公开(公告)号：US09257335B2

公开(公告)日：2016-02-09

申请号：US14426302

申请日：2013-09-04

Applicant: Research Triangle Institute

Inventor： Erik Vick ,  Garry Brian Cunningham ,  Dorota Temple

IPC: H01L21/768 ,  H01L23/48 ,  H01L23/00

CPC classification number: H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/0311 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/036 ,  H01L2224/039 ,  H01L2224/0401 ,  H01L2224/05025 ,  H01L2224/05096 ,  H01L2224/05555 ,  H01L2224/05557 ,  H01L2224/05569 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05676 ,  H01L2224/05684 ,  H01L2224/05687 ,  H01L2224/06181 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16235 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/0476 ,  H01L2924/01074 ,  H01L2924/04941 ,  H01L2224/0239 ,  H01L2924/01029 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01047 ,  H01L2924/01044 ,  H01L2224/03 ,  H01L2924/00

Abstract: An electronic device includes a substrate including a front side, a back side, a thickness between the front side and back side, one or more front-side vias extending from the front side into a part of the thickness, and an interconnect via extending from the back side toward the front side; a contact pad on the front side and including one or more protrusions extending through corresponding front-side vias and into the interconnect via; and an interconnect extending through the interconnect via and into contact with the protrusion(s).

Abstract translation: 一种电子设备包括：基板，包括正面，背面，前侧和后侧之间的厚度，从前侧延伸到厚度的一部分的一个或多个正面通孔;以及互连件， 背面朝前方; 接触垫，其包括一个或多个延伸穿过相应的前侧通孔并进入所述互连通孔中的突起; 以及通过互连件延伸并与突起接触的互连。

公开(公告)号：US20150235898A1

公开(公告)日：2015-08-20

申请号：US14426302

申请日：2013-09-04

Applicant: Research Triangle Institute

Inventor： Erik Vick ,  Garry Brian Cunningham ,  Dorota Temple

IPC: H01L21/768 ,  H01L23/00 ,  H01L23/48

CPC classification number: H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/0311 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/036 ,  H01L2224/039 ,  H01L2224/0401 ,  H01L2224/05025 ,  H01L2224/05096 ,  H01L2224/05555 ,  H01L2224/05557 ,  H01L2224/05569 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05676 ,  H01L2224/05684 ,  H01L2224/05687 ,  H01L2224/06181 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16235 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/0476 ,  H01L2924/01074 ,  H01L2924/04941 ,  H01L2224/0239 ,  H01L2924/01029 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01047 ,  H01L2924/01044 ,  H01L2224/03 ,  H01L2924/00

Abstract: An electronic device includes a substrate including a front side, a back side, a thickness between the front side and back side, one or more front-side vias extending from the front side into a part of the thickness, and an interconnect via extending from the back side toward the front side; a contact pad on the front side and including one or more protrusions extending through corresponding front-side vias and into the interconnect via; and an interconnect extending through the interconnect via and into contact with the protrusion(s).

Abstract translation: 一种电子设备包括：基板，包括正面，背面，前侧和后侧之间的厚度，从前侧延伸到厚度的一部分的一个或多个正面通孔;以及互连件， 背面朝前方; 接触垫，其包括一个或多个延伸穿过相应的前侧通孔并进入所述互连通孔中的突起; 以及通过互连件延伸并与突起接触的互连。

公开(公告)号：US09022649B2

公开(公告)日：2015-05-05

申请号：US13645765

申请日：2012-10-05

Applicant: Research Triangle Institute, International

Inventor： John Lewis ,  Ethan Klem ,  Jeffrey Robert Piascik ,  Garry Brian Cunningham

IPC: G01K11/00 ,  G01K11/32

CPC classification number: G01K11/3213

Abstract: A temperature sensor includes a photon source, a fluorescent element and a photodetector. The fluorescent element includes a temperature-insensitive first fluorophore and a temperature-sensitive second fluorophore. The photodetector includes a first photosensor exhibiting a first spectral responsivity and a second photosensor exhibiting a second spectral responsivity. To measure a temperature of a surface, the fluorescent element may be placed adjacent to the surface and irradiated with a photon beam. First photons emitted from the first fluorophore and second photons emitted from the second fluorophore are collected. The first and second photons may be transmitted as a single dichromatic beam to the photodetector. The photosensors generate two different photodetector output signals, the ratio of which may be correlated to temperature.

Abstract translation: 温度传感器包括光子源，荧光元件和光电检测器。 荧光元件包括温度不敏感的第一荧光团和温度敏感的第二荧光团。 光检测器包括具有第一光谱响应性的第一光电传感器和呈现第二光谱响应度的第二光电传感器。 为了测量表面的温度，荧光元件可以放置在表面附近并用光子束照射。 从第一荧光团发射的第一光子和从第二荧光团发射的第二光子被收集。 第一和第二光子可以作为单个二色光束传输到光电检测器。 光电传感器产生两个不同的光电检测器输出信号，其比例可能与温度相关。