区域占有的面积率的增加以及由于来自透光性基板的外周端面的反射而引起的噪声较小。 光学器件包括其中形成有光接收元件的半导体衬底和设置在半导体衬底上方以覆盖光接收元件并用粘合剂层固定到半导体衬底的透光衬底。 透光性基板在外周端面具有从上表面向下表面倾斜的曲面。

公开(公告)号：US20110169118A1

公开(公告)日：2011-07-14

申请号：US13004354

申请日：2011-01-11

申请人： Hikari SANO

发明人： Hikari SANO

IPC分类号： H01L31/0232 ,  H01L31/18

CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L2224/13

摘要： The present invention is has an object of providing an optical device miniaturized while maintaining bonding strength between a semiconductor substrate and a light-transmissive plate, reducing possibility of warpage, and maintaining yields and design flexibility, a method of manufacturing the optical device, and an electronic apparatus. The optical device according to the present invention includes a semiconductor substrate having one surface in which a light-receiving element is formed; and a light-transmissive plate provided above the semiconductor substrate so as to cover the light-receiving element. The semiconductor substrate and the light-transmissive plate are partially bonded above a light-receiving unit of the semiconductor substrate. The light-receiving element is formed in the light-receiving unit.

摘要翻译： 本发明的目的是提供一种小型化的光学装置，同时保持半导体基板和透光板之间的结合强度，降低翘曲的可能性，并且保持屈服和设计灵活性，制造光学装置的方法和 电子仪器 根据本发明的光学装置包括其中形成有光接收元件的一个表面的半导体衬底; 以及设置在半导体衬底上方以覆盖光接收元件的透光板。 半导体衬底和透光板部分地接合在半导体衬底的光接收单元的上方。 光接收元件形成在光接收单元中。

公开(公告)号：US20110147872A1

公开(公告)日：2011-06-23

申请号：US13037669

申请日：2011-03-01

申请人： Daisuke INOUE ,  Kyoko FUJII ,  Takahiro NAKANO ,  Hikari SANO

发明人： Daisuke INOUE ,  Kyoko FUJII ,  Takahiro NAKANO ,  Hikari SANO

IPC分类号： H01L31/0232 ,  H01L31/18

CPC分类号： G02B5/1842 ,  G02B5/1814 ,  G02B5/1876 ,  G02B27/4205 ,  G02B27/4272 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14685 ,  H01L2224/11

摘要： An optical device includes a semiconductor device, a light receiving part formed on the main surface of the semiconductor device, and a transparent board laminated above the main surface of the semiconductor device, with an adhesive material interposed between the transparent board and the main surface of the semiconductor device. A serrated part is formed on at least one of (i) the main surface that is of the transparent board and faces the semiconductor device and (ii) the back surface of the transparent board.

摘要翻译： 光学器件包括半导体器件，形成在半导体器件的主表面上的光接收部分和层叠在半导体器件的主表面上方的透明板，粘合剂材料插入在透明板和主体表面之间 半导体器件。 在（i）透明板的主表面和面向半导体器件的主表面和（ii）透明板的背面中的至少一个上形成锯齿形部分。

公开(公告)号：US20110147871A1

公开(公告)日：2011-06-23

申请号：US13036232

申请日：2011-02-28

申请人： Masaki UTSUMI ,  Takahiro NAKANO ,  Hikari SANO

发明人： Masaki UTSUMI ,  Takahiro NAKANO ,  Hikari SANO

IPC分类号： H01L31/0232 ,  H01L31/18

CPC分类号： H01L27/14625 ,  H01L21/561 ,  H01L23/3128 ,  H01L27/14618 ,  H01L27/14685 ,  H01L27/14687 ,  H01L2224/13

摘要： To provide a semiconductor device and a method of manufacturing the same, which have a device structure ensuring high degrees of reliability and mass-productivity at low cost.A semiconductor device includes: a substrate including an imaging area and having a first main surface and a second main surface; an electrode formed on the first main surface; an external electrode formed on the second main surface; a conductive portion which is formed in a through hole penetrating the substrate, and electrically connects the electrode and the external electrode; an optical element which is placed on the first main surface and has a convex surface including a convex portion; and a light transmitting element which is bonded to the optical element so as to cover the convex portion and has a flat upper surface.

摘要翻译： 提供一种以低成本确保高可靠性和大规模生产率的器件结构的半导体器件及其制造方法。 半导体器件包括：基板，包括成像区域并具有第一主表面和第二主表面; 形成在所述第一主表面上的电极; 形成在所述第二主表面上的外部电极; 导电部，形成在穿过所述基板的通孔中，并且电连接所述电极和所述外部电极; 光学元件，其放置在所述第一主表面上并且具有包括凸部的凸面; 以及透光元件，其结合到所述光学元件以覆盖所述凸部并且具有平坦的上表面。

公开(公告)号：US20090189276A1

公开(公告)日：2009-07-30

申请号：US12348543

申请日：2009-01-05

申请人： Hikari SANO ,  Yoshihiro Tomita ,  Takahiro Nakano

发明人： Hikari SANO ,  Yoshihiro Tomita ,  Takahiro Nakano

IPC分类号： H01L23/34

CPC分类号： H01L27/14618 ,  H01L23/3677 ,  H01L23/481 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14636 ,  H01L2224/02351 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05 ,  H01L2224/05548 ,  H01L2224/06181 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/014

摘要： A semiconductor chip, including: a substrate including an front surface; an integrated circuit formed on the front surface and including a plurality of semiconductor elements; and a heat-radiating plug formed in a region of the substrate corresponding to at least one of the semiconductor elements. The heat-radiating plug is made of a material having a thermal conductivity greater than that of the substrate formed in a non-penetrating hole having its opening on a reverse surface of the substrate.

摘要翻译： 一种半导体芯片，包括：包括前表面的基板; 形成在所述前表面上且包括多个半导体元件的集成电路; 以及形成在所述基板的与所述半导体元件中的至少一个相对应的区域中的散热塞。 散热塞由具有大于在其基板的背面上具有开口的非贯通孔中形成的基板的热导率的材料制成。