公开(公告)号：US10468317B2

公开(公告)日：2019-11-05

申请号：US16047873

申请日：2018-07-27

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Stefan Groetsch ,  Joerg Erich Sorg ,  Christoph Koller

IPC: H01L23/14 ,  H01L29/866 ,  H01L31/02 ,  H01L31/024 ,  H01L33/48 ,  H01L33/62 ,  H01L33/64 ,  H05K1/02 ,  H05K1/05 ,  H01L23/60 ,  H01L23/00 ,  H01L25/16

Abstract: Electronic component with a support comprising a first inorganic insulating layer and a second inorganic insulating layer, between which a metal core is arranged, a first, a second and a third electrically conductive structure which are arranged on a top surface of the carrier, a first and a second electrical contact point and a thermal contact point, which are arranged on a bottom surface of the carrier, a component and an electrical protection element which are arranged on the side of the top surface of the carrier, in which the first electrically conductive structure is electrically conductively connected to the first electrical contact point, the second electrically conductive structure is electrically conductively connected to the second electrical contact point, the third electrically conductive structure is electrically conductively connected to the thermal contact point, the component is electrically conductively connected to the first and second electrically conductive structures, the electrical protection element is electrically conductively connected to the third electrically conductive structure and the first or second electrically conductive structure.

公开(公告)号：US20190051788A1

公开(公告)日：2019-02-14

申请号：US16079020

申请日：2017-05-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Frank Singer ,  Alexander Linkov ,  Stefan Illek ,  Rainer Butendeich ,  Christoph Koller ,  Thomas Schwarz

IPC: H01L31/167 ,  H01L25/13 ,  H01L31/0232 ,  H01L31/02 ,  H01L25/16

Abstract: A light source is disclosed. In an embodiment a light source includes at least one first semiconductor emitter for generating first light, at least one second semiconductor emitter for generating second light, the second light having a different color than the first light, a light mixing body configured to produce a mixed light from the first and second lights and a detector on the light mixing body, the detector configured to determine a color locus of the mixed light, wherein the first and second semiconductor emitters are arranged along a line and have different distances from the detector, wherein the light mixing body is arranged on side surfaces of the first and second semiconductor emitters and in projection onto the side surfaces at least partially covers each of the side surfaces, so that the detector receives light from each of the first and second semiconductor emitters through the light mixing body.

公开(公告)号：US20160276545A1

公开(公告)日：2016-09-22

申请号：US15033157

申请日：2014-10-16

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Johannes Mueller ,  Christoph Koller ,  Thomas Schwarz ,  Frank Singer

IPC: H01L33/48 ,  H01L33/00 ,  H01L33/60 ,  H01L33/54 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L24/24 ,  H01L33/005 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: In various embodiments, a method for producing an electronic component is provided. The method includes applying an adhesive layer to a carrier, initially curing the adhesive layer applied to the carrier, providing a chip, wherein the chip has a substrate and a layer sequence arranged on the substrate, laying the chip onto the initially cured adhesive layer by way of a top side of the layer sequence, embedding the chip into a shaped body, wherein the top side of the layer sequence and a first side of the shaped body lie substantially in a plane, separating the embedded chip from the adhesive layer and the carrier, and applying an electrically conductive structure to the first side of the shaped body, the shaped body forming a vertical electrical insulation between the electrically conductive structure and the substrate.

Abstract translation: 在各种实施例中，提供了一种用于制造电子部件的方法。 该方法包括将粘合剂层施加到载体上，最初固化施加到载体上的粘合剂层，提供芯片，其中芯片具有衬底和布置在衬底上的层序列，将芯片铺设在初始固化的粘合剂层上 层序列的顶侧的方式，将芯片嵌入成形体中，其中层序列的顶侧和成形体的第一侧基本上位于平面中，将嵌入的芯片与粘合剂层分离，并且 载体，并且将导电结构施加到成形体的第一侧，成形体在导电结构和基板之间形成垂直的电绝缘。