公开(公告)号：US20030207073A1

公开(公告)日：2003-11-06

申请号：US10409400

申请日：2003-04-07

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Hiroaki Takezawa ,  Tsutomu Mitani ,  Minehiro Itagaki ,  Yoshihiro Bessho ,  Kazuo Eda

IPC: B32B005/12 ,  B32B009/00 ,  B05D005/10 ,  B05D001/36

CPC classification number: H05K3/321 ,  B32B7/02 ,  B32B7/12 ,  H05K2201/09909 ,  H05K2201/10636 ,  H05K2201/10984 ,  H05K2203/0783 ,  H05K2203/121 ,  Y02P70/611 ,  Y10S428/901 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T428/24066 ,  Y10T428/24917 ,  Y10T428/2495 ,  Y10T428/24975 ,  Y10T428/269 ,  Y10T428/31678 ,  Y10T428/31681

Abstract: In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.

公开(公告)号：US20010033032A1

公开(公告)日：2001-10-25

申请号：US09842487

申请日：2001-04-25

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Masahiro Ono ,  Tsukasa Shiraishi ,  Yoshihiro Bessho ,  Kazuo Eda

IPC: H01L023/52

CPC classification number: H01L24/85 ,  H01L24/11 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05572 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/78301 ,  H01L2224/81191 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A manufacturing method for a semiconductor device using a wire bonding method using a metal wire. In the wire bonding method, an impact load applied when a metal ball formed at the tip of the metal wire by electric discharge is brought into contact with a terminal electrode of a semiconductor device is smaller than a static load applied after the metal ball is brought into contact with the terminal electrode. The method makes it possible to prevent an element or wiring from being damaged while securing the pressure necessary for bonding the metal ball to the terminal electrode even when the terminal electrode is placed on the element or the wiring.

公开(公告)号：US20020034620A1

公开(公告)日：2002-03-21

申请号：US09965768

申请日：2001-09-27

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Hiroaki Takezawa ,  Tsutomu Mitani ,  Minehiro Itagaki ,  Yoshihiro Bessho ,  Kazuo Eda

IPC: B32B003/00

CPC classification number: H05K3/321 ,  B32B7/02 ,  B32B7/12 ,  H05K2201/09909 ,  H05K2201/10636 ,  H05K2201/10984 ,  H05K2203/0783 ,  H05K2203/121 ,  Y02P70/611 ,  Y10S428/901 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T428/24066 ,  Y10T428/24917 ,  Y10T428/2495 ,  Y10T428/24975 ,  Y10T428/269 ,  Y10T428/31678 ,  Y10T428/31681

Abstract: In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.

Abstract translation: 在包括通过导电粘合剂彼此电连接的第一电极和第二电极的安装结构中，至少一个电极和导电粘合剂之间的粘合部分的周边被电绝缘层覆盖，由此附着 部分从外围加强。 电绝缘层可以通过将导电粘合剂的粘合剂树脂组分溶解在溶剂中而形成。 这增加了导电粘合剂中的导电填料的浓度，从而也增强了粘合部分的导电性。