摘要:
An apparatus usable with an object having surfaces, for examining the states of the surfaces, includes on irradiating system for irradiating the surfaces of the object with a single light beam, and a plurality of light-receiving systems provided in association with the surfaces of the object, respectively, the plural light-receiving systems being arranged to receive light scatteringly reflected from the surfaces of the object, respectively, and to produce outputs corresponding to the states of the surfaces of the object, respectively.
摘要:
An apparatus usable with an object having a surface with a pattern, for examining the state of the surface, includes a projecting system for directing a light beam to the surface of the object, and a collecting system for collecting scattered light from the surface of the object. A projection of the optical axis of the collecting system onto the surface of the object extends in a direction different from a projection onto the surface of the object of a major portion of light diffracted from the pattern. A light-receiving unit receives the scattered light as collected by the collecting system and for producing an output corresponding to the state of the surface of the object.
摘要:
An apparatus usable with an object having surfaces, for examining the states of the surfaces, includes on irradiating system for irradiating the surfaces of the object with a single light beam, and a plurality of light-receiving systems provided in association with the surfaces of the object, respectively, the plural light-receiving systems being arranged to receive light scatteringly reflected from the surfaces of the object, respectively, and to produce outputs corresponding to the states of the surfaces of the object, respectively.
摘要:
First and second piezoelectric transducers 2 and 3 are fixed to a tubular main body 1 via first and second fitting bases 4 and 5. On front and rear surfaces of an end portion of each of the first and second piezoelectric transducers 2 and 3 are provided first and second electrodes 6 and 7. When the tubular main body 1 is secured to a circuit box, each of the end portions of the first and second piezoelectric transducers 2 and 3 is inserted between first and second contact members provided on the circuit box such that the first and second electrodes 6 and 7 are electrically connected to the first and second contact members, respectively to connect the first and second piezoelectric transducers 2 and 3 to the circuit box by one touch operation.
摘要:
A fabricating method for a system including a plurality of processing apparatuses connected to each other by an inter-apparatus transporter. The semiconductor waters are processed in the processing apparatuses and are transported to specified processing apparatuses in different time interval that are set to N times a unit time interval. Since the fabricating system includes processing apparatuses and an inter-apparatus transporter that are periodically controlled at time intervals related to a unit time, intervals related to a unit time, the scheduling of a plurality of works can be made efficiently to enhance the level of optimization, thus improving the productivity.
摘要:
A wafer transport method includes the steps of preparing a semiconductor process equipment having a transport chamber and a process chamber. An interface means connects the transport chamber to the process chamber. A transport means transports a semiconductor wafer from the transport chamber to the process chamber by way of the interface means. The transport means mounting a substrate is inserted into a communicating corridor including a supply means and an exhaust means. The substrate is transported while performing the supply and exhaust by sequentially controlling a supply shutoff means, an exhaust shutoff means, and a communicating shutoff means according to the position of a conductance part formed of a gap between the transport means and the communicating corridor. Thus, the substrate is transported at a high throughput without contamination of the substrate while keeping the different atmospheric conditions for the transport chamber and the process chamber, thereby manufacturing a semiconductor device with high performance capabilities.
摘要:
A manufacturing technique is disclosed for producing a semiconductor integrated circuit device having plural layers of buried wirings, and such that there is prevented the occurrence of a discontinuity caused by stress migration at an interface between a plug connected at a bottom thereof to a buried wiring and the buried wiring. For example, in the case where the width of a first Cu wiring is not smaller than about 0.9 μm and is smaller than about 1.44 μm, and the width of a second Cu wiring and the diameter of a plug are about 0.18 μm, there are arranged two or more plugs which connect the first wirings and the second Cu wirings electrically with each other.
摘要:
A fabricating method for a system that includes a plurality of processing apparatuses connected to each other by an inter-apparatus transporter and a computer storing managing information of processing and transporting of semiconductor wafers. The processing apparatuses have an interface for loading and unloading a plurality of the semiconductor wafers that are contained in a carrier. The semiconductor waters are processed in processing chambers of the processing apparatuses and the result of processing is monitored. In the processing, a first carrier containing the plurality of the semiconductor wafers having been processed in the first processing apparatus is transported toward the second processing apparatus by the inter-apparatus transporter prior to unloading of a second carrier containing semiconductor wafers processed in the second processing apparatus, according to the managing information.
摘要:
A fabricating method for a system that includes a plurality of processing apparatuses connected to each other by an inter-apparatus transporter and a computer storing managing information of processing and transporting of semiconductor wafers. The processing apparatuses have an interface for loading and unloading a plurality of the semiconductor wafers that are contained in a carrier. The semiconductor waters are processed in processing chambers of the processing apparatuses and the result of processing is monitored. In the processing, a first carrier containing the plurality of the semiconductor wafers having been processed in the first processing apparatus is transported toward the second processing apparatus by the inter-apparatus transporter prior to unloading of a second carrier containing semiconductor wafers processed in the second processing apparatus, according to the managing information.
摘要:
An exposure apparatus for printing, by exposure, a pattern of an original onto a substrate includes a housing tightly filled with a predetermined ambience and for accommodating therein at least a portion of an exposure light optical axis, and a detection system having an optical system, wherein a portion of a light path of the detection system is disposed in a first space enclosed by the housing, and wherein at least another portion of the detection system including an electrical element thereof is disposed in a second space outside the housing.