公开(公告)号：US20110147872A1

公开(公告)日：2011-06-23

申请号：US13037669

申请日：2011-03-01

申请人： Daisuke INOUE ,  Kyoko FUJII ,  Takahiro NAKANO ,  Hikari SANO

发明人： Daisuke INOUE ,  Kyoko FUJII ,  Takahiro NAKANO ,  Hikari SANO

IPC分类号： H01L31/0232 ,  H01L31/18

CPC分类号： G02B5/1842 ,  G02B5/1814 ,  G02B5/1876 ,  G02B27/4205 ,  G02B27/4272 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14685 ,  H01L2224/11

摘要： An optical device includes a semiconductor device, a light receiving part formed on the main surface of the semiconductor device, and a transparent board laminated above the main surface of the semiconductor device, with an adhesive material interposed between the transparent board and the main surface of the semiconductor device. A serrated part is formed on at least one of (i) the main surface that is of the transparent board and faces the semiconductor device and (ii) the back surface of the transparent board.

摘要翻译： 光学器件包括半导体器件，形成在半导体器件的主表面上的光接收部分和层叠在半导体器件的主表面上方的透明板，粘合剂材料插入在透明板和主体表面之间 半导体器件。 在（i）透明板的主表面和面向半导体器件的主表面和（ii）透明板的背面中的至少一个上形成锯齿形部分。

公开(公告)号：US20110147871A1

公开(公告)日：2011-06-23

申请号：US13036232

申请日：2011-02-28

申请人： Masaki UTSUMI ,  Takahiro NAKANO ,  Hikari SANO

发明人： Masaki UTSUMI ,  Takahiro NAKANO ,  Hikari SANO

IPC分类号： H01L31/0232 ,  H01L31/18

CPC分类号： H01L27/14625 ,  H01L21/561 ,  H01L23/3128 ,  H01L27/14618 ,  H01L27/14685 ,  H01L27/14687 ,  H01L2224/13

摘要： To provide a semiconductor device and a method of manufacturing the same, which have a device structure ensuring high degrees of reliability and mass-productivity at low cost.A semiconductor device includes: a substrate including an imaging area and having a first main surface and a second main surface; an electrode formed on the first main surface; an external electrode formed on the second main surface; a conductive portion which is formed in a through hole penetrating the substrate, and electrically connects the electrode and the external electrode; an optical element which is placed on the first main surface and has a convex surface including a convex portion; and a light transmitting element which is bonded to the optical element so as to cover the convex portion and has a flat upper surface.

摘要翻译： 提供一种以低成本确保高可靠性和大规模生产率的器件结构的半导体器件及其制造方法。 半导体器件包括：基板，包括成像区域并具有第一主表面和第二主表面; 形成在所述第一主表面上的电极; 形成在所述第二主表面上的外部电极; 导电部，形成在穿过所述基板的通孔中，并且电连接所述电极和所述外部电极; 光学元件，其放置在所述第一主表面上并且具有包括凸部的凸面; 以及透光元件，其结合到所述光学元件以覆盖所述凸部并且具有平坦的上表面。

公开(公告)号：US20110147782A1

公开(公告)日：2011-06-23

申请号：US13037626

申请日：2011-03-01

申请人： Hikari SANO ,  Takahiro NAKANO

发明人： Hikari SANO ,  Takahiro NAKANO

IPC分类号： H01L33/58 ,  H01L21/78

CPC分类号： H04N5/2254 ,  H01L21/76898 ,  H01L24/05 ,  H01L24/13 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14683 ,  H01L27/14687 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/94 ,  H01L2924/0002 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/014 ,  H01L2224/05552 ,  H01L2924/00

摘要： Provided is an optical device which has an increased rate of an area occupied by an effective optical region to an light-transmissive substrate and less noise due to reflection from a peripheral end face of the light-transmissive substrate. The optical device includes a semiconductor substrate in which a light-receiving element is formed and a light-transmissive substrate provided above the semiconductor substrate so as to cover the light-receiving element and fixed to the semiconductor substrate with an adhesive layer. The light-transmissive substrate has, in a peripheral end face, a curved surface which slopes so as to flare from an upper surface toward a lower surface.

摘要翻译： 提供了一种光学器件，其具有对透光性基板的有效光学区域占有的面积率的增加以及由于来自透光性基板的外周端面的反射而引起的噪声较小。 光学器件包括其中形成有光接收元件的半导体衬底和设置在半导体衬底上方以覆盖光接收元件并用粘合剂层固定到半导体衬底的透光衬底。 透光性基板在外周端面具有从上表面向下表面倾斜的曲面。

公开(公告)号：US20090211793A1

公开(公告)日：2009-08-27

申请号：US12330923

申请日：2008-12-09

申请人： Takahiro NAKANO ,  Masanori Minamio ,  Yoshihiro Tomita ,  Hikari Sano

发明人： Takahiro NAKANO ,  Masanori Minamio ,  Yoshihiro Tomita ,  Hikari Sano

IPC分类号： H05K1/18 ,  H05K3/02

CPC分类号： H01L27/14636 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L27/14618 ,  H01L2224/0231 ,  H01L2224/0233 ,  H01L2224/0401 ,  H01L2224/05001 ,  H01L2224/0554 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12043 ,  H01L2924/351 ,  H05K1/115 ,  H05K3/388 ,  H05K2201/09509 ,  Y10T29/49155 ,  H01L2924/00

摘要： In a substrate module of the present invention, a connection electrode is provided on a first surface of a substrate, and a first penetrating hole portion is running through the substrate in a thickness direction thereof so as to reach a reverse surface of the connection electrode, with a penetrating electrode being provided inside the first penetrating hole portion. The penetrating electrode defines a depression in a position opposing the reverse surface of the connection electrode, and an upper portion of the penetrating electrode is thicker than a side portion of the penetrating electrode. The penetrating electrode is present also on a second surface of the substrate, and is connected to a wiring electrode on the second surface.

摘要翻译： 在本发明的基板模块中，在基板的第一面上设置有连接电极，第一贯通孔部在其厚度方向上贯穿基板，从而到达连接电极的背面， 其中穿透电极设置在第一穿透孔部分的内部。 穿透电极在与连接电极的反面相对的位置形成凹部，并且穿透电极的上部比穿透电极的侧部更厚。 穿透电极也存在于基板的第二表面上，并且连接到第二表面上的布线电极。

公开(公告)号：US20120018820A1

公开(公告)日：2012-01-26

申请号：US13247226

申请日：2011-09-28

申请人： Masaki UTSUMI ,  Kyoko FUJII ,  Takahiro NAKANO

发明人： Masaki UTSUMI ,  Kyoko FUJII ,  Takahiro NAKANO

IPC分类号： H01L29/84

CPC分类号： H04R19/04 ,  B81B2201/0257 ,  B81C1/0023 ,  H01L23/055 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device includes a converter that converts an acoustic pressure into an electrical signal and an amplifier element that includes an amplifier circuit that amplifies the electrical signal outputted from the converter. The converter includes a pedestal including a cavity formed from an upper face to a lower face thereof, and a vibration film located so as to cover an opening of the cavity on the side of the upper face. The vibration film vibrates in accordance with the acoustic pressure to thereby convert the acoustic pressure into an electrical signal. The amplifier element is located under the converter so as to cover the cavity.

摘要翻译： 半导体器件包括将声压转换为电信号的转换器和包括放大从转换器输出的电信号的放大器电路的放大器元件。 该转换器包括：底座，其包括由上表面到下表面形成的空腔;以及振动膜，其位于上表面侧的空腔的开口上。 振动膜根据声压而振动，从而将声压转换为电信号。 放大器元件位于转换器下方以覆盖空腔。

公开(公告)号：US20180251331A1

公开(公告)日：2018-09-06

申请号：US15889877

申请日：2018-02-06

申请人： Takahiro NAKANO

发明人： Takahiro NAKANO

IPC分类号： B65H43/00 ,  B65H5/06 ,  B65H9/10 ,  B65H29/20

CPC分类号： B65H31/34 ,  B65H29/20 ,  B65H29/22 ,  B65H31/02 ,  B65H31/3027 ,  B65H31/36 ,  B65H43/00 ,  B65H43/04 ,  B65H43/06 ,  B65H2301/4212 ,  B65H2301/4213 ,  B65H2404/1521 ,  B65H2405/11151 ,  B65H2511/17 ,  B65H2511/214 ,  B65H2511/30 ,  B65H2513/10 ,  B65H2801/27 ,  B65H2220/01 ,  B65H2220/02 ,  B65H2220/11

摘要： A sheet processing apparatus includes a conveying roller that conveys a sheet, a processing tray on which the sheet from the conveying roller is loaded, a reference stopper provided at one end of the processing tray, a return paddle having an elastic piece for transferring the sheet from the conveying roller to the reference member, and a roller arm that moves the return paddle in the sheet thickness direction at a predetermined moving rate according to the number of sheets loaded on the processing tray. The moving rate of the roller arm is reduced as the number of sheets loaded on the processing tray is increased. With this configuration, aligning property of even a wavy sheet can be suppressed from being deteriorated at sheet loading.

公开(公告)号：US20150086298A1

公开(公告)日：2015-03-26

申请号：US14491399

申请日：2014-09-19

申请人： Kazuyuki KUBOTA ,  Eiji FUKASAWA ,  Ichitaro KUBOTA ,  Hideyuki KUBOTA ,  Hisashi OSADA ,  Takahiro NAKANO ,  Hiroyuki SORITA ,  Junya NAKAJIMA ,  Takuma KOBAYASHI ,  Takashi SAITO ,  Isao KONDO

发明人： Kazuyuki KUBOTA ,  Eiji FUKASAWA ,  Ichitaro KUBOTA ,  Hideyuki KUBOTA ,  Hisashi OSADA ,  Takahiro NAKANO ,  Hiroyuki SORITA ,  Junya NAKAJIMA ,  Takuma KOBAYASHI ,  Takashi SAITO ,  Isao KONDO

IPC分类号： B42B5/08 ,  B65H35/00

CPC分类号： B42B5/08 ,  B26F1/02 ,  B31F5/00 ,  B31F5/06 ,  B42C1/12 ,  B42F3/003 ,  B65H5/06 ,  B65H31/00 ,  B65H37/04 ,  B65H37/06 ,  B65H45/18 ,  B65H2301/4505 ,  B65H2301/51611 ,  B65H2701/18292 ,  B65H2801/27 ,  F16B15/0015 ,  G03G15/6544 ,  G03G15/6582 ,  G03G2215/00818 ,  G03G2215/00827 ,  G03G2215/00877

摘要： A sheet post-processing device includes a conveying section that conveys the paper sheet, a punch section that punches punch holes in the paper sheet conveyed by the conveying section, a stacker section that stores the paper sheet in which the punch holes are punched by the punch section, a stopper section that regulates a conveying direction leading end of the paper sheet stored in the stacker section; a binding section that binds the paper sheet bundle whose leading end is regulated by the stacker section, and a folding section that folds the paper sheet bundle bound by the binding section at a predetermined folding position. The punch section punches the punch holes at the front and rear of the folding position in the sheet conveying direction, and the binding section binds the paper sheet bundle with a paper-made staple by making the paper-made staple penetrate the punch holes. With this configuration, there can be provided a sheet-post processing device capable of easily generating a booklet for simple ring binding.

摘要翻译： 片材后处理装置包括输送纸张的输送部，冲压由输送部输送的纸张中的冲孔的冲压部，存放打孔孔的纸张的堆纸部， 冲压部，限制存储在堆垛部中的纸张的输送方向前端的止动部; 将前端由堆垛部调节的纸摞束缚的捆扎部，以及折叠部，其在预定的折叠位置折叠由捆扎部束缚的纸张束。 打孔部在纸张输送方向上在折叠位置的前后冲压打孔，并且装订部通过使造纸用钉穿过打孔而用纸制的订书钉装订纸张束。 利用这种结构，可以提供能够容易地生成用于简单环形装订的小册子的片后处理装置。

公开(公告)号：US20120004090A1

公开(公告)日：2012-01-05

申请号：US13168254

申请日：2011-06-24

申请人： Toshio SAKURAI ,  Tomohiro ARASHI ,  Hisashi KOBUKE ,  Takahiro NAKANO ,  Tomoko NAKAMURA ,  Yasuharu MIYAUCHI

发明人： Toshio SAKURAI ,  Tomohiro ARASHI ,  Hisashi KOBUKE ,  Takahiro NAKANO ,  Tomoko NAKAMURA ,  Yasuharu MIYAUCHI

IPC分类号： C03C14/00

CPC分类号： C04B35/20 ,  C04B2235/3203 ,  C04B2235/3208 ,  C04B2235/3217 ,  C04B2235/3232 ,  C04B2235/3284 ,  C04B2235/3409 ,  C04B2235/36 ,  C04B2235/77 ,  C04B2235/96 ,  H05K1/0306

摘要： Provided is a dielectric ceramic that includes a main component which contains Mg2SiO4 and additives which contain a zinc oxide and a glass component, in which, in X-ray diffraction. The peak intensity ratio, IB/IA, of the X-ray diffraction peak intensity IB of zinc oxide remaining unreacted, for which 2θ is between 31.0° and 32.0° and between 33.0° and 34.0°, with respect to the peak intensity IA of Mg2SiO4 as the main phase, for which 2θ is between 36.0° and 37.0°, is 10% or less. The dielectric ceramic has a relative density of 96% or greater.

摘要翻译： 提供一种电介质陶瓷，其包含含有Mg 2 SiO 4的主要成分和含有氧化锌和玻璃成分的添加剂，其中，在X射线衍射中。 氧化锌的X射线衍射峰强度IB的峰强度比IB / IA保持未反应，其中2℃; 相对于作为主相的Mg2SiO4的峰强度IA，在31.0°和32.0°之间，在33.0°和34.0°之间，其中为2θ; 在36.0°和37.0°之间，为10％以下。 介电陶瓷的相对密度为96％以上。

公开(公告)号：US20110289494A1

公开(公告)日：2011-11-24

申请号：US13195942

申请日：2011-08-02

申请人： Takahiro NAKANO ,  Masakuni Agetsuma

发明人： Takahiro NAKANO ,  Masakuni Agetsuma

IPC分类号： G06F9/44

CPC分类号： G06F11/203 ,  G06F8/65 ,  G06F11/1433 ,  G06F11/2035 ,  G06F11/2046

摘要： Provided is a computer system including a first server and a storage system. In the first server, a first virtual server and a second virtual server are operated. Upon reception of a request to boot the first virtual server, the second virtual server judges whether system software of the first virtual server, which is requested to be booted, matches system software of the first server in which the first virtual server is operated. In the case where the system software of the first virtual server and the system software of the first server do not match, the second virtual server updates the system software of the first virtual server before booting the first virtual server.

摘要翻译： 提供了包括第一服务器和存储系统的计算机系统。 在第一服务器中，操作第一虚拟服务器和第二虚拟服务器。 在接收到引导第一虚拟服务器的请求时，第二虚拟服务器判断被请求引导的第一虚拟服务器的系统软件是否匹配运行第一虚拟服务器的第一服务器的系统软件。 在第一虚拟服务器的系统软件和第一服务器的系统软件不匹配的情况下，第二虚拟服务器在引导第一虚拟服务器之前更新第一虚拟服务器的系统软件。

公开(公告)号：US20110242728A1

公开(公告)日：2011-10-06

申请号：US13025792

申请日：2011-02-11

申请人： Toshio SAKURAI ,  Hisashi KOBUKE ,  Tomohiro ARASHI ,  Takahiro NAKANO ,  Yasuharu MIYAUCHI

发明人： Toshio SAKURAI ,  Hisashi KOBUKE ,  Tomohiro ARASHI ,  Takahiro NAKANO ,  Yasuharu MIYAUCHI

IPC分类号： H01G4/06

CPC分类号： H05K1/0306 ,  H01G4/1209 ,  H01G4/20 ,  H01G4/30 ,  H01G4/33 ,  Y10T29/43

摘要： A ceramic electronic component includes a first dielectric layer, a second dielectric layer, and an intermediate layer. The first dielectric layer is a layer containing BaO, Nd2O3, and TiO2, the second dielectric layer is a layer containing a different material from the material of the first dielectric layer, and the intermediate layer is a layer formed between the first dielectric layer and the second dielectric layer and containing main components that are not contained in the first dielectric layer and the second dielectric layer in common as the main components.

摘要翻译： 陶瓷电子部件包括第一电介质层，第二电介质层和中间层。 第一电介质层是包含BaO，Nd 2 O 3和TiO 2的层，第二电介质层是包含与第一介电层的材料不同的材料的层，中间层是形成在第一介电层和 第二电介质层，并且包含不包含在第一电介质层和第二电介质层中的作为主要成分共同的主要成分。