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    PUMP, CHEMICAL LIQUID SUPPLYING UNIT, AND SUBSTRATE TREATING APPARATUS
    1.
    发明申请
    PUMP, CHEMICAL LIQUID SUPPLYING UNIT, AND SUBSTRATE TREATING APPARATUS 有权

    公开(公告)号：US20230072779A1

    公开(公告)日：2023-03-09

    申请号：US17900761

    申请日：2022-08-31

    Applicant: SEMES CO., LTD.

    Inventor： Young Jun SON ,  Byoung Doo CHOI ,  Sung Chul JUNG ,  Woo Sin JUNG ,  Young Un YUN ,  Woo Ram LEE ,  Ki Sang EUM

    IPC: F04B45/06

    Abstract: Provided is a pump for supplying a liquid. The pump includes: a tube including a pump chamber communicating with a chemical liquid inlet and a chemical liquid outlet, and configured to discharge a chemical liquid through a change in volume due to contraction and expansion; and a driving unit contracting or expanding the tube in a longitudinal direction, in which the tube includes: a flexible tube body including a pump chamber which has an increased internal volume when is contracted in a longitudinal direction and has a decreased internal volume when is expanded in the longitudinal direction, and which has a jar shape of which a radius is increased from the chemical liquid inlet to a center of the pump chamber, and the radius is decreased from the pump chamber to the chemical liquid outlet; a first flange provided at one end of the tube body and including the chemical liquid inlet; and a second flange provided at the other end of the tube body and including the chemical liquid outlet.

    HOME PORT, AND APPARATUS FOR TREATING SUBSTRATE WITH THE SAME
    3.
    发明公开
    HOME PORT, AND APPARATUS FOR TREATING SUBSTRATE WITH THE SAME 审中-公开

    公开(公告)号：US20230207342A1

    公开(公告)日：2023-06-29

    申请号：US18146800

    申请日：2022-12-27

    Applicant: SEMES CO., LTD.

    Inventor： Young Jun SON ,  Tae Hoon LEE ,  Do Yeon KIM

    IPC: H01L21/67 ,  H01L21/687

    CPC classification number: H01L21/67051 ,  H01L21/6715 ,  H01L21/67253 ,  H01L21/68764

    Abstract: Provided is an apparatus for treating a substrate. The substrate treating apparatus according to an exemplary embodiment may include: a support unit supporting a substrate; a treating container covering an outer side of the support unit; a liquid supply unit including a nozzle ejecting a liquid to the substrate supported on the support unit; and a home port which is positioned outside the treating container, and in which the nozzle waits, and the home port may include a body having a discharge space to which the liquid ejected from the nozzle is discharged therein, and a measurement unit connected to the body and measuring a charging amount of the liquid discharged from the discharge space.

    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
    4.
    发明公开
    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 审中-公开

    公开(公告)号：US20240186155A1

    公开(公告)日：2024-06-06

    申请号：US18523893

    申请日：2023-11-30

    Applicant: SEMES CO., LTD.

    Inventor： Ki Sang EUM ,  Dong Woon PARK ,  Young Jun SON ,  Woo Ram LEE ,  Jin Ho CHOI

    IPC: H01L21/67 ,  H01L21/687

    CPC classification number: H01L21/67051 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67253 ,  H01L21/68785

    Abstract: Proposed is a substrate processing apparatus for cleaning the bottom surface of a substrate. The apparatus includes a processing container configured to form a processing space for a substrate, a substrate support unit provided inside the processing space and configured to support the substrate, a first nozzle unit configured to have a first nozzle member provided on a side of the substrate support unit inside the processing space and supplying a processing fluid toward a center area of a bottom surface of the substrate, and a second nozzle member provided to be fixedly coupled to the substrate support unit and supplying a processing fluid toward an edge area of the bottom surface of the substrate, wherein the first nozzle member is provided to rotate between a center position and an end position of the bottom surface of the substrate.

    APPARATUS FOR PROCESSING SUBSTRATE
    6.
    发明公开
    APPARATUS FOR PROCESSING SUBSTRATE 审中-公开

    公开(公告)号：US20240162056A1

    公开(公告)日：2024-05-16

    申请号：US18367564

    申请日：2023-09-13

    Applicant: SEMES CO., LTD.

    Inventor： Sun Wook JUNG ,  Ha Neul YOO ,  Woo Ram LEE ,  Young Jun SON

    IPC: H01L21/67 ,  B08B3/02

    CPC classification number: H01L21/67051 ,  B08B3/022

    Abstract: An apparatus for processing a substrate includes a first bowl and a processing space therein; a first support portion disposed in the processing space and configured to support the substrate in a first support position; a second bowl disposed to move in a first direction in the processing space; a second support portion configured to move upwardly and downwardly with respect to the first support portion to support the substrate between the second support position disposed above the first support position and the third support position, and to move in the first direction; and a cleaning unit including a first cleaning portion disposed below the substrate toward a rear surface of the substrate in the first support position and a second cleaning portion disposed below the substrate and opposing a rear surface of the substrate between the second support position and the third support position.

    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
    9.
    发明申请
    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 有权

    公开(公告)号：US20250091075A1

    公开(公告)日：2025-03-20

    申请号：US18778898

    申请日：2024-07-19

    Applicant: SEMES CO., LTD.

    Inventor： Young Jun SON

    IPC: B05B12/08 ,  B05B12/14

    Abstract: Provided are a substrate processing apparatus and a substrate processing method. The substrate processing apparatus includes a substrate support portion supporting a substrate, a first discharge unit including a first nozzle discharging a first processing liquid to the substrate, a first measurement unit connected to the first nozzle and measuring a first amount of charges of the first processing liquid discharged from the first nozzle, a bowl disposed around the substrate support portion, a second measurement unit measuring a second amount of charges of the first processing liquid scattered from the substrate to the surface of the bowl, and a second discharge unit including a second nozzle discharging a second processing liquid charged based on a difference between the first amount of charges and the second amount of charges to the substrate.

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