Compact three-way Doherty amplifier module

    公开(公告)号:US11050388B2

    公开(公告)日:2021-06-29

    申请号:US16563728

    申请日:2019-09-06

    Applicant: NXP USA, INC.

    Abstract: Embodiments of a method and a device are disclosed. In an embodiment, a Doherty amplifier module includes a substrate including a mounting surface, and further includes a first amplifier die, a second amplifier die, and a third amplifier die on the mounting surface. The first amplifier die is configured to amplify a first radio frequency (RF) signal along a first signal path, the second amplifier die is configured to amplify a second RF signal along a second signal path, and the third amplifier die is configured to amplify a third RF signal along a third signal path. A side of the first amplifier die including a first output terminal faces a side of the second amplifier die including a second output terminal. The second signal path is parallel to the first signal path, and the third signal path is orthogonal to the first and second signal paths.

    Systems and methods for fast switching time division duplex operation of power amplifiers

    公开(公告)号:US10742173B2

    公开(公告)日:2020-08-11

    申请号:US16139671

    申请日:2018-09-24

    Applicant: NXP USA, Inc.

    Abstract: Power amplifiers, amplifier systems, and related methods are disclosed herein. In one example embodiment, the amplifier system includes a bias controller that enables fast switching between an on state bias voltage and an off state bias voltage for the power amplifier. The bias controller can transition a low impedance switch to an on state to electrically couple a first electrode of a charge holding capacitor to an input of the power amplifier. The charge holding capacitor can be pre charged with the on state bias voltage to quickly provide the on state bias voltage to the power amplifier. The bias controller can also transition the low impedance switch to an off state to couple the input of the power amplifier to the off state bias voltage.

    Amplifier device with harmonic termination circuit

    公开(公告)号:US10587226B2

    公开(公告)日:2020-03-10

    申请号:US15926937

    申请日:2018-03-20

    Applicant: NXP USA, Inc.

    Abstract: An amplifier device includes an input terminal, an output terminal, a first transistor having a control terminal and first and second current-carrying terminals, and a class-J circuit coupled between the second current-carrying terminal of the first transistor and the output terminal and configured to harmonically terminate the first transistor. The class-J circuit may include a first resonator, characterized by a first resonant frequency substantially equal to a second harmonic frequency. The first resonator may be coupled between the second current-carrying terminal and a voltage reference. A shunt inductor that is distinct from the first resonator may be coupled between the second current-carrying terminal and the voltage reference.

    Multiple-stage Doherty power amplifiers implemented with multiple semiconductor technologies

    公开(公告)号:US12224713B2

    公开(公告)日:2025-02-11

    申请号:US17360821

    申请日:2021-06-28

    Applicant: NXP USA, Inc.

    Abstract: A device includes an integrated circuit (IC) die. The IC die includes a silicon germanium (SiGe) substrate, a first RF signal input terminal, a first RF signal output terminal, a first amplification path between the first RF signal input terminal and the first RF signal output terminal, a second RF signal input terminal, a second RF signal output terminal, and a second amplification path between the second RF signal input terminal and the second RF signal output terminal. The device includes a first power transistor die including a first input terminal electrically connected to the first RF signal output terminal and a second power transistor die including a second input terminal electrically connected to the second RF signal output terminal. The first amplification path can include two heterojunction bipolar transistors (HBTs) connected in a cascode configuration and the second amplification path can include two HBTs connected in a cascode configuration.

    TEMPERATURE COMPENSATION CIRCUIT AND TEMPERATURE COMPENSATED AMPLIFIER CIRCUIT

    公开(公告)号:US20210036663A1

    公开(公告)日:2021-02-04

    申请号:US16528536

    申请日:2019-07-31

    Applicant: NXP USA, Inc.

    Abstract: Embodiments of a temperature compensation circuit and a temperature compensated amplifier circuit are disclosed. In an embodiment, a temperature compensation circuit includes a bias reference circuit having serially connected transistor devices and a driver transistor device connected to the bias reference circuit. At least one of the serially connected transistor devices includes a resistor connected between two terminals of the at least one of the serially connected transistor devices. The driver transistor device is configured to generate a drive current based on a resistance value of the resistor.

    SYSTEMS AND METHODS FOR AUTOMATICALLY BIASING POWER AMPLIFIERS

    公开(公告)号:US20200099345A1

    公开(公告)日:2020-03-26

    申请号:US16139761

    申请日:2018-09-24

    Applicant: NXP USA, Inc.

    Abstract: Power amplifiers, amplifier systems, and related methods are disclosed herein. In one example embodiment, the amplifier system includes a bias controller that automatically sets a bias voltage of a power amplifier device by monitoring a reference device that is in a scaled relationship with the power amplifier device, and integrally is formed with the power amplifier device on a same semiconductor die. The bias controller can compare a voltage at an input to the reference device to a reference voltage, and then adjust a voltage at a control input of the reference device to a stabilized voltage that induces the reference device to drive the voltage at the input to the reference device equal to the reference voltage. Finally, the bias controller can transform, based on the scaled relationship, the stabilized voltage into a bias voltage applied to a control input of the power amplifier device.

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