公开(公告)号：US20130085350A1

公开(公告)日：2013-04-04

申请号：US13250755

申请日：2011-09-30

申请人： Michael A. Schugt ,  Yanzhu Zhao

发明人： Michael A. Schugt ,  Yanzhu Zhao

IPC分类号： A61N1/08 ,  A61B5/07

CPC分类号： A61N1/37229 ,  A61B5/0031 ,  A61B5/0215 ,  A61B5/686 ,  A61B5/6876 ,  A61N1/37205 ,  A61N1/3754 ,  A61N1/3756

摘要： This disclosure describes antenna structures for use with implantable medical devices (IMDs). The IMD may include a housing that hermetically encloses electronic components of the IMD and a fixation mechanism that attaches the IMD to a target location within a patient, such as a wall of a vessel. The fixation mechanism may function as a radiating element of an antenna of the IMD. The fixation mechanism may be attached to a housing of the IMD with two different members. One member may be an anchoring structure that mechanically anchors the fixation mechanism to the housing. The second member may be a connector that electrically connects the fixation mechanism to the housing such that the fixation mechanism is configured to transmit and/or receive communication signals with other implantable or external devices.

摘要翻译： 本公开描述了与可植入医疗装置（IMD）一起使用的天线结构。 IMD可以包括密封地包围IMD的电子部件的壳体和将IMD附接到病人（例如血管壁）内的目标位置的固定机构。 固定机构可以用作IMD天线的辐射元件。 固定机构可以用两个不同的构件附接到IMD的壳体。 一个构件可以是将固定机构机械地锚定到壳体的锚固结构。 第二构件可以是将固定机构电连接到壳体的连接器，使得固定机构配置成与其他可植入或外部装置传输和/或接收通信信号。

公开(公告)号：US08939905B2

公开(公告)日：2015-01-27

申请号：US13250755

申请日：2011-09-30

申请人： Michael A. Schugt ,  Yanzhu Zhao

发明人： Michael A. Schugt ,  Yanzhu Zhao

IPC分类号： A61B5/07 ,  A61B5/0215 ,  A61N1/372 ,  A61B5/00 ,  A61N1/375

CPC分类号： A61N1/37229 ,  A61B5/0031 ,  A61B5/0215 ,  A61B5/686 ,  A61B5/6876 ,  A61N1/37205 ,  A61N1/3754 ,  A61N1/3756

摘要： This disclosure describes antenna structures for use with implantable medical devices (IMDs). The IMD may include a housing that hermetically encloses electronic components of the IMD and a fixation mechanism that attaches the IMD to a target location within a patient, such as a wall of a vessel. The fixation mechanism may function as a radiating element of an antenna of the IMD. The fixation mechanism may be attached to a housing of the IMD with two different members. One member may be an anchoring structure that mechanically anchors the fixation mechanism to the housing. The second member may be a connector that electrically connects the fixation mechanism to the housing such that the fixation mechanism is configured to transmit and/or receive communication signals with other implantable or external devices.

摘要翻译： 本公开描述了与可植入医疗装置（IMD）一起使用的天线结构。 IMD可以包括密封地包围IMD的电子部件的壳体和将IMD附接到病人（例如血管壁）内的目标位置的固定机构。 固定机构可以用作IMD天线的辐射元件。 固定机构可以用两个不同的构件附接到IMD的壳体。 一个构件可以是将固定机构机械地锚定到壳体的锚固结构。 第二构件可以是将固定机构电连接到壳体的连接器，使得固定机构配置成与其他可植入或外部装置传输和/或接收通信信号。

公开(公告)号：US20120029598A1

公开(公告)日：2012-02-02

申请号：US12847043

申请日：2010-07-30

申请人： Yanzhu Zhao

发明人： Yanzhu Zhao

IPC分类号： A61N1/08 ,  A61F2/82

CPC分类号： A61N1/37211 ,  A61B5/0031 ,  A61B5/0215 ,  A61B5/1122 ,  A61B5/6876 ,  A61B5/6882 ,  A61B2562/0219

摘要： This disclosure describes antenna structures for use in an implantable medical device. The implantable medical device may include a housing that hermetically encloses electronic components of the implantable medical device and a fixation mechanism that affixes the implantable medical device to a target location, such as a wall of a vessel. The fixation mechanism functions as a radiating element of an antenna of the implantable medical device. The housing of the implantable medical device may include a conductive loop that electrically couples to a telemetry module and magnetically couples to the fixation mechanism. The telemetry module may provide signals to be transmitted to the inner loop and those signals are magnetically coupled between the inner loop and the fixation mechanism, which radiates the signals.

摘要翻译： 本公开描述了用于可植入医疗装置的天线结构。 可植入医疗装置可以包括密封地封装可植入医疗装置的电子部件的壳体和将可植入医疗装置固定到诸如血管壁的目标位置的固定机构。 固定机构用作可植入医疗装置的天线的辐射元件。 可植入医疗装置的壳体可以包括电耦合到遥测模块并且磁耦合到固定机构的导电回路。 遥测模块可以提供要传输到内环的信号，并且这些信号被磁耦合在内环和固定机构之间，从而辐射信号。

公开(公告)号：US20100109966A1

公开(公告)日：2010-05-06

申请号：US12347597

申请日：2008-12-31

申请人： Duane N. Mateychuk ,  Joyce K. Yamamoto ,  Gerard J. Hill ,  Charles S. Farlow ,  Robert S. Wentink ,  Michael William Barror ,  Charles R. Gordon ,  Joachim Hossick-Schott ,  Yanzhu Zhao

发明人： Duane N. Mateychuk ,  Joyce K. Yamamoto ,  Gerard J. Hill ,  Charles S. Farlow ,  Robert S. Wentink ,  Michael William Barror ,  Charles R. Gordon ,  Joachim Hossick-Schott ,  Yanzhu Zhao

IPC分类号： H01Q1/38 ,  H01Q1/52 ,  B05D5/12

CPC分类号： A61N1/37229 ,  A61N1/3752 ,  H01Q1/38 ,  H01Q3/24 ,  H01Q9/42

摘要： An antenna for an implantable medical device (IMD) is provided including a monolithic structure derived from a plurality of discrete dielectric layers having an antenna embedded within the monolithic structure. Superstrate dielectric layers formed above the antenna may provide improved matching gradient with the surrounding environment to mitigate energy reflection effects. A outermost biocompatible layer is positioned over the superstrates as an interface with the surrounding environment. A shielding layer is positioned under the antenna to provide electromagnetic shielding for the IMD circuitry. Substrate dielectric layers formed below the antenna may possess higher dielectric values to allow the distance between the antenna and ground shielding layer to be minimized. An electromagnetic bandgap layer may be positioned between the antenna and the shielding layer. The dielectric layers may comprise layers of ceramic material that can be co-fired together with the antenna to form a hermetically sealed monolithic antenna structure.

摘要翻译： 提供了一种用于可植入医疗装置（IMD）的天线，其包括从具有嵌入整体结构内的天线的多个离散电介质层导出的单片结构。 形成在天线上方的上层电介质层可以提供与周围环境的改进的匹配梯度以减轻能量反射效应。 最外面的生物相容性层被定位在上层之上，作为与周围环境的界面。 屏蔽层位于天线下方，为IMD电路提供电磁屏蔽。 形成在天线下方的衬底电介质层可具有更高的介电值，以使天线和接地屏蔽层之间的距离最小化。 电磁带隙层可以位于天线和屏蔽层之间。 电介质层可以包括陶瓷材料层，其可与天线一起共烧以形成气密密封的单片天线结构。

公开(公告)号：US08620449B2

公开(公告)日：2013-12-31

申请号：US12841778

申请日：2010-07-22

申请人： Yanzhu Zhao ,  Quentin S Denzene

发明人： Yanzhu Zhao ,  Quentin S Denzene

IPC分类号： A61N1/00 ,  A61N1/08 ,  H01Q1/36

CPC分类号： A61N1/37229 ,  H01Q1/36 ,  H01Q9/42

摘要： This disclosure is directed to a three-dimensional antenna that may be used for an implantable medical device (IMD). The antenna includes a first antenna portion that includes a plurality of segments arranged substantially parallel to one another in a first plane. The antenna further includes a second antenna portion that includes a plurality of segments arranged substantially parallel to one another in a second plane that is substantially parallel to the first plane. The antenna further includes a third antenna portion that includes a plurality of segments arranged substantially parallel to one another in a third plane. The plurality of segments of the third portion are coupled between segments of the first and second portions. The third plane is arranged substantially perpendicular to the first plane and the second plane.

摘要翻译： 本公开涉及可用于可植入医疗装置（IMD）的三维天线。 天线包括第一天线部分，其包括在第一平面中彼此大致平行布置的多个段。 天线还包括第二天线部分，其包括在基本上平行于第一平面的第二平面中彼此大致平行地布置的多个段。 天线还包括第三天线部分，其包括在第三平面中彼此大致平行布置的多个段。 第三部分的多个段联接在第一和第二部分的段之间。 第三平面布置成基本上垂直于第一平面和第二平面。

公开(公告)号：US09333365B2

公开(公告)日：2016-05-10

申请号：US12847043

申请日：2010-07-30

申请人： Yanzhu Zhao

发明人： Yanzhu Zhao

IPC分类号： A61N1/08 ,  A61N1/372 ,  A61B5/00 ,  A61B5/0215 ,  A61B5/11

CPC分类号： A61N1/37211 ,  A61B5/0031 ,  A61B5/0215 ,  A61B5/1122 ,  A61B5/6876 ,  A61B5/6882 ,  A61B2562/0219

摘要： This disclosure describes antenna structures for use in an implantable medical device. The implantable medical device may include a housing that hermetically encloses electronic components of the implantable medical device and a fixation mechanism that affixes the implantable medical device to a target location, such as a wall of a vessel. The fixation mechanism functions as a radiating element of an antenna of the implantable medical device. The housing of the implantable medical device may include a conductive loop that electrically couples to a telemetry module and magnetically couples to the fixation mechanism. The telemetry module may provide signals to be transmitted to the inner loop and those signals are magnetically coupled between the inner loop and the fixation mechanism, which radiates the signals.

摘要翻译： 本公开描述了用于可植入医疗装置的天线结构。 可植入医疗装置可以包括密封地封装可植入医疗装置的电子部件的壳体和将可植入医疗装置固定到诸如血管壁的目标位置的固定机构。 固定机构用作可植入医疗装置的天线的辐射元件。 可植入医疗装置的壳体可以包括电耦合到遥测模块并且磁耦合到固定机构的导电回路。 遥测模块可以提供要传输到内环的信号，并且这些信号被磁耦合在内环和固定机构之间，从而辐射信号。

公开(公告)号：US09330820B2

公开(公告)日：2016-05-03

申请号：US13873961

申请日：2013-04-30

申请人： Mark G. Allen ,  Seong-O Choi ,  Jung-Hwan Pauk ,  Xiaosong Wu ,  Yanzhu Zhao ,  Yong-Kyu Yoon ,  Swaminathan Rajaraman

发明人： Mark G. Allen ,  Seong-O Choi ,  Jung-Hwan Pauk ,  Xiaosong Wu ,  Yanzhu Zhao ,  Yong-Kyu Yoon ,  Swaminathan Rajaraman

IPC分类号： H01B13/00 ,  A61B5/00 ,  A61M37/00 ,  H05K1/02 ,  C25D1/00 ,  C25D1/10 ,  C25D5/02 ,  A61N1/32 ,  H05K3/40 ,  H05K3/20

CPC分类号： B32B3/30 ,  A61B5/685 ,  A61B2562/125 ,  A61M37/0015 ,  A61M2037/0053 ,  A61N1/327 ,  C25D1/003 ,  C25D1/10 ,  C25D5/022 ,  H01B13/00 ,  H05K1/02 ,  H05K3/20 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2203/0113 ,  Y10T428/2958 ,  Y10T428/298

摘要： Methods are provided for fabricating three-dimensional electrically conductive structures. Three-dimensional electrically conductive microstructures are also provided. The method may include providing a mold having at least one microdepression which defines a three-dimensional structure; filling the microdepression of the mold with at least one substrate material; molding the at least one substrate material to form a substrate; and depositing and patterning of at least one electrically conductive layer either during the molding process or subsequent to the molding process to form an electrically conductive structure. In one embodiment, the three-dimensional electrically conductive microstructure comprises an electrically functional microneedle array comprising two or more microneedles, each including a high aspect ratio, polymeric three dimensional substrate structure which is at least substantially coated by an electrically conductive layer.

摘要翻译： 提供用于制造三维导电结构的方法。 还提供三维导电微结构。 该方法可以包括提供具有限定三维结构的至少一个微压缩的模具; 用至少一种基底材料填充模具的微压缩; 模制所述至少一种基底材料以形成基底; 以及在模制过程期间或在模制过程之后沉积和图案化至少一个导电层以形成导电结构。 在一个实施例中，三维导电微结构包括电功能微针阵列，其包括两个或更多个微针，每个微针包括高纵横比，至少基本上被导电层涂覆的聚合物三维衬底结构。

公开(公告)号：US20080063866A1

公开(公告)日：2008-03-13

申请号：US11754680

申请日：2007-05-29

申请人： Mark Allen ,  Seong-O Choi ,  Jung-Hwan Park ,  Xiaosong Wu ,  Yanzhu Zhao ,  Yong-Kyu Yoon ,  Swaminathan Rajaraman

发明人： Mark Allen ,  Seong-O Choi ,  Jung-Hwan Park ,  Xiaosong Wu ,  Yanzhu Zhao ,  Yong-Kyu Yoon ,  Swaminathan Rajaraman

IPC分类号： B32B3/30

CPC分类号： B32B3/30 ,  A61B5/685 ,  A61B2562/125 ,  A61M37/0015 ,  A61M2037/0053 ,  A61N1/327 ,  C25D1/003 ,  C25D1/10 ,  C25D5/022 ,  H01B13/00 ,  H05K1/02 ,  H05K3/20 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2203/0113 ,  Y10T428/2958 ,  Y10T428/298

摘要： Methods are provided for fabricating three-dimensional electrically conductive structures. Three-dimensional electrically conductive microstructures are also provided. The method may include providing a mold having at least one microdepression which defines a three-dimensional structure; filling the microdepression of the mold with at least one substrate material; molding the at least one substrate material to form a substrate; and depositing and patterning of at least one electrically conductive layer either during the molding process or subsequent to the molding process to form an electrically conductive structure. In one embodiment, the three-dimensional electrically conductive microstructure comprises an electrically functional microneedle array comprising two or more microneedles, each including a high aspect ratio, polymeric three dimensional substrate structure which is at least substantially coated by an electrically conductive layer.

摘要翻译： 提供用于制造三维导电结构的方法。 还提供三维导电微结构。 该方法可以包括提供具有限定三维结构的至少一个微压缩的模具; 用至少一种基底材料填充模具的微压; 模制所述至少一种基底材料以形成基底; 以及在模制过程期间或在模制过程之后沉积和图案化至少一个导电层以形成导电结构。 在一个实施例中，三维导电微结构包括电功能微针阵列，其包括两个或更多个微针，每个微针包括高纵横比，至少基本上被导电层涂覆的聚合物三维衬底结构。

公开(公告)号：US09610450B2

公开(公告)日：2017-04-04

申请号：US12847051

申请日：2010-07-30

申请人： Yanzhu Zhao

发明人： Yanzhu Zhao

IPC分类号： A61B5/07 ,  A61B5/02 ,  A61N1/372 ,  A61B5/00 ,  A61N1/375

CPC分类号： A61N1/3727 ,  A61B5/0031 ,  A61N1/37229 ,  A61N1/375

摘要： An antenna structure, for use in an implantable medical device, may include an inner portion that is magnetically coupled to an outer portion. In one example, the inner and outer portions include conductive loops. In accordance with the techniques of this disclosure, a capacitive sensor is electrically coupled to one of the conductive loops of the antenna of the implantable medical device. As the capacitance of the capacitive sensor changes as a function of the sensed parameter, an impedance of the antenna varies with the output of the capacitive sensor. This variation in impedance of the antenna modulates a carrier signal with the measured parameter. In other words, the measured parameter is modulated onto the carrier signal as a change in amplitude caused by variation in impedance of antenna during radiation/transmission.

公开(公告)号：US20130306356A1

公开(公告)日：2013-11-21

申请号：US13873961

申请日：2013-04-30

申请人： Mark G. Allen ,  Seong-O Choi ,  Jung-Hwan Pauk ,  Xiaosong Wu ,  Yanzhu Zhao ,  Yong-Kyu Yoon ,  Swaminathan Rajaraman

发明人： Mark G. Allen ,  Seong-O Choi ,  Jung-Hwan Pauk ,  Xiaosong Wu ,  Yanzhu Zhao ,  Yong-Kyu Yoon ,  Swaminathan Rajaraman

IPC分类号： H01B13/00 ,  H05K1/02

CPC分类号： B32B3/30 ,  A61B5/685 ,  A61B2562/125 ,  A61M37/0015 ,  A61M2037/0053 ,  A61N1/327 ,  C25D1/003 ,  C25D1/10 ,  C25D5/022 ,  H01B13/00 ,  H05K1/02 ,  H05K3/20 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2203/0113 ,  Y10T428/2958 ,  Y10T428/298

摘要： Methods are provided for fabricating three-dimensional electrically conductive structures. Three-dimensional electrically conductive microstructures are also provided. The method may include providing a mold having at least one microdepression which defines a three-dimensional structure; filling the microdepression of the mold with at least one substrate material; molding the at least one substrate material to form a substrate; and depositing and patterning of at least one electrically conductive layer either during the molding process or subsequent to the molding process to form an electrically conductive structure. In one embodiment, the three-dimensional electrically conductive microstructure comprises an electrically functional microneedle array comprising two or more microneedles, each including a high aspect ratio, polymeric three dimensional substrate structure which is at least substantially coated by an electrically conductive layer.

摘要翻译： 提供用于制造三维导电结构的方法。 还提供三维导电微结构。 该方法可以包括提供具有限定三维结构的至少一个微压缩的模具; 用至少一种基底材料填充模具的微压; 模制所述至少一种基底材料以形成基底; 以及在模制过程期间或在模制过程之后沉积和图案化至少一个导电层以形成导电结构。 在一个实施例中，三维导电微结构包括电功能微针阵列，其包括两个或更多个微针，每个微针包括高纵横比，至少基本上被导电层涂覆的聚合物三维衬底结构。