公开(公告)号：US11482503B2

公开(公告)日：2022-10-25

申请号：US16811964

申请日：2020-03-06

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Michele Calabretta ,  Crocifisso Marco Antonio Renna ,  Sebastiano Russo ,  Marco Alfio Torrisi

IPC: H01L23/00 ,  B23K35/26 ,  C22C13/00 ,  H01L23/31 ,  H01L23/495 ,  B23K101/40

Abstract: A method for soldering a die obtained using the semiconductor technique with a leadframe, comprising the steps of providing a leadframe, which has at least one surface made at least partially of copper; providing a die, which has at least one surface coated with a metal layer; applying to the surface a solder alloy comprising at least 40 wt % of tin or at least 50% of indium or at least 50% of gallium, without lead, and heating the alloy to a temperature of at least 380° C. to form a drop of solder alloy; providing a die, which has at least one surface coated with a metal layer; and setting the metal layer in contact with the drop of solder alloy to form the soldered connection with the leadframe. Moreover, a device obtained with said method is provided.

公开(公告)号：US11756916B2

公开(公告)日：2023-09-12

申请号：US17933016

申请日：2022-09-16

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Michele Calabretta ,  Crocifisso Marco Antonio Renna ,  Sebastiano Russo ,  Marco Alfio Torrisi

IPC: H01L23/00 ,  B23K35/26 ,  C22C13/00 ,  H01L23/31 ,  H01L23/495 ,  B23K101/40

CPC classification number: H01L24/29 ,  B23K35/262 ,  C22C13/00 ,  H01L23/3121 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49579 ,  H01L24/27 ,  H01L24/32 ,  H01L24/83 ,  B23K2101/40 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/2912 ,  H01L2224/29105 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2924/014 ,  H01L2924/20109

Abstract: A method for soldering a die obtained using the semiconductor technique with a leadframe, comprising the steps of providing a leadframe, which has at least one surface made at least partially of copper; providing a die, which has at least one surface coated with a metal layer; applying to the surface a solder alloy comprising at least 40 wt % of tin or at least 50% of indium or at least 50% of gallium, without lead, and heating the alloy to a temperature of at least 380° C. to form a drop of solder alloy; providing a die, which has at least one surface coated with a metal layer; and setting the metal layer in contact with the drop of solder alloy to form the soldered connection with the leadframe. Moreover, a device obtained with said method is provided.

公开(公告)号：US09013878B2

公开(公告)日：2015-04-21

申请号：US13626322

申请日：2012-09-25

Applicant: STMicroelectronics S.r.l.

Inventor： Matteo Sebastiano Dimauro ,  Sebastiano Russo ,  Rosalba Cacciola ,  Cristiano Gianluca Stella

IPC: H05K7/20 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K1/111 ,  H05K3/3431 ,  H05K2201/0373 ,  H05K2201/09663 ,  H05K2201/10166 ,  H05K2201/10969 ,  H05K2203/1178 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49149

Abstract: An electronic system includes an insulating structural element with a coupling surface configured for coupling the electronic system with at least one further electronic system. The electronic system further includes at least one conducting contact element at least partially exposed on the coupling surface. Each conducting contact element has a soldering surface supporting reflow soldering of the conducting contact element with a corresponding further contact element of the further electronic system. In addition, each conducting contact element has at least one lateral surface protruding from the insulating structural element. The soldering surface of the conducting contact element includes at least one channel having an opened end at the protruding lateral surface, the channel configured to facilitate dispersion of waste gas produced during reflow soldering.

Abstract translation: 电子系统包括绝缘结构元件，其具有被配置为将电子系统与至少一个另外的电子系统耦合的耦合表面。 电子系统还包括至少一个至少部分地暴露在耦合表面上的导电接触元件。 每个导电接触元件具有支撑导电接触元件的回流焊接的焊接表面与另外的电子系统的相应的另外的接触元件。 此外，每个导电接触元件具有从绝缘结构元件突出的至少一个侧表面。 导电接触元件的焊接表面包括在突出侧表面具有开口端的至少一个通道，该通道构造成便于在回流焊接期间产生的废气的分散。

公开(公告)号：US20130083489A1

公开(公告)日：2013-04-04

申请号：US13626322

申请日：2012-09-25

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Matteo Sebastiano Dimauro ,  Sebastiano Russo ,  Rosalba Cacciola ,  Cristiano Gianluca Stella

IPC: H05K7/00 ,  B23K31/02 ,  H01B5/00 ,  H01R9/00 ,  H05K7/20

CPC classification number: H05K1/111 ,  H05K3/3431 ,  H05K2201/0373 ,  H05K2201/09663 ,  H05K2201/10166 ,  H05K2201/10969 ,  H05K2203/1178 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49149

Abstract: An electronic system includes an insulating structural element with a coupling surface configured for coupling the electronic system with at least one further electronic system. The electronic system further includes at least one conducting contact element at least partially exposed on the coupling surface. Each conducting contact element has a soldering surface supporting reflow soldering of the conducting contact element with a corresponding further contact element of the further electronic system. In addition, each conducting contact element has at least one lateral surface protruding from the insulating structural element. The soldering surface of the conducting contact element includes at least one channel having an opened end at the protruding lateral surface, the channel configured to facilitate dispersion of waste gas produced during reflow soldering.

Abstract translation: 电子系统包括绝缘结构元件，其具有被配置为将电子系统与至少一个另外的电子系统耦合的耦合表面。 电子系统还包括至少一个至少部分地暴露在耦合表面上的导电接触元件。 每个导电接触元件具有支撑导电接触元件的回流焊接的焊接表面与另外的电子系统的相应的另外的接触元件。 此外，每个导电接触元件具有从绝缘结构元件突出的至少一个侧表面。 导电接触元件的焊接表面包括在突出侧表面具有开口端的至少一个通道，该通道构造成便于在回流焊接期间产生的废气的分散。