公开(公告)号：US11765793B2

公开(公告)日：2023-09-19

申请号：US16932286

申请日：2020-07-17

Applicant: SEMES CO., LTD.

Inventor： Muhyeon Lee ,  Gui Su Park ,  Byungsun Bang ,  Jungbong Choi ,  Youngil Lee ,  Kangseop Yun ,  Seung Eun Na ,  Ye Jin Choi ,  Kyounghwan Kim

IPC: H05B3/06 ,  H01L21/683 ,  H01L21/67 ,  H05B3/00 ,  H01L21/687

CPC classification number: H05B3/0047 ,  H01L21/6708 ,  H01L21/683 ,  H01L21/68714 ,  H05B3/06 ,  H01L21/67 ,  H01L21/67005 ,  H01L21/67115

Abstract: An apparatus for treating a substrate includes a process chamber having a treatment space defined therein, a support unit for supporting the substrate in the treatment space, a liquid supply unit for supplying treating liquid to the substrate supported on the support unit, and a heating unit disposed in the support unit for heating the substrate supported on the support unit, wherein the heating unit includes a plurality of lamps to heat the substrate, and a window disposed above the lamps to transmit light emitted from the lamps, wherein the window includes a base in a form of a plate, and light adjustment means formed on the base to spread or converge light emitted from the lamps.

公开(公告)号：US10211075B2

公开(公告)日：2019-02-19

申请号：US15440288

申请日：2017-02-23

Applicant: SEMES CO., LTD.

Inventor： Dae Min Kim ,  Soyoung Park ,  Muhyeon Lee

IPC: B05D1/00 ,  B05D1/02 ,  B05D1/34 ,  B05D1/36 ,  B05D3/00 ,  B05D7/00 ,  B08B3/00 ,  B08B3/02 ,  B08B3/04 ,  H01L21/02 ,  H01L21/67

Abstract: An apparatus and a method for treating a substrate with liquid are disclosed. The substrate treating apparatus comprises a substrate supporting unit for supporting the substrate, a liquid supply unit for supplying a liquid to the substrate supported on the substrate supporting unit, and a controller for controlling the liquid supply unit, wherein the liquid supply unit comprises a first nozzle for supplying a first liquid and a second nozzle for supplying a second liquid, and a second area where the second liquid is supplied on the substrate is provided within a first area where the first liquid is supplied on the substrate. The first liquid and the second liquid supplied with a hydrophobic film are discharged with different ways from each other. Thereby, particles with various sizes may be removed depending on each discharge methods.

公开(公告)号：US12198950B2

公开(公告)日：2025-01-14

申请号：US17943312

申请日：2022-09-13

Applicant: SEMES CO., LTD.

Inventor： Myung A Jeon ,  Muhyeon Lee ,  Sul Lee

IPC: H01L21/67 ,  B08B3/02 ,  B08B3/08 ,  B32B41/00 ,  B32B43/00 ,  H01L21/683

Abstract: Embodiments of the inventive concept described herein relate to an apparatus and method for removing an adhesive exposed to the outside from an object being processed. The apparatus for removing the adhesive exposed to the outside from an edge region of the object being processed, in which the object has a patterned substrate and a support plate bonded together by the adhesive. The cover liquid nozzle dispenses the cover liquid onto a cover area of a top surface of the object other than the exposed area, and the controller controls the cover liquid dispensing member to adjust a flow rate of the cover liquid to cause a removal rate of the adhesive to remain constant.

公开(公告)号：US20170274415A1

公开(公告)日：2017-09-28

申请号：US15440288

申请日：2017-02-23

Applicant: SEMES CO., LTD.

Inventor： Dae Min KIM ,  Soyoung Park ,  Muhyeon Lee

IPC: B05D1/02 ,  B05B9/03 ,  B05D7/00

CPC classification number: H01L21/67051 ,  B05D1/002 ,  B05D1/005 ,  B05D1/02 ,  B05D1/34 ,  B05D1/36 ,  B05D3/002 ,  B05D7/52 ,  B08B3/00 ,  B08B3/024 ,  B08B3/04 ,  H01L21/02041

Abstract: The present invention relates to an apparatus and a method for treating a substrate with liquid. The substrate treating apparatus comprises a substrate supporting unit for supporting the substrate, a liquid supply unit for supplying a liquid to the substrate supported on the substrate supporting unit, and a controller for controlling the liquid supply unit, wherein the liquid supply unit comprises a first nozzle for supplying a first liquid and a second nozzle for supplying a second liquid, and a second area where the second liquid is supplied on the substrate is provided within a first area where the first liquid is supplied on the substrate. The first liquid and the second liquid supplied with a hydrophobic film are discharged with different ways from each other. Thereby, particles with various sizes may be removed depending on each discharge methods.