HIGH-VOLTAGE ELECTRICAL SWITCH BY SERIES CONNECTED SEMICONDUCTOR SWITCHES
    1.
    发明申请
    HIGH-VOLTAGE ELECTRICAL SWITCH BY SERIES CONNECTED SEMICONDUCTOR SWITCHES 有权
    高压电气开关系列连接半导体开关

    公开(公告)号:US20140184309A1

    公开(公告)日:2014-07-03

    申请号:US13731184

    申请日:2012-12-31

    Applicant: NXP B.V.

    CPC classification number: H03K17/689 H03K17/102

    Abstract: A high voltage electrical switch including: a plurality of series connected semiconductor switches; a plurality of rectifiers wherein each rectifier is connected to a semiconductor switch control input of one of the semiconductor switches; a radio frequency signal generator; and a plurality of galvanic isolators, wherein each galvanic isolator connects the radio frequency signal generator to one of the plurality of rectifiers, wherein the plurality of semiconductor switches are isolated from one another.

    Abstract translation: 一种高压电开关,包括:多个串联连接的半导体开关; 多个整流器,其中每个整流器连接到半导体开关之一的半导体开关控制输入端; 射频信号发生器; 以及多个电流隔离器,其中每个电流隔离器将所述射频信号发生器连接到所述多个整流器中的一个,其中所述多个半导体开关彼此隔离。

    Haptic feedback and capacitive sensing in a transparent touch screen display

    公开(公告)号:US09904366B2

    公开(公告)日:2018-02-27

    申请号:US14459501

    申请日:2014-08-14

    Applicant: NXP B.V.

    Abstract: Consistent with an example embodiment, a user (touch screen) interface has haptic feedback. The user interface comprises, a substrate, a transparent bottom electrode on top of the substrate, a transparent wrinkling layer on top of the transparent bottom electrode, a transparent top electrode on top of the transparent wrinkling layer; and a transparent protective surface on top of the transparent top electrode. The transparent wrinkling layer changes from a smooth surface to a roughened surface upon application of a voltage between the top electrode and the bottom electrode; the voltage generates an electrostatic force mutually attracting the top and bottom electrodes to exert a compressive force upon the transparent wrinkling layer sufficient to generate a degree of surface wrinkling that is perceptible to the touch.

    HAPTIC FEEDBACK AND CAPACITIVE SENSING IN A TRANSPARENT TOUCH SCREEN DISPLAY
    3.
    发明申请
    HAPTIC FEEDBACK AND CAPACITIVE SENSING IN A TRANSPARENT TOUCH SCREEN DISPLAY 有权
    快速反馈和电容感应在透明触摸屏显示

    公开(公告)号:US20160048207A1

    公开(公告)日:2016-02-18

    申请号:US14459501

    申请日:2014-08-14

    Applicant: NXP B.V.

    Abstract: Consistent with an example embodiment, a user (touch screen) interface has haptic feedback. The user interface comprises, a substrate, a transparent bottom electrode on top of the substrate, a transparent wrinkling layer on top of the transparent bottom electrode, a transparent top electrode on top of the transparent wrinkling layer; and a transparent protective surface on top of the transparent top electrode. The transparent wrinkling layer changes from a smooth surface to a roughened surface upon application of a voltage between the top electrode and the bottom electrode; the voltage generates an electrostatic force mutually attracting the top and bottom electrodes to exert a compressive force upon the transparent wrinkling layer sufficient to generate a degree of surface wrinkling that is perceptible to the touch.

    Abstract translation: 与示例性实施例一致,用户(触摸屏)界面具有触觉反馈。 用户接口包括:基板,在基板顶部的透明底部电极,透明底部电极顶部的透明起皱层,透明起皱层顶部的透明顶部电极; 和透明顶部电极顶部的透明保护表面。 在顶部电极和底部电极之间施加电压时,透明起皱层从光滑表面变成粗糙表面; 电压产生相互吸引顶部和底部电极的静电力,以对透明起皱层施加足够的压缩力,以产生可触觉的一定程度的表面起皱。

    Integrated circuits separated by through-wafer trench isolation
    4.
    发明授权
    Integrated circuits separated by through-wafer trench isolation 有权
    通过晶圆沟槽隔离分离的集成电路

    公开(公告)号:US09177852B2

    公开(公告)日:2015-11-03

    申请号:US14449522

    申请日:2014-08-01

    Applicant: NXP B.V.

    CPC classification number: H01L21/76232 H01L21/76224 H01L21/823878

    Abstract: An isolated semiconductor circuit comprising: a first sub-circuit and a second sub-circuit; a backend that includes an electrically isolating connector between the first and second sub-circuits; a lateral isolating trench between the semiconductor portions of the first and second sub-circuits, wherein the lateral isolating trench extends along the width of the semiconductor portions of the first and second sub-circuits, wherein one end of the isolating trench is adjacent the backend, and wherein the isolating trench is filled with an electrically isolating material.

    Abstract translation: 一种隔离半导体电路,包括:第一子电路和第二子电路; 后端,其包括在所述第一和第二子电路之间的电隔离连接器; 在所述第一和第二子电路的半导体部分之间的横向隔离沟槽,其中所述横向隔离沟槽沿着所述第一和第二子电路的半导体部分的宽度延伸,其中所述隔离沟槽的一端与所述后端 ,并且其中所述隔离沟槽填充有电绝缘材料。

    INTERFACE FOR COMMUNICATION BETWEEN VOLTAGE DOMAINS
    5.
    发明申请
    INTERFACE FOR COMMUNICATION BETWEEN VOLTAGE DOMAINS 有权
    电压域之间的通信接口

    公开(公告)号:US20150187503A1

    公开(公告)日:2015-07-02

    申请号:US14657978

    申请日:2015-03-13

    Applicant: NXP B.V.

    Abstract: In one or more embodiments, circuitry is provided for isolation and communication of signals between circuits operating in different voltage domains using capacitive coupling. The capacitive coupling is provided by one or more capacitive structures having a breakdown voltage that is defined by way of the various components and their spacing. The capacitive structures each include three capacitive plates arranged to have two plates located in an upper layer and one plate located in a lower layer. A communication signal can be transmitted via the capacitive coupling created between the lower plate and each of the upper plates, respectively.

    Abstract translation: 在一个或多个实施例中,电路被提供用于使用电容耦合来在工作在不同电压域的电路之间进行信号的隔离和通信。 电容耦合由具有通过各种部件及其间隔限定的击穿电压的一个或多个电容结构提供。 电容结构各自包括布置成具有位于上层中的两个板和位于下层中的一个板的三个电容板。 可以通过分别在下板和每个上板之间产生的电容耦合来传输通信信号。

    Semiconductor Device and Associated Method
    6.
    发明申请
    Semiconductor Device and Associated Method 审中-公开
    半导体器件及相关方法

    公开(公告)号:US20150179735A1

    公开(公告)日:2015-06-25

    申请号:US14575001

    申请日:2014-12-18

    Applicant: NXP B.V.

    Abstract: The invention relates to a semiconductor device and an associated method for fabricating the semiconductor device. The device comprises: a substrate having a contact surface and a back surface separated by a total distance; a vertical device formed in the substrate and having first and second terminals on the contact surface; an isolation trench extending the total distance through the substrate between the contact surface and the back surface to electrically isolate the vertical device; and a terminal separation trench extending from the contact surface into the substrate and arranged to separate and define an electrical conduction path between the first and second terminals of the vertical device.

    Abstract translation: 本发明涉及一种用于制造半导体器件的半导体器件和相关方法。 该装置包括:具有接触面和分离总距离的背面的基板; 垂直装置,其形成在所述基板中,并且在所述接触表面上具有第一和第二端子; 隔离沟槽,其在接触表面和背面之间延伸通过衬底的总距离,以电隔离垂直装置; 以及从所述接触表面延伸到所述衬底中并且被布置成分离并限定所述垂直装置的所述第一和第二端子之间的导电路径的端子分离沟槽。

    Integrated circuits separated by through-wafer trench isolation
    7.
    发明授权
    Integrated circuits separated by through-wafer trench isolation 有权
    通过晶圆沟槽隔离分离的集成电路

    公开(公告)号:US08853816B2

    公开(公告)日:2014-10-07

    申请号:US13705627

    申请日:2012-12-05

    Applicant: NXP B.V.

    CPC classification number: H01L21/76232 H01L21/76224 H01L21/823878

    Abstract: An isolated semiconductor circuit comprising: a first sub-circuit and a second sub-circuit; a backend that includes an electrically isolating connector between the first and second sub-circuits; a lateral isolating trench between the semiconductor portions of the first and second sub-circuits, wherein the lateral isolating trench extends along the width of the semiconductor portions of the first and second sub-circuits, wherein one end of the isolating trench is adjacent the backend, and wherein the isolating trench is filled with an electrically isolating material.

    Abstract translation: 一种隔离半导体电路,包括:第一子电路和第二子电路; 后端,其包括在所述第一和第二子电路之间的电隔离连接器; 在所述第一和第二子电路的半导体部分之间的横向隔离沟槽,其中所述横向隔离沟槽沿着所述第一和第二子电路的半导体部分的宽度延伸,其中所述隔离沟槽的一端与所述后端 ,并且其中所述隔离沟槽填充有电绝缘材料。

    Sensor controlled transistor protection
    9.
    发明授权
    Sensor controlled transistor protection 有权
    传感器控制晶体管保护

    公开(公告)号:US09368958B2

    公开(公告)日:2016-06-14

    申请号:US14045611

    申请日:2013-10-03

    Applicant: NXP B.V.

    Abstract: A circuit for protecting a transistor is disclosed. The circuit includes a temperature sensing device coupled to the transistor and a tunable clamping circuit connected between transistor terminals, wherein the tunable clamping circuit is configured to provide an adjustable clamping voltage. A temperature controller coupled to the temperature sensing device and the tunable clamping circuit is also included. The temperature controller is configured to trigger a change in a clamping voltage of the tunable clamping circuit based on a feedback from the temperature sensing device.

    Abstract translation: 公开了一种用于保护晶体管的电路。 电路包括耦合到晶体管的温度感测装置和连接在晶体管端子之间的可调谐钳位电路,其中可调谐钳位电路被配置为提供可调整的钳位电压。 还包括耦合到温度感测装置和可调谐钳位电路的温度控制器。 温度控制器被配置为基于来自温度感测装置的反馈来触发可调谐钳位电路的钳位电压的变化。

    High-voltage electrical switch by series connected semiconductor switches
    10.
    发明授权
    High-voltage electrical switch by series connected semiconductor switches 有权
    高压电开关串联连接半导体开关

    公开(公告)号:US08816725B2

    公开(公告)日:2014-08-26

    申请号:US13731184

    申请日:2012-12-31

    Applicant: NXP B.V.

    CPC classification number: H03K17/689 H03K17/102

    Abstract: A high voltage electrical switch including: a plurality of series connected semiconductor switches; a plurality of rectifiers wherein each rectifier is connected to a semiconductor switch control input of one of the semiconductor switches; a radio frequency signal generator; and a plurality of galvanic isolators, wherein each galvanic isolator connects the radio frequency signal generator to one of the plurality of rectifiers, wherein the plurality of semiconductor switches are isolated from one another.

    Abstract translation: 一种高压电开关,包括:多个串联连接的半导体开关; 多个整流器,其中每个整流器连接到半导体开关之一的半导体开关控制输入端; 射频信号发生器; 以及多个电流隔离器,其中每个电流隔离器将所述射频信号发生器连接到所述多个整流器中的一个,其中所述多个半导体开关彼此隔离。

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