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1.发明授权Halogen-free resin composition, and prepreg and laminate for printed circuits using same 有权无卤树脂组合物，以及使用其的印刷电路用预浸料和层压材料公开(公告)号：US09487652B2
公开(公告)日：2016-11-08
申请号：US14552775
申请日：2014-11-25
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Jiang You
IPC: B32B27/38 , B32B27/04 , B32B27/18 , B32B27/20 , B32B27/26 , C08L63/04 , C08G59/24 , C08G59/32 , C08G59/62 , C08K3/36 , C08K5/49 , C08L39/04 , C08L63/00
CPC classification number: C08L39/04 , C08G59/3218 , C08G59/621 , C08K5/49 , C08L63/00 , C08L79/04
Abstract: Halogen-free resin composition, prepreg, and laminate for printed circuits. Based on 100 parts by weight of organic solid matter, it comprises: (A) dicyclopentadiene-type benzoxazine resin: 50-80 parts by weight; (B) dicyclopentadiene-type epoxy resin; (C) dicyclopentadiene-type novolac hardener; (D) phosphorus-containing flame retardant. The dicyclopentadiene structure in (A) decreases the dielectric constant, dielectric dissipation value, and water absorption of cured products and maintain adhesive force as the main resin; adding (B) can improve the tenacity of cured products and maintain low water absorption and excellent dielectric performances; Taking the dicyclopentadiene-type novolac as the hardener can sufficiently exert the advantage of excellent dielectric performances and good thermal and moisture resistance resulted from the dicyclopentadiene-containing structure. The prepreg above and the laminate for printed circuits using the prepreg have low dielectric constant, low dielectric dissipation factor, low water absorption, high adhesion, high thermal resistance and good flame retardancy, processability and chemical resistance.
Abstract translation: 用于印刷电路的无卤素树脂组合物，预浸料和层压板。 基于100重量份的有机固体物质，其包含：（A）二环戊二烯型苯并恶嗪树脂：50-80重量份; （B）二环戊二烯型环氧树脂; （C）二环戊二烯型酚醛清漆硬化剂; （D）含磷阻燃剂。 （A）中的二环戊二烯结构降低了固化产物的介电常数，介电耗散值和吸水率，并保持作为主要树脂的粘合力; 加入（B）可以提高固化产物的强度，保持低吸水性和优良的介电性能; 以二环戊二烯型酚醛清漆为硬化剂，可以充分发挥由含二环戊二烯的结构产生的优异的介电性能和良好的耐热和耐湿性。 上述预浸料和使用该预浸料的印刷电路用层叠体具有低介电常数，低介电损耗因数，低吸水率，高附着力，高耐热性，良好的阻燃性，加工性和耐化学性。
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公开(公告)号：US09752028B2
公开(公告)日：2017-09-05
申请号：US14679387
申请日：2015-04-06
Applicant: Shengyi Technology Co., Ltd.
Inventor： Jiang You , Tianhui Huang , Zhongqiang Yang
CPC classification number: C08L63/04 , C08G59/4071 , C08G59/621 , C08K3/36 , C08K5/0066 , C08K5/523 , C08L63/00
Abstract: The present invention relates to a halogen-free thermosetting resin composition, and also a prepreg and a laminate for printed circuit prepared from the halogen-free thermosetting resin composition. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free epoxy resin, (B) from 5 to 30 parts by weight of a first curing agent of phosphorus-containing bisphenol, (C) from 5 to 30 parts by weight of a second curing agent of alkylphenol novolac, and (D) a phosphorus-containing flame retardant. The prepreg and laminate for printed circuit prepared from the halogen-free thermosetting resin composition according to the present invention have high glass transition temperature, excellent dielectric properties, low water absorption, high thermal resistance and better process workability, and can fulfill halogen-free flame retardance and achieve the grade of UL94 V-0.
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3.发明申请Halogen-Free Thermosetting Resin Composition, Prepreg and Laminate for Printed Circuit Prepared From the Same 有权无卤素热固性树脂组合物，由其制备的印刷电路用预浸料和层压板公开(公告)号：US20160185953A1
公开(公告)日：2016-06-30
申请号：US14679387
申请日：2015-04-06
Applicant: Shengyi Technology Co., Ltd.
Inventor： Jiang You , Tianhui Huang , Zhongqiang Yang
CPC classification number: C08L63/04 , C08G59/4071 , C08G59/621 , C08K3/36 , C08K5/0066 , C08K5/523 , C08L63/00
Abstract: The present invention relates to a halogen-free thermosetting resin composition, and also a prepreg and a laminate for printed circuit prepared from the halogen-free thermosetting resin composition. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free epoxy resin, (B) from 5 to 30 parts by weight of a first curing agent of phosphorus-containing bisphenol, (C) from 5 to 30 parts by weight of a second curing agent of alkylphenol novolac, and (D) a phosphorus-containing flame retardant. The prepreg and laminate for printed circuit prepared from the halogen-free thermosetting resin composition according to the present invention have high glass transition temperature, excellent dielectric properties, low water absorption, high thermal resistance and better process workability, and can fulfill halogen-free flame retardance and achieve the grade of UL94 V-0.
Abstract translation: 本发明涉及一种无卤热固性树脂组合物，以及由无卤素热固性树脂组合物制备的预浸料和印刷电路层压板。 无卤热固性树脂组合物基于100重量份的有机固体，包含（A）30至60重量份的无卤环氧树脂，（B）5至30重量份的第一 含磷双酚的固化剂，（C）5〜30重量份烷基酚酚醛清漆的第二固化剂，（D）含磷阻燃剂。 由本发明的无卤素热固性树脂组合物制备的用于印刷电路的预浸料和层压材料具有高的玻璃化转变温度，优异的介电性能，低吸水性，高耐热性和更好的工艺加工性，并且可以实现无卤素火焰 延迟并达到UL94 V-0的等级。
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4.发明申请HALOGEN-FREE THERMOSETTING RESIN COMPOSITION, AND PREPREG AND LAMINATE FOR PRINTED CIRCUITS USING THE SAME 有权无卤素热固性树脂组合物，以及使用该印刷电路的PREPREG和层压板公开(公告)号：US20160185939A1
公开(公告)日：2016-06-30
申请号：US14680806
申请日：2015-04-07
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Jiang You , Tianhui Huang , Zhongqiang Yang
CPC classification number: C08K5/357 , C08G59/4071 , C08J5/24 , C08J2363/00 , C08K3/36 , C08K5/35 , C08L63/00
Abstract: The present invention relates to a halogen-free thermosetting resin composition and also a prepreg and a laminate for printed circuits prepared from the halogen-free thermosetting resin composition. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free epoxy resin, (B) from 20 to 50 parts by weight of a compound containing dihydrobenzoxazine ring, (C) from 10 to 40 parts by weight of a phosphorus-containing bisphenol curing agent. The prepreg and laminate for printed circuits prepared from the halogen-free thermosetting resin composition according to the present invention have high glass transition temperature, excellent dielectric properties, low water absorption, high thermal resistance and better processability, and can fulfill halogen-free flame retardancy and achieve UL94 V-0 grade.
Abstract translation: 本发明涉及一种无卤热固性树脂组合物，以及由无卤素热固性树脂组合物制备的用于印刷电路的预浸料和层压材料。 无卤素热固性树脂组合物基于100重量份的有机固体，包含（A）30至60重量份的无卤环氧树脂，（B）20至50重量份的化合物 含有二氢苯并恶嗪环，（C）10〜40重量份的含磷双酚固化剂。 由本发明的无卤素热固性树脂组合物制备的印刷电路用预浸料和层压材料具有玻璃化转变温度高，介电性能优异，吸水率低，耐热性高，加工性好的优点，可以实现无卤阻燃 并达到UL94 V-0级。
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5.发明申请Halogen-Free Thermosetting Resin Composition, Prepreg and Laminate for Printed Circuit Prepared From the Same 审中-公开无卤素热固性树脂组合物，由其制备的印刷电路用预浸料和层压板公开(公告)号：US20160185952A1
公开(公告)日：2016-06-30
申请号：US14679372
申请日：2015-04-06
Applicant: Shengyi Technology Co., Ltd.
Inventor： Jiang You , Tianhui Huang , Zhongqiang Yang
CPC classification number: C08L63/04 , C08G59/3218 , C08G59/4071 , C08G59/621 , C08J2363/00 , C08K5/0066 , C08K5/49 , C08K5/5317 , C08L63/00
Abstract: The present invention relates to a halogen-free thermosetting resin composition, and also a prepreg and a laminate for printed circuit prepared from the halogen-free thermosetting resin composition. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free epoxy resin, (B) from 5 to 30 parts by weight of a first curing agent of phosphorus-containing bisphenol, (C) from 5 to 30 parts by weight of a second curing agent of dicyclopentadiene novolac, and (D) a phosphorus-containing flame retardant. The prepreg and laminate for printed circuit prepared from the halogen-free thermosetting resin composition according to the present invention have high glass transition temperature, excellent dielectric properties, low water absorption, high thermal resistance and better process workability, and can fulfill halogen-free flame retardance and achieve the grade of UL94 V-0.
Abstract translation: 本发明涉及一种无卤热固性树脂组合物，以及由无卤素热固性树脂组合物制备的预浸料和印刷电路层压板。 无卤热固性树脂组合物基于100重量份的有机固体，包含（A）30至60重量份的无卤环氧树脂，（B）5至30重量份的第一 含磷双酚的固化剂，（C）5-30重量份二环戊二烯酚醛清漆的第二固化剂，（D）含磷阻燃剂。 由本发明的无卤素热固性树脂组合物制备的用于印刷电路的预浸料和层压材料具有高的玻璃化转变温度，优异的介电性能，低吸水性，高耐热性和更好的工艺加工性，并且可以实现无卤素火焰 延迟并达到UL94 V-0的等级。
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Patent Agency Ranking
6.发明申请HALOGEN-FREE RESIN COMPOSITION, AND PREPREG AND LAMINATE FOR PRINTED CIRCUITS USING SAME 有权无卤素树脂组合物，以及使用相同印刷电路的PREPREG和层压板公开(公告)号：US20150353722A1
公开(公告)日：2015-12-10
申请号：US14552775
申请日：2014-11-25
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Jiang You
IPC: C08L39/04
CPC classification number: C08L39/04 , C08G59/3218 , C08G59/621 , C08K5/49 , C08L63/00 , C08L79/04
Abstract: Halogen-free resin composition, prepreg, and laminate for printed circuits. Based on 100 parts by weight of organic solid matter, it comprises: (A) dicyclopentadiene-type benzoxazine resin: 50-80 parts by weight; (B) dicyclopentadiene-type epoxy resin; (C) dicyclopentadiene-type novolac hardener; (D) phosphorus-containing flame retardant. The dicyclopentadiene structure in (A) decreases the dielectric constant, dielectric dissipation value, and water absorption of cured products and maintain adhesive force as the main resin; adding (B) can improve the tenacity of cured products and maintain low water absorption and excellent dielectric performances; Taking the dicyclopentadiene-type novolac as the hardener can sufficiently exert the advantage of excellent dielectric performances and good thermal and moisture resistance resulted from the dicyclopentadiene-containing structure. The prepreg above and the laminate for printed circuits using the prepreg have low dielectric constant, low dielectric dissipation factor, low water absorption, high adhesion, high thermal resistance and good flame retardancy, processability and chemical resistance.
Abstract translation: 用于印刷电路的无卤素树脂组合物，预浸料和层压板。 基于100重量份的有机固体物质，其包含：（A）二环戊二烯型苯并恶嗪树脂：50-80重量份; （B）二环戊二烯型环氧树脂; （C）二环戊二烯型酚醛清漆硬化剂; （D）含磷阻燃剂。 （A）中的二环戊二烯结构降低了固化产物的介电常数，介电耗散值和吸水率，并保持作为主要树脂的粘合力; 加入（B）可以提高固化产物的强度，保持低吸水性和优良的介电性能; 以二环戊二烯型酚醛清漆为硬化剂，可以充分发挥由含二环戊二烯的结构产生的优异的介电性能和良好的耐热和耐湿性。 上述预浸料和使用该预浸料的印刷电路用层叠体具有低介电常数，低介电损耗因数，低吸水率，高附着力，高耐热性，良好的阻燃性，加工性和耐化学性。
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7.发明授权公开(公告)号：US09963590B2
公开(公告)日：2018-05-08
申请号：US15027374
申请日：2014-06-10
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Jiang You
IPC: C08L63/00 , C08G59/50 , C08J5/24 , C08L79/02 , H05K1/03 , B32B27/38 , B32B27/42 , C08K3/22 , C08K3/34 , C08K3/40 , C08K5/00 , C08L63/04 , C08G14/06 , C08L61/06 , C08L61/34 , C08G59/32 , C08G59/62 , C08G59/68
CPC classification number: C08L63/00 , B32B27/38 , B32B27/42 , B32B2260/021 , B32B2260/023 , B32B2260/046 , B32B2262/101 , B32B2264/102 , B32B2264/104 , B32B2307/204 , B32B2307/306 , B32B2307/3065 , B32B2307/714 , B32B2307/726 , B32B2307/7265 , B32B2307/734 , B32B2457/08 , C08G14/06 , C08G59/3218 , C08G59/5073 , C08G59/621 , C08G59/686 , C08J5/24 , C08J2363/00 , C08J2379/02 , C08J2379/04 , C08J2461/06 , C08J2463/00 , C08J2479/02 , C08J2479/04 , C08K3/22 , C08K3/34 , C08K3/40 , C08K5/0066 , C08K5/49 , C08L61/04 , C08L61/06 , C08L61/34 , C08L63/04 , C08L79/02 , C08L79/04 , C08L79/06 , C08L2201/02 , C08L2201/22 , C08L2203/20 , C08L2205/03 , H05K1/0373 , H05K2201/012 , H05K2201/015
Abstract: The technology discloses a halogen-free resin composition and a prepreg and a laminate used for a printed circuit. The resin composition comprises: alkyl phenol epoxy resin; benzoxazine resin, alkyl phenol novolac curing agent, and phosphorus-containing flame retardant. The alkyl phenol epoxy resin has many alkyl branched chains in its molecular structure, making the composition have excellent dielectric properties, a higher glass transition temperature, low water absorption, and good heat resistance. Mixing benzoxazine resin into the composition can further reduce dielectric constant, dielectric loss value and water absorption of the cured product. With an alkyl phenol novolac curing agent, the molecular structure will have many alkyls, excellent dielectric properties and low water absorption. A prepreg and a laminate used for printed circuit prepared using the resin composition have low dielectric constants, dielectric loss factors, and water absorption, high dimensional stability, high thermal resistance and good flame retardancy, processability and chemical resistance.
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公开(公告)号：US09611377B2
公开(公告)日：2017-04-04
申请号：US14680806
申请日：2015-04-07
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Jiang You , Tianhui Huang , Zhongqiang Yang
CPC classification number: C08K5/357 , C08G59/4071 , C08J5/24 , C08J2363/00 , C08K3/36 , C08K5/35 , C08L63/00
Abstract: The present invention relates to a halogen-free thermosetting resin composition and also a prepreg and a laminate for printed circuits prepared from the halogen-free thermosetting resin composition. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free epoxy resin, (B) from 20 to 50 parts by weight of a compound containing dihydrobenzoxazine ring, (C) from 10 to 40 parts by weight of a phosphorus-containing bisphenol curing agent. The prepreg and laminate for printed circuits prepared from the halogen-free thermosetting resin composition according to the present invention have high glass transition temperature, excellent dielectric properties, low water absorption, high thermal resistance and better processability, and can fulfill halogen-free flame retardancy and achieve UL94 V-0 grade.
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9.发明授权Halogen-free resin composition, and prepreg and laminate for printed circuits using the same 有权无卤素树脂组合物，以及使用其的印刷电路用预浸料和层压材料公开(公告)号：US09493651B2
公开(公告)日：2016-11-15
申请号：US14563398
申请日：2014-12-08
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Jiang You
CPC classification number: C08L79/04 , C08K5/0066 , C08L61/04 , C08L63/00 , C08L63/04 , C08L2201/02 , C08L2203/20
Abstract: Halogen-free resin composition, prepreg, and laminate for printed circuits using same. Based on 100 parts by weight of organic solid matter, the resin composition comprises: (A) bisphenol-type epoxy resin: 30˜60 parts by weight; (B) benzoxazine resin: 5˜45 parts by weight; (C) alkyl phenol novolac hardener: 10˜30 parts by weight; (D) phosphorus-containing flame retardant. The bisphenol-type epoxy resin, with numerous alkyl branched chains and benzene rings in its structure, makes the composition possess high glass transition temperature, low water absorption, good thermal resistance, and excellent dielectric properties. Taking the alkyl phenol novolac as the hardener can sufficiently exert the advantages of excellent dielectric properties and low water absorption resulted from containing numerous alkyls. The prepreg and laminate for printed circuits made from halogen-free resin composition have high glass transition temperature, low dielectric constant, low dielectric dissipation factor, low water absorption, high thermal resistance, and good flame retardancy, processability and chemical resistance.
Abstract translation: 无卤素树脂组合物，预浸料和使用其的印刷电路层压板。 基于100重量份的有机固体物质，树脂组合物包含：（A）双酚型环氧树脂：30〜60重量份; （B）苯并恶嗪树脂：5〜45重量份; （C）烷基苯酚酚醛清漆硬化剂：10〜30重量份; （D）含磷阻燃剂。 在其结构中具有许多烷基支链和苯环的双酚型环氧树脂使组合物具有高玻璃化转变温度，低吸水性，良好的耐热性和优异的介电性能。 以烷基苯酚酚醛清漆作为硬化剂可以充分发挥由于含有许多烷基而导致的优异的介电性能和低吸水性的优点。 由无卤素树脂组合物制成的印刷电路用预浸料和层压板具有高玻璃化转变温度，低介电常数，低介电损耗因子，低吸水率，高耐热性，良好的阻燃性，可加工性和耐化学性。
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10.发明申请HALOGEN-FREE RESIN COMPOSITION, AND PREPREG AND LAMINATE FOR PRINTED CIRCUITS USING THE SAME 有权无卤素树脂组合物，以及使用该印刷电路的印刷电路板和层压板公开(公告)号：US20160024304A1
公开(公告)日：2016-01-28
申请号：US14563398
申请日：2014-12-08
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Jiang You
CPC classification number: C08L79/04 , C08K5/0066 , C08L61/04 , C08L63/00 , C08L63/04 , C08L2201/02 , C08L2203/20
Abstract: Halogen-free resin composition, prepreg, and laminate for printed circuits using same. Based on 100 parts by weight of organic solid matter, the resin composition comprises: (A) bisphenol-type epoxy resin: 30˜60 parts by weight; (B) benzoxazine resin: 5˜45 parts by weight; (C) alkyl phenol novolac hardener: 10˜30 parts by weight; (D) phosphorus-containing flame retardant. The bisphenol-type epoxy resin, with numerous alkyl branched chains and benzene rings in its structure, makes the composition possess high glass transition temperature, low water absorption, good thermal resistance, and excellent dielectric properties. Taking the alkyl phenol novolac as the hardener can sufficiently exert the advantages of excellent dielectric properties and low water absorption resulted from containing numerous alkyls. The prepreg and laminate for printed circuits made from halogen-free resin composition have high glass transition temperature, low dielectric constant, low dielectric dissipation factor, low water absorption, high thermal resistance, and good flame retardancy, processability and chemical resistance.
Abstract translation: 无卤素树脂组合物，预浸料和使用其的印刷电路层压板。 基于100重量份的有机固体物质，树脂组合物包含：（A）双酚型环氧树脂：30〜60重量份; （B）苯并恶嗪树脂：5〜45重量份; （C）烷基苯酚酚醛清漆硬化剂：10〜30重量份; （D）含磷阻燃剂。 在其结构中具有许多烷基支链和苯环的双酚型环氧树脂使组合物具有高玻璃化转变温度，低吸水性，良好的耐热性和优异的介电性能。 以烷基苯酚酚醛清漆作为硬化剂可以充分发挥由于含有许多烷基而导致的优异的介电性能和低吸水性的优点。 由无卤素树脂组合物制成的印刷电路用预浸料和层压板具有高玻璃化转变温度，低介电常数，低介电损耗因子，低吸水率，高耐热性，良好的阻燃性，可加工性和耐化学性。
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