公开(公告)号：US11961833B2

公开(公告)日：2024-04-16

申请号：US17702702

申请日：2022-03-23

Applicant: Richtek Technology Corporation

Inventor： Kuo-Chin Chiu ,  Chien-Wei Chiu

IPC: H01L27/02 ,  H01L21/8234 ,  H01L21/761

CPC classification number: H01L27/0255 ,  H01L21/823481 ,  H01L27/0288 ,  H01L21/761

Abstract: A high voltage device is used as a lower switch in a power stage of a switching regulator. The high voltage device includes at least one lateral diffused metal oxide semiconductor (LDMOS) device, a first isolation region, a second isolation region, a third isolation region, and a current limiting device. The first isolation region is located in a semiconductor layer, and encloses the LDMOS device. The second isolation region has a first conductivity type, and encloses the first isolation region in the semiconductor layer. The third isolation region has a second conductivity type, and encloses the second isolation region in the semiconductor layer. The current limiting device is electrically connected to the second isolation region, and is configured to operably suppress a parasitic silicon controlled rectifier (SCR) from being turned on.

公开(公告)号：US20220336441A1

公开(公告)日：2022-10-20

申请号：US17702702

申请日：2022-03-23

Applicant: Richtek Technology Corporation

Inventor： Kuo-Chin Chiu ,  Chien-Wei Chiu

IPC: H01L27/02 ,  H01L21/8234

Abstract: A high voltage device is used as a lower switch in a power stage of a switching regulator. The high voltage device includes at least one lateral diffused metal oxide semiconductor (LDMOS) device, a first isolation region, a second isolation region, a third isolation region, and a current limiting device. The first isolation region is located in a semiconductor layer, and encloses the LDMOS device. The second isolation region has a first conductivity type, and encloses the first isolation region in the semiconductor layer. The third isolation region has a second conductivity type, and encloses the second isolation region in the semiconductor layer. The current limiting device is electrically connected to the second isolation region, and is configured to operably suppress a parasitic silicon controlled rectifier (SCR) from being turned on.

公开(公告)号：US09048732B2

公开(公告)日：2015-06-02

申请号：US14294789

申请日：2014-06-03

Applicant: Richtek Technology Corporation

Inventor： Yi-Wei Lee ,  Chih-Feng Huang ,  Kuo-Chin Chiu

IPC: H02M7/217 ,  H02M7/537 ,  H01L29/808 ,  H02M7/00 ,  H01L29/06

CPC classification number: H02M7/217 ,  H01L29/0692 ,  H01L29/808 ,  H02M7/003 ,  H02M7/537

Abstract: A control circuit for an AC-DC power converter includes a junction field effect transistor (JFET), a first resistor, a second resistor, and a third resistor. The JFET includes a substrate, a drain, a source, a gate, a first oxide layer, and a second oxide layer. The first oxide layer is attached to a region located between the drain and the gate of the JFET, and the second oxide layer is not attached to a region located between the drain and the gate of the JFET. The first resistor is positioned on the first oxide layer, and the second resistor and the third resistor are positioned on the second oxide layer. When the JFET and the first resistor receive an input power signal, the first, the second, and the third resistors divide the input power signal, and prevent from the breakdown of the first oxide layer and the second oxide layer.

Abstract translation: 用于AC-DC电力转换器的控制电路包括结型场效应晶体管（JFET），第一电阻器，第二电阻器和第三电阻器。 JFET包括衬底，漏极，源极，栅极，第一氧化物层和第二氧化物层。 第一氧化物层附接到位于JFET的漏极和栅极之间的区域，并且第二氧化物层未附接到位于JFET的漏极和栅极之间的区域。 第一电阻器位于第一氧化物层上，第二电阻器和第三电阻器位于第二氧化物层上。 当JFET和第一电阻器接收输入功率信号时，第一，第二和第三电阻器分割输入功率信号，并防止第一氧化物层和第二氧化物层的击穿。

公开(公告)号：US12136650B2

公开(公告)日：2024-11-05

申请号：US17718101

申请日：2022-04-11

Applicant: Richtek Technology Corporation

Inventor： Chih-Wen Hsiung ,  Chun-Lung Chang ,  Kun-Huang Yu ,  Kuo-Chin Chiu ,  Wu-Te Weng

IPC: H01L29/78 ,  H01L21/74 ,  H01L29/06 ,  H01L29/10 ,  H01L29/66

Abstract: A high voltage device includes: a semiconductor layer, a well, a body region, a body contact, a gate, a source, and a drain. The body contact is configured as an electrical contact of the body region. The body contact and the source overlap with each other to define an overlap region. The body contact has a depth from an upper surface of the semiconductor layer, wherein the depth is deeper than a depth of the source, whereby a part of the body contact is located vertically below the overlap region. A length of the overlap region in a channel direction is not shorter than a predetermined length, so as to suppress a parasitic bipolar junction transistor from being turning on when the high voltage device operates, wherein the parasitic bipolar junction transistor is formed by a part of the well, a part of the body region and a part of the source.

公开(公告)号：US20240297067A1

公开(公告)日：2024-09-05

申请号：US18664656

申请日：2024-05-15

Applicant: Richtek Technology Corporation

Inventor： Kun-Huang Yu ,  Chien-Yu Chen ,  Ting-Wei Liao ,  Chih-Wen Hsiung ,  Chun-Lung Chang ,  Kuo-Chin Chiu ,  Wu-Te Weng ,  Chien-Wei Chiu ,  Yong-Zhong Hu ,  Ta-Yung Yang

IPC: H01L21/762 ,  H01L29/06 ,  H01L29/423 ,  H01L29/78

CPC classification number: H01L21/7621 ,  H01L21/76221 ,  H01L21/76281 ,  H01L29/0653 ,  H01L29/42368 ,  H01L29/7816

Abstract: A high voltage device includes: a semiconductor layer, a well, a bulk region, a gate, a source, and a drain. The bulk region is formed in the semiconductor layer and contacts the well region along a channel direction. A portion of the bulk region is vertically below and in contact with the gate, to provide an inversion region of the high voltage device when the high voltage device is in conductive operation. A portion of the well lies between the bulk region and the drain, to separate the bulk region from the drain. A first concentration peak region of an impurities doping profile of the bulk region is vertically below and in contact with the source. A concentration of a second conductivity type impurities of the first concentration peak region is higher than that of other regions in the bulk region.

公开(公告)号：US12062570B2

公开(公告)日：2024-08-13

申请号：US17547829

申请日：2021-12-10

Applicant: Richtek Technology Corporation

Inventor： Kun-Huang Yu ,  Chien-Yu Chen ,  Ting-Wei Liao ,  Chih-Wen Hsiung ,  Chun-Lung Chang ,  Kuo-Chin Chiu ,  Wu-Te Weng ,  Chien-Wei Chiu ,  Yong-Zhong Hu ,  Ta-Yung Yang

IPC: H01L29/78 ,  H01L21/762 ,  H01L29/06 ,  H01L29/423

CPC classification number: H01L21/7621 ,  H01L21/76221 ,  H01L21/76281 ,  H01L29/0653 ,  H01L29/42368 ,  H01L29/7816

Abstract: A high voltage device includes: a semiconductor layer, a well, a bulk region, a gate, a source, and a drain. The bulk region is formed in the semiconductor layer and contacts the well region along a channel direction. A portion of the bulk region is vertically below and in contact with the gate, to provide an inversion region of the high voltage device when the high voltage device is in conductive operation. A portion of the well lies between the bulk region and the drain, to separate the bulk region from the drain. A first concentration peak region of an impurities doping profile of the bulk region is vertically below and in contact with the source. A concentration of a second conductivity type impurities of the first concentration peak region is higher than that of other regions in the bulk region.

公开(公告)号：US20220223464A1

公开(公告)日：2022-07-14

申请号：US17547829

申请日：2021-12-10

Applicant: Richtek Technology Corporation

Inventor： Kun-Huang Yu ,  Chien-Yu Chen ,  Ting-Wei Liao ,  Chih-Wen Hsiung ,  Chun-Lung Chang ,  Kuo-Chin Chiu ,  Wu-Te Weng ,  Chien-Wei Chiu ,  Yong-Zhong Hu ,  Ta-Yung Yang

IPC: H01L21/762 ,  H01L29/06 ,  H01L29/423 ,  H01L29/78

Abstract: A high voltage device includes: a semiconductor layer, a well, a bulk region, a gate, a source, and a drain. The bulk region is formed in the semiconductor layer and contacts the well region along a channel direction. A portion of the bulk region is vertically below and in contact with the gate, to provide an inversion region of the high voltage device when the high voltage device is in conductive operation. A portion of the well lies between the bulk region and the drain, to separate the bulk region from the drain. A first concentration peak region of an impurities doping profile of the bulk region is vertically below and in contact with the source. A concentration of a second conductivity type impurities of the first concentration peak region is higher than that of other regions in the bulk region.

公开(公告)号：US20220223733A1

公开(公告)日：2022-07-14

申请号：US17547707

申请日：2021-12-10

Applicant: Richtek Technology Corporation

Inventor： Chun-Lung Chang ,  Chih-Wen Hsiung ,  Kun-Huang Yu ,  Kuo-Chin Chiu ,  Wu-Te Weng ,  Chien-Wei Chiu ,  Ta-Yung Yang

IPC: H01L29/78 ,  H01L29/66

Abstract: A high voltage device includes: a semiconductor layer, a well region, a shallow trench isolation region, a drift oxide region, a body region, a gate, a source, and a drain. The drift oxide region is located on a drift region. The shallow trench isolation region is located below the drift oxide region. A part of the drift oxide region is located vertically above a part of the shallow trench isolation region and is in contact with the shallow trench isolation region. The shallow trench isolation region is formed between the drain and the body region.

公开(公告)号：US20210074851A1

公开(公告)日：2021-03-11

申请号：US16868456

申请日：2020-05-06

Applicant: RICHTEK TECHNOLOGY CORPORATION

Inventor： Chien-Wei Chiu ,  Ta-Yung Yang ,  Wu-Te Weng ,  Chien-Yu Chen ,  Kun-Huang Yu ,  Chih-Wen Hsiung ,  Kuo-Chin Chiu ,  Chun-Lung Chang

IPC: H01L29/78 ,  H01L29/10 ,  H01L29/40 ,  H01L21/765 ,  H01L29/66

Abstract: The present invention provides a high voltage device and a manufacturing method thereof. The high voltage device includes: a semiconductor layer, a drift oxide region, a well, a body region, a gate, at least one sub-gate, a source, and a drain. The drift oxide region is located on a drift region in an operation region. The sub-gate is formed on the drift oxide region right above the drift region. The sub-gate is parallel with the gate. A conductive layer of the gate has a first conductivity type, and a conductive layer of the sub-gate has a second conductivity type or is an intrinsic semiconductor structure.

公开(公告)号：US09084327B2

公开(公告)日：2015-07-14

申请号：US13789325

申请日：2013-03-07

Applicant: Richtek Technology Corporation

Inventor： Kuo-Chin Chiu ,  Chih-Feng Huang

IPC: H05B33/08

CPC classification number: H02M3/158 ,  G05F1/16 ,  G05F3/16 ,  H05B33/083 ,  H05B33/0851 ,  H05B33/0854

Abstract: A driver circuit for driving an LED array is disclosed. The LED array includes a first, a second, a third, a fourth LED device and a diode device. The second LED device is connected to the first LED device. The fourth LED device is connected to the third LED device. The diode device is connected between the second LED device and the third LED device. The driver circuit includes a first constant current regulator for coupling between the first and the second LED device; a second constant current regulator for coupling between the second and the third LED device; a third constant current regulator for coupling between the third and the fourth LED device; a fourth constant current regulator for coupling between the fourth LED device and a fixed-voltage terminal; and a control circuit coupled with the first, the second, the third, and the fourth constant current regulators.

Abstract translation: 公开了一种用于驱动LED阵列的驱动电路。 LED阵列包括第一，第二，第三，第四LED器件和二极管器件。 第二LED装置连接到第一LED装置。 第四LED装置连接到第三LED装置。 二极管器件连接在第二LED器件和第三LED器件之间。 驱动器电路包括用于在第一和第二LED器件之间耦合的第一恒流调节器; 用于耦合在所述第二和第三LED器件之间的第二恒流调节器; 用于耦合在第三和第四LED器件之间的第三恒流调节器; 用于在第四LED器件和固定电压端子之间耦合的第四恒流调节器; 以及与第一，第二，第三和第四恒定电流调节器耦合的控制电路。