公开(公告)号：US09527118B2

公开(公告)日：2016-12-27

申请号：US14934200

申请日：2015-11-06

Applicant: Semes Co., Ltd.

Inventor： Young Hun Lee ,  Eui Sang Lim ,  Jae Myoung Lee

IPC: H01L21/331 ,  H01L21/8222 ,  B08B7/00 ,  H01L21/02 ,  H01L21/67

CPC classification number: B08B7/0021 ,  H01L21/02057 ,  H01L21/02101 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/67069

Abstract: Disclosed are systems and methods for treating a substrate. The method may include supplying supercritical carbon dioxide into a chamber to treat a substrate. Here, temperature and pressure of the chamber is maintained to allow carbon dioxide to be directly changed from a gas state to a supercritical state when the carbon dioxide is supplied into the chamber.

Abstract translation: 公开了用于处理基材的系统和方法。 该方法可以包括将超临界二氧化碳供应到室中以处理基底。 这里，保持室的温度和压力，以便当将二氧化碳供应到室中时，使二氧化碳直接从气态改变为超临界状态。

公开(公告)号：US11495474B2

公开(公告)日：2022-11-08

申请号：US17026389

申请日：2020-09-21

Applicant: SEMES CO., LTD.

Inventor： Yong Hee Lee ,  Young Hun Lee ,  Jinwoo Jung ,  Eui Sang Lim

IPC: H01L21/02 ,  H01L21/67 ,  H01L21/687

Abstract: Disclosed is a method for processing a substrate, comprising a liquid processing step of performing liquid processing on the substrate by supplying a processing liquid onto the substrate in a liquid processing chamber, a transfer step of transferring the substrate from the liquid processing chamber to a drying chamber, and a drying step of drying the substrate in the drying chamber. In the drying step, the substrate is dried while an edge region of the substrate other than a central region of the substrate is supported by a support unit, and in the liquid processing step, the liquid processing is performed on the substrate such that a height of the processing liquid remaining on the edge region of the substrate is greater than a height of the processing liquid remaining on the central region of the substrate when the liquid processing is completed in the liquid processing chamber.

公开(公告)号：US20160133454A1

公开(公告)日：2016-05-12

申请号：US14934200

申请日：2015-11-06

Applicant: Semes Co., Ltd.

Inventor： Young Hun Lee ,  Eui Sang Lim ,  Jae Myoung Lee

IPC: H01L21/02 ,  B08B7/00

CPC classification number: B08B7/0021 ,  H01L21/02057 ,  H01L21/02101 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/67069

Abstract: Disclosed are systems and methods for treating a substrate. The method may include supplying supercritical carbon dioxide into a chamber to treat a substrate. Here, temperature and pressure of the chamber is maintained to allow carbon dioxide to be directly changed from a gas state to a supercritical state when the carbon dioxide is supplied into the chamber.

Abstract translation: 公开了用于处理基材的系统和方法。 该方法可以包括将超临界二氧化碳供应到室中以处理基底。 这里，保持室的温度和压力，以便当将二氧化碳供应到室中时，使二氧化碳直接从气态改变为超临界状态。

公开(公告)号：US12222159B2

公开(公告)日：2025-02-11

申请号：US17408953

申请日：2021-08-23

Applicant: SEMES CO., LTD.

Inventor： Do Hyeon Yoon ,  Yong Hyun Choi ,  Eui Sang Lim ,  Jun Young Choi

IPC: F26B21/14 ,  F26B5/14 ,  F26B21/10

Abstract: An apparatus for treating a substrate includes a body having an inner space in which the substrate is dried by a drying fluid in a supercritical state, a fluid supply unit that supplies the drying fluid into the inner space, a fluid exhaust unit that releases the drying fluid from the inner space, and a controller. The controller controls the fluid supply unit and the fluid exhaust unit to perform a pressure-raising step of raising pressure in the inner space to a set pressure and a flow step of generating a flow of the drying gas in the inner space by releasing, by the fluid exhaust unit, the drying fluid from the inner space while the fluid supply unit supplies the drying fluid into the inner space.

公开(公告)号：US11942337B2

公开(公告)日：2024-03-26

申请号：US17063820

申请日：2020-10-06

Applicant: SEMES CO., LTD.

Inventor： Eui Sang Lim ,  Young Hun Lee ,  Jinwoo Jung ,  Miso Park ,  Byongwook Ahn ,  Yong Hee Lee

IPC: H01L21/67 ,  H01J37/32

CPC classification number: H01L21/67017 ,  H01J37/32449 ,  H01J37/32467 ,  H01J37/32715 ,  H01J37/32834 ,  H01J2237/334

Abstract: The apparatus includes a support unit to support the substrate in a treatment space of a process chamber, a first fluid supply unit to supply a supercritical fluid having an organic solvent dissolved in the supercritical fluid, to the treatment space, a second fluid supply unit to supply the supercritical fluid having no organic solvent dissolved in the supercritical fluid, to the treatment space, an exhaust unit to exhaust the treatment space, a controller to control the first fluid supply unit, the second fluid supply unit, and the exhaust unit. The controller controls the first and second fluid supply units such that the supercritical fluid having no organic solvent dissolved in the supercritical fluid is supplied to the treatment space through the second fluid supply unit, after the supercritical fluid mixed with the organic solvent is supplied to the treatment space through the first fluid supply unit.

公开(公告)号：US11145520B2

公开(公告)日：2021-10-12

申请号：US16916246

申请日：2020-06-30

Applicant: SEMES CO., LTD.

Inventor： Young Hun Lee ,  Eui Sang Lim

IPC: B08B3/02 ,  H01L21/67

Abstract: Disclosed is a method for liquid-treating a substrate. In a method for treating a substrate, the substrate may be treated by supplying a treatment liquid onto the rotating substrate by using a first nozzle and a second nozzle, the first nozzle supplies the treatment liquid to an area including a central area on the substrate, and the second nozzle supplies the treatment liquid to a peripheral area of the substrate.

公开(公告)号：US20160121374A1

公开(公告)日：2016-05-05

申请号：US14930206

申请日：2015-11-02

Applicant: Semes Co., Ltd

Inventor： Young Hun Lee ,  Eui Sang Lim ,  Jae Myoung Lee

IPC: B08B7/00 ,  H01L21/02 ,  H01L21/67

CPC classification number: B08B7/0021 ,  B08B3/02 ,  B08B2203/0229 ,  F26B3/04 ,  F26B5/005 ,  F26B11/18 ,  F26B21/14 ,  H01L21/02101 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/67103 ,  H01L21/67126 ,  H01L21/6719 ,  H01L21/68742

Abstract: A substrate treating apparatus is disclosed. The apparatus may include a housing including an upper body and a lower body coupled to each other to define a treatment space, the lower body being provided below the upper body, a supporting unit coupled to the upper body, the supporting unit supporting an edge of a substrate disposed in the treatment space, a fluid supplying unit configured to supply fluid into the treatment space, a sealing member provided between and in contact with the upper and lower bodies, the sealing member hermetically isolating the treatment space from an outer space, and an isolation plate installed between the sealing member and the supporting unit. The isolation plate may be provided to face the sealing member.

Abstract translation: 公开了一种基板处理装置。 所述装置可以包括壳体，所述壳体包括彼此联接以限定处理空间的上主体和下体，所述下体设置在所述上​​身下方，支撑单元联接到所述上身，所述支撑单元支撑 设置在处理空间中的基板，配置成向处理空间供给流体的流体供给单元，设置在上下体之间并与上下体接触的密封构件，密封构件使处理空间与外部空间隔离，以及 安装在密封构件和支撑单元之间的隔离板。 隔离板可以设置成面对密封构件。

公开(公告)号：US12300483B2

公开(公告)日：2025-05-13

申请号：US17370475

申请日：2021-07-08

Applicant: SEMES CO., LTD.

Inventor： Miso Park ,  Yong Hee Lee ,  Eui Sang Lim ,  Jinwoo Jung

IPC: H01L21/02 ,  B08B7/00 ,  B08B13/00 ,  H01L21/67

Abstract: An apparatus for treating a substrate using a treating fluid in a supercritical state is provided. In a pressure increasing step of increasing a pressure in the treating space from a pressure lower than a critical pressure of the treating fluid to a treating pressure higher than the critical pressure, the apparatus controls a supply amount of the treating fluid supplied from a first supply port to control flow of the treating fluid supplied from the first supply port and then exhausted through an exhaust port.

公开(公告)号：US12293928B2

公开(公告)日：2025-05-06

申请号：US17563189

申请日：2021-12-28

Applicant: SEMES CO., LTD.

Inventor： Eui Sang Lim ,  Yong Hee Lee

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/677

Abstract: A substrate treating device includes a liquid treating chamber for liquid-treating a substrate therein, a drying chamber for dry-treating the liquid-treated substrate, a transfer device for transferring the substrate between the liquid treating chamber and the drying chamber, and a controller for controlling the liquid treating chamber and the transfer device. The transfer device includes a transfer robot having a hand for placing the substrate thereon, and a heating member for heating the substrate. The controller controls the transfer device such that the heating member of the transfer device heats a liquid on the substrate to a first temperature before the transfer device transfers the substrate taken out from the liquid treating chamber to the drying chamber.

公开(公告)号：US12014938B2

公开(公告)日：2024-06-18

申请号：US17955206

申请日：2022-09-28

Applicant: SEMES CO., LTD.

Inventor： Yong Hee Lee ,  Young Hun Lee ,  Jinwoo Jung ,  Eui Sang Lim

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/687

CPC classification number: H01L21/67051 ,  H01L21/02057 ,  H01L21/02101 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/6715 ,  H01L21/68707 ,  H01L21/68764 ,  H01L21/6719

Abstract: Disclosed is a method for processing a substrate, comprising a liquid processing step of performing liquid processing on the substrate by supplying a processing liquid onto the substrate in a liquid processing chamber, a transfer step of transferring the substrate from the liquid processing chamber to a drying chamber, and a drying step of drying the substrate in the drying chamber. In the drying step, the substrate is dried while an edge region of the substrate other than a central region of the substrate is supported by a support unit, and in the liquid processing step, the liquid processing is performed on the substrate such that a height of the processing liquid remaining on the edge region of the substrate is greater than a height of the processing liquid remaining on the central region of the substrate when the liquid processing is completed in the liquid processing chamber.