公开(公告)号：US20150223346A1

公开(公告)日：2015-08-06

申请号：US14415676

申请日：2013-08-01

Applicant: OSRAM SYLVANIA INC.

Inventor： Jeffery Serre ,  Alan Lenef ,  Adam Scotch

IPC: H05K3/34 ,  B23K3/06 ,  B23K1/00 ,  B23K1/20 ,  H05K1/11 ,  H05K13/04

CPC classification number: H05K3/3431 ,  B23K1/0016 ,  B23K1/20 ,  B23K3/0684 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/95 ,  H01L24/97 ,  H01L33/62 ,  H01L2224/29082 ,  H01L2224/29105 ,  H01L2224/29113 ,  H01L2224/325 ,  H01L2224/83143 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83815 ,  H01L2224/83907 ,  H01L2224/9205 ,  H01L2224/95085 ,  H01L2224/95101 ,  H01L2224/95146 ,  H01L2224/97 ,  H01L2924/01322 ,  H05K1/111 ,  H05K3/3468 ,  H05K13/0465 ,  H05K2201/10992 ,  H05K2203/044 ,  H05K2203/047 ,  H05K2203/048 ,  H01L2924/00012 ,  H01L2924/0105

Abstract: A dual solder layer for fluidic self assembly, an electrical component substrate, and method employing same is described. The dual solder layer comprises a layer of a self-assembly solder disposed on a layer of a base solder which is disposed on the solder pad of an electrical component substrate. The self-assembly solder has a liquidus temperature less than a first temperature and the base solder has a solidus temperature greater than the first temperature. The self-assembly solder liquefies at the first temperature during a fluidic self assembly method to cause electrical components to adhere to the substrate. After attachment, the substrate is removed from the bath and heated so that the base solder and self-assembly solder combine to form a composite alloy which forms the final electrical solder connection between the component and the solder pad on the substrate.

Abstract translation: 描述了用于流体自组装的双焊料层，电组件衬底和使用其的方法。 双焊料层包括设置在基底焊料层上的自组装焊料层，其设置在电组件衬底的焊盘上。 自组装焊料具有低于第一温度的液相线温度，并且基底焊料的固相线温度大于第一温度。 在流体自组装方法期间，自组装焊料在第一温度下液化，以使电组件粘附到衬底上。 附着后，将衬底从浴中取出并加热，使得基底焊料和自组装焊料组合形成复合合金，其形成组件和衬底上的焊盘之间的最终电焊接连接。

公开(公告)号：US20160334552A1

公开(公告)日：2016-11-17

申请号：US15112487

申请日：2015-01-26

Applicant: OSRAM SYLVANIA INC.

Inventor： Alan Lenef ,  James Avallon ,  Adam Scotch

IPC: G02B5/08 ,  H01L33/60 ,  C04B37/02 ,  C09K11/77 ,  C09K11/08 ,  H01L33/50 ,  G02B7/18

CPC classification number: G02B5/0858 ,  C04B37/026 ,  C04B2237/062 ,  C04B2237/121 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/407 ,  C04B2237/708 ,  C04B2237/72 ,  C09K11/0883 ,  C09K11/7734 ,  C09K11/7774 ,  G02B7/1815 ,  H01L33/505 ,  H01L33/60

Abstract: There is herein described a ceramic wavelength converter having a high reflectivity reflector. The ceramic wavelength converter is capable of converting a primary light into a secondary light and the reflector comprises a reflective metal layer and a dielectric buffer layer between the ceramic wavelength converter and the reflective metal layer. The buffer layer is non-absorbing with respect to the secondary light and has an index of refraction that is less than an index of refraction of the ceramic wavelength converter. Preferably the reflectivity of the reflector is at least 80%, more preferably at least 85% and even more preferably at least 95% with respect to the secondary light emitted by the converter.

Abstract translation: 这里描述了具有高反射率反射器的陶瓷波长转换器。 陶瓷波长转换器能够将一次光转换成二次光，反射器包括反射金属层和陶瓷波长转换器与反射金属层之间的介质缓冲层。 缓冲层相对于次级光不吸收，并且具有小于陶瓷波长转换器的折射率的折射率。 优选地，反射器的反射率相对于由转换器发射的次级光是至少80％，更优选至少85％，甚至更优选至少95％。

公开(公告)号：US10039194B2

公开(公告)日：2018-07-31

申请号：US14415676

申请日：2013-08-01

Applicant: OSRAM SYLVANIA Inc.

Inventor： Jeffery Serre ,  Alan Lenef ,  Adam Scotch

IPC: H05K3/34 ,  B23K3/06 ,  B23K1/00 ,  B23K1/20 ,  H05K1/11 ,  H05K13/04 ,  H01L23/00 ,  H01L33/62

CPC classification number: H05K3/3431 ,  B23K1/0016 ,  B23K1/20 ,  B23K3/0684 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/95 ,  H01L24/97 ,  H01L33/62 ,  H01L2224/29082 ,  H01L2224/29105 ,  H01L2224/29113 ,  H01L2224/325 ,  H01L2224/83143 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83815 ,  H01L2224/83907 ,  H01L2224/9205 ,  H01L2224/95085 ,  H01L2224/95101 ,  H01L2224/95146 ,  H01L2224/97 ,  H01L2924/01322 ,  H05K1/111 ,  H05K3/3468 ,  H05K13/0465 ,  H05K2201/10992 ,  H05K2203/044 ,  H05K2203/047 ,  H05K2203/048 ,  H01L2924/00012 ,  H01L2924/0105

Abstract: A dual solder layer for fluidic self assembly, an electrical component substrate, and method employing same is described. The dual solder layer comprises a layer of a self-assembly solder disposed on a layer of a base solder which is disposed on the solder pad of an electrical component substrate. The self-assembly solder has a liquidus temperature less than a first temperature and the base solder has a solidus temperature greater than the first temperature. The self-assembly solder liquefies at the first temperature during a fluidic self assembly method to cause electrical components to adhere to the substrate. After attachment, the substrate is removed from the bath and heated so that the base solder and self-assembly solder combine to form a composite alloy which forms the final electrical solder connection between the component and the solder pad on the substrate.