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Patent Agency Ranking
公开(公告)号：US10281088B2
公开(公告)日：2019-05-07
申请号：US15656094
申请日：2017-07-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jin Wook Chung , Kyung Wook Hwang
IPC: F21K9/232 , H01L33/50 , H01L33/60 , H01L33/06 , H01L33/32 , H01L33/56 , H01L33/64 , H01L25/075 , H01L33/62 , F21K9/27 , F21Y115/10 , F21V3/02 , F21K9/23 , F21Y107/00
Abstract: An LED device includes a transparent substrate having a bar-like shape and having a first surface and a second surface opposed thereto, a plurality of LED chips mounted on the first surface of the transparent substrate and electrically connected to each other, each of the plurality of LED chips having a reflective layer disposed on a surface mounted in the transparent substrate, a first connection terminal and a second connection terminal disposed on opposing ends of the transparent substrate and electrically connected to the plurality of LED chips, a bonding layer interposed between the plurality of LED chips and the transparent substrate and including a metal filler, and a wavelength conversion portion covering the first surface and the second surface of the transparent substrate and the plurality of LED chips.
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公开(公告)号：US10386020B2
公开(公告)日：2019-08-20
申请号：US15849022
申请日：2017-12-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Pun Jae Choi , Jin Wook Chung
IPC: F21K9/237 , F21Y115/10 , H01L33/08 , H01L33/50 , H01L33/54 , H01L33/62 , F21V3/06 , F21K9/235 , F21K9/232 , H01L33/64 , H01L33/60
Abstract: A light emitting diode (LED) module array including: a plurality of LED groups connected to each other in series, each LED group including a single rod-shaped LED module or a plurality of LED modules connected to each other in parallel, wherein a number of LED modules included in a first LED group is different from a number of LED modules included in a second LED group.
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公开(公告)号：US09887332B2
公开(公告)日：2018-02-06
申请号：US15056117
申请日：2016-02-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Pun Jae Choi , Geun Woo Ko , Yong Min Kwon , Ah Young Woo , Jun Ho Lee , Jin Wook Chung
CPC classification number: H01L33/62 , H01L25/0753 , H01L25/167 , H01L33/486 , H01L33/56 , H01L33/60
Abstract: A semiconductor light-emitting device package includes: a light-emitting structure having a first surface, a second surface opposite to the first surface and side surfaces disposed between the first and the second surfaces, the light-emitting structure comprising a first light-emitting laminate and a second light-emitting laminate, each of the first and the second light emitting laminates including: a first conductivity-type semiconductor layer; an active layer, and a second conductivity-type semiconductor layer, an interconnector provided on the second surface of the light-emitting structure and configured to electrically connect the first and the second light-emitting laminates; a metal guide surrounding the side surfaces of the light-emitting structure; and an encapsulant surrounding the metal guide and the second and the side surfaces of the light-emitting structure and exposing the first surface of the light-emitting structure.
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公开(公告)号：US10711958B2
公开(公告)日：2020-07-14
申请号：US16161948
申请日：2018-10-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jin Wook Chung , Chong Min Lee
IPC: H01L33/62 , H01L25/075 , H05K1/18 , F21S4/28 , F21V29/70 , F21V19/00 , F21Y115/10
Abstract: A light emitting diode (LED) device includes: a transparent substrate having a first surface and a second surface opposite to the first surface; an LED array disposed on at least one of the first surface and the second surface of the transparent substrate, and including a plurality of LED chips electrically connected to one another; a controller disposed on at least one of the first surface and the second surface, and is electrically connected to the LED array to control the LED array; a connection terminal disposed at one end of the transparent substrate, and electrically connected to the LED array and the controller; and a wavelength converter covering the first surface and the second surface of the transparent substrate and the LED array.
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公开(公告)号：US20180347766A1
公开(公告)日：2018-12-06
申请号：US15849022
申请日：2017-12-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Pun Jae Choi , Jin Wook Chung
CPC classification number: F21K9/237 , F21K9/232 , F21K9/235 , F21V3/061 , F21Y2115/10 , H01L25/0753 , H01L33/08 , H01L33/505 , H01L33/507 , H01L33/54 , H01L33/60 , H01L33/62 , H01L33/642
Abstract: A light emitting diode (LED) module array including: a plurality of LED groups connected to each other in series, each LED group including a single rod-shaped LED module or a plurality of LED modules connected to each other in parallel, wherein a number of LED modules included in a first LED group is different from a number of LED modules included in a second LED group.
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