Apparatus for treating substrate and method for treating substrate

    公开(公告)号:US12272544B2

    公开(公告)日:2025-04-08

    申请号:US18145920

    申请日:2022-12-23

    Abstract: Disclosed is a method for treating a substrate in a plurality of chambers. The substrate treating method may include performing liquid treatment on a substrate located in a chamber through a supply line for connecting a circulation line and each of the plurality of chambers while the liquid circulates in the circulation line, wherein a flow rate per unit time of the liquid flowing downstream of a valve provided in the supply line is constantly maintained at a reference flow rate, and controlling an upstream flow rate which is a flow rate per unit time of the liquid flowing upstream of the circulation line rather than the supply lines or a downstream flow rate which is a flow rate per unit time of the liquid flowing downstream of the circulation line rather than the supply lines based on a distribution flow rate which is a flow rate per unit time of the liquid flowing upstream of the valve to maintain the reference flow rate.

    CHEMICAL LIQUID PROVIDING UNIT AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME

    公开(公告)号:US20220297169A1

    公开(公告)日:2022-09-22

    申请号:US17694828

    申请日:2022-03-15

    Abstract: Provided are a treating liquid providing unit capable of predicting a temperature change of a substrate treating liquid by adding an inflow amount or consumption amount of the substrate treating liquid as a control factor, and a substrate treating apparatus including the same. The treating liquid providing unit includes a treating liquid storage module for storing the substrate treating liquid, a treating liquid heating module for heating the substrate treating liquid, a treating liquid discharging module for discharging the substrate treating liquid, a treating liquid supplying module for supplying the substrate treating liquid to the treating liquid storage module when the substrate treating liquid is discharged, and a control module for predicting the temperature of the substrate treating liquid remaining in the treating liquid storage module based on the inflow amount of the substrate treating liquid.

    Dissolved ozone removal unit, substrate treating apparatus including the same, and substrate treating method

    公开(公告)号:US11433438B2

    公开(公告)日:2022-09-06

    申请号:US16718011

    申请日:2019-12-17

    Inventor: Moon Soon Choi

    Abstract: The inventive concept relates to a dissolved ozone removal unit, a substrate treating apparatus including the same, and a substrate treating method. The dissolved ozone removal unit includes a fluid channel providing member having a fluid channel through which a processing liquid passes and a light source member that is mounted in the fluid channel providing member and that supplies UV light to the processing liquid, and the fluid channel providing member includes a helical fluid channel configured such that the processing liquid is exposed to the UV light while helically moving around the light source member.

    Unit for supplying liquid, apparatus and method for treating substrate with the unit

    公开(公告)号:US12266546B2

    公开(公告)日:2025-04-01

    申请号:US17969155

    申请日:2022-10-19

    Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a support unit configured to support a substrate; and a liquid supply unit configured to supply a treating liquid onto the substrate supported on the support unit, and wherein the liquid supply unit comprises: a tank configured to have an accommodation space for storing the treating liquid therein; a circulation line configured to circulate the treating liquid stored in the accommodation space; a supplementary line configured to supply the treating liquid to the accommodation space, and at which a valve is installed; a heater installed at the circulation line, and for heating the treating liquid; and a controller is configured to control the valve and the heater.

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