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1.发明申请RESIN COMPOSITION FOR THERMALLY CONDUCTIVE SHEET, BASE MATERIAL-ATTACHED RESIN LAYER, THERMALLY CONDUCTIVE SHEET, AND SEMICONDUCTOR DEVICE 审中-公开导热片，基材料附着树脂层，导热片和半导体器件的树脂组合物公开(公告)号：US20160122503A1
公开(公告)日：2016-05-05
申请号：US14931966
申请日：2015-11-04
发明人： Shunsuke Mochizuki , Kazuya Kitagawa , Yoji Shirato , Keita Nagahashi , Mika Tsuda , Kazuya Hirasawa , Motomi Kurokawa
IPC分类号： C08K3/38 , H01L23/367 , H01L23/31 , C09K5/08
CPC分类号： C08K3/38 , C08K2003/385 , C09K5/08 , C09K5/14 , H01L23/295 , H01L23/3731 , H01L23/3737 , H01L23/42 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2924/00012
摘要： A resin composition for a thermally conductive sheet includes a thermosetting resin and a filler dispersed in the thermosetting resin. The filler includes secondary agglomerated particles satisfying the following conditions: a void is formed in the central portion; a communicating pore which begins from the void and communicates with the outer surface of the secondary agglomerated particle is formed; and the ratio of the average pore diameter of the communicating pores to the average void diameter of the voids is equal to or more than 0.05 and equal to or less than 1.0.
摘要翻译： 用于导热片的树脂组合物包括热固性树脂和分散在热固性树脂中的填料。 填料包括满足以下条件的二次附聚颗粒：在中心部分形成空隙; 形成从空隙开始并与二次附聚粒子的外表面连通的连通孔; 并且连通孔的平均孔径与空隙的平均孔径的比例等于或大于0.05且等于或小于1.0。
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公开(公告)号：US10720375B2
公开(公告)日：2020-07-21
申请号：US15746893
申请日：2016-07-20
发明人： Shunsuke Mochizuki , Kazuya Kitagawa , Yoji Shirato , Keita Nagahashi , Mika Tsuda , Satoshi Maji
摘要： A substrate for a power module (100) of the present invention includes a metal substrate (101), an insulating resin layer (102) provided on the metal substrate (101), and a metal layer (103) provided on the insulating resin layer (102). The insulating resin layer (102) includes a thermosetting resin (A) and inorganic fillers (B) dispersed in the thermosetting resin (A), a maximum value of a dielectric loss ratio of the insulating resin layer (102) at a frequency of 1 kHz and 100° C. to 175° C. is equal to or less than 0.030, and a change in a relative permittivity is equal to or less than 0.10.
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3.发明申请公开(公告)号：US20160005677A1
公开(公告)日：2016-01-07
申请号：US14789207
申请日：2015-07-01
发明人： Shunsuke Mochizuki , Kazuya Kitagawa , Yoji Shirato , Keita Nagahashi , Mika Tsuda , Kazuya Hirasawa , Motomi Kurokawa
IPC分类号： H01L23/373 , H01L23/495 , C09K5/14
摘要： A thermally conductive sheet includes a thermosetting resin and an inorganic filler material. When a pore diameter distribution is measured through mercury intrusion technique for the inorganic filler material, a pore diameter distribution curve of the inorganic filler material has a first maximum value in the range where the pore diameter R is greater than or equal to 0.1 μm and less than or equal to 5.0 μm, and a second maximum value in the range where the pore diameter R is greater than or equal to 10 μm and less than or equal to 30 μm, and the difference between a second pore diameter at the second maximum value and a first pore diameter at the first maximum value is greater than or equal to 9.9 μm and less than or equal to 25 μm.
摘要翻译： 导热片包括热固性树脂和无机填料。 当通过无机填充材料的水银侵入技术测量孔径分布时，无机填料的孔径分布曲线在孔径R大于等于0.1μm的范围内具有第一最大值 在孔径R大于或等于10μm且小于或等于30μm的范围内的第二最大值，以及第二最大值的第二孔径之间的差异 并且第一最大值的第一孔径大于或等于9.9μm且小于或等于25μm。
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公开(公告)号：US20190341331A1
公开(公告)日：2019-11-07
申请号：US15746893
申请日：2016-07-20
发明人： Shunsuke Mochizuki , Kazuya Kitagawa , Yoji Shirato , Keita Nagahashi , Mika Tsuda , Satoshi Maji
IPC分类号： H01L23/373 , H05K1/05 , H05K1/18 , H05K1/03
摘要： A substrate for a power module (100) of the present invention includes a metal substrate (101), an insulating resin layer (102) provided on the metal substrate (101), and a metal layer (103) provided on the insulating resin layer (102). The insulating resin layer (102) includes a thermosetting resin (A) and inorganic fillers (B) dispersed in the thermosetting resin (A), a maximum value of a dielectric loss ratio of the insulating resin layer (102) at a frequency of 1 kHz and 100° C. to 175° C. is equal to or less than 0.030, and a change in a relative permittivity is equal to or less than 0.10.
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公开(公告)号：US20170162484A1
公开(公告)日：2017-06-08
申请号：US15116061
申请日：2015-01-28
发明人： Shunsuke Mochizuki , Kazuya Kitagawa , Yoji Shirato , Keita Nagahashi , Mika Tsuda , Satoshi Maji , Motomi Kurokawa , Kazuya Hirasawa
IPC分类号： H01L23/495 , H01L23/31 , H01L25/065 , H01L23/373
CPC分类号： H01L23/49568 , H01L23/3121 , H01L23/3735 , H01L23/3737 , H01L23/4334 , H01L23/49548 , H01L23/49575 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0655 , H01L2224/29139 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48106 , H01L2224/48137 , H01L2224/48245 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/0665 , H01L2924/13055 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
摘要： A thermally conductive sheet of the present invention includes a thermosetting resin (A), and an inorganic filler material (B) which is dispersed in the thermosetting resin (A). In the thermally conductive sheet according to the present invention, the volume resistivity of the cured product of the thermally conductive sheet, which is measured one minute later after an applied voltage of 1000 V is applied thereto on the basis of JIS K 6911 and at a temperature of 175° C., is greater than or equal to 1.0×108 Ω·m.
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6.发明申请公开(公告)号：US20180208820A1
公开(公告)日：2018-07-26
申请号：US15746089
申请日：2016-07-20
发明人： Mika Tsuda , Haruyuki Hatano , Kazuya Kitagawa , Keita Nagahashi
IPC分类号： C09K5/14 , C08L79/04 , C08J5/18 , H01L23/373 , H01L23/495
CPC分类号： C09K5/14 , C08J5/18 , C08J2379/04 , C08J2463/00 , C08J2463/02 , C08J2463/08 , C08K3/36 , C08K3/38 , C08K2003/2227 , C08K2003/385 , C08K2201/011 , C08L61/14 , C08L63/00 , C08L79/04 , C08L2203/20 , C08L2205/025 , C08L2205/035 , H01L23/3107 , H01L23/3121 , H01L23/3733 , H01L23/3737 , H01L23/4334 , H01L23/49568 , H01L23/49575 , H01L23/49586 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/29139 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2924/13055 , H01L2924/181 , H01L2924/00012 , H01L2924/00014 , H01L2924/00 , C08L61/06 , C08K3/22 , C08K2003/382
摘要： The thermal conductive resin composition of first embodiment includes an epoxy resin, a cyanate resin, and thermal conductive filler. It has a thermal conductivity at 25° C., and cracking does not occur when a specific flex resistance test is carried out. The thermal conductive resin composition of a second embodiment includes an epoxy resin, a thermal conductive filler, and silica nanoparticles. An average particle diameter D50 of the silica nanoparticles is equal to or more than 1 nm and equal to or less than 100 nm, a content of the silica nanoparticles is equal to or more than 0.3% by mass and equal to or less than 2.5% by mass with respect to 100% by mass of a total solid content of the thermal conductive resin composition. The thermal conductive filler includes secondary agglomerated particles constituted of primary particles of scale-like boron nitride.
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公开(公告)号：US20170011986A1
公开(公告)日：2017-01-12
申请号：US15115775
申请日：2015-01-28
发明人： Shunsuke Mochizuki , Kazuya Kitagawa , Yoji Shirato , Keita Nagahashi , Mika Tsuda , Satoshi Maji , Motomi Kurokawa , Kazuya Hirasawa
IPC分类号： H01L23/373 , H01L21/56 , H01L21/48 , H01L23/367 , H01L23/31
CPC分类号： H01L23/3737 , H01L21/4882 , H01L21/565 , H01L23/3114 , H01L23/367 , H01L23/3735 , H01L23/4334 , H01L23/49548 , H01L23/49568 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2924/13055 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A thermally conductive sheet of the present invention includes a thermosetting resin (A) and an inorganic filler material (B) that is dispersed in the thermosetting resin (A). In the thermally conductive sheet of the present invention, at a frequency of 1 kHz and at a temperature of 100° C. to 175° C., the maximum value of a dielectric loss factor of a cured product of the thermally conductive sheet is less than or equal to 0.030, and a change in relative dielectric constant of the cured product of the thermally conductive sheet is less than or equal to 0.10.
摘要翻译： 本发明的导热片包括分散在热固性树脂（A）中的热固性树脂（A）和无机填料（B）。 在本发明的导热片中，在1kHz的频率和100℃〜175℃的温度下，导热片的固化物的介电损耗系数的最大值较小 导热片的固化物的相对介电常数的变化小于或等于0.10。
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公开(公告)号：US10269689B2
公开(公告)日：2019-04-23
申请号：US15116061
申请日：2015-01-28
发明人： Shunsuke Mochizuki , Kazuya Kitagawa , Yoji Shirato , Keita Nagahashi , Mika Tsuda , Satoshi Maji , Motomi Kurokawa , Kazuya Hirasawa
IPC分类号： H01L23/00 , H01L23/31 , H01L23/373 , H01L23/433 , H01L23/495 , H01L25/065
摘要： A thermally conductive sheet of the present invention includes a thermosetting resin (A), and an inorganic filler material (B) which is dispersed in the thermosetting resin (A). In the thermally conductive sheet according to the present invention, the volume resistivity of the cured product of the thermally conductive sheet, which is measured one minute later after an applied voltage of 1000 V is applied thereto on the basis of JIS K 6911 and at a temperature of 175° C., is greater than or equal to 1.0×108 Ω·m.
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公开(公告)号：US09859189B2
公开(公告)日：2018-01-02
申请号：US15115775
申请日：2015-01-28
发明人： Shunsuke Mochizuki , Kazuya Kitagawa , Yoji Shirato , Keita Nagahashi , Mika Tsuda , Satoshi Maji , Motomi Kurokawa , Kazuya Hirasawa
IPC分类号： H01L23/34 , H01L23/373 , H01L23/433 , H01L21/48 , H01L21/56 , H01L23/31 , H01L23/367 , H01L23/495
CPC分类号： H01L23/3737 , H01L21/4882 , H01L21/565 , H01L23/3114 , H01L23/367 , H01L23/3735 , H01L23/4334 , H01L23/49548 , H01L23/49568 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2924/13055 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A thermally conductive sheet of the present invention includes a thermosetting resin (A) and an inorganic filler material (B) that is dispersed in the thermosetting resin (A). In the thermally conductive sheet of the present invention, at a frequency of 1 kHz and at a temperature of 100° C. to 175° C., the maximum value of a dielectric loss factor of a cured product of the thermally conductive sheet is less than or equal to 0.030, and a change in relative dielectric constant of the cured product of the thermally conductive sheet is less than or equal to 0.10.
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10.发明申请公开(公告)号：US20160002520A1
公开(公告)日：2016-01-07
申请号：US14789344
申请日：2015-07-01
发明人： Shunsuke Mochizuki , Kazuya Kitagawa , Yoji Shirato , Keita Nagahashi , Mika Tsuda , Kazuya Hirasawa , Motomi Kurokawa
IPC分类号： C09K5/14 , H01L23/31 , H01L23/367
CPC分类号： C09K5/14 , H01L23/3107 , H01L23/3737 , H01L23/4334 , H01L23/49568 , H01L23/49575 , H01L23/564 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A thermally conductive sheet includes a thermosetting resin (A) and an inorganic filler material (B) which is dispersed in the thermosetting resin (A). In the thermally conductive sheet, when a pore diameter distribution is measured through mercury intrusion technique for the inorganic filler material (B) that is included in an incineration residue after a cured product of the thermally conductive sheet is heated at 700° C. for four hours and is incinerated, a pore diameter distribution curve, that is measured through the mercury intrusion technique and is plotted with a pore diameter R as a horizontal axis and a logarithmic derivative of a pore volume (dV/d log R) as a vertical axis, has a peak (P) in the range where the pore diameter R is greater than or equal to 1.0 μm and is less than or equal to 10.0 μm, and the peak (P) is configured of two or more overlapping peaks.
摘要翻译： 导热片包括分散在热固性树脂（A）中的热固性树脂（A）和无机填料（B）。 在导热片中，当导热片的固化物在700℃下加热4次后，通过汞侵入技术测定包含在焚烧残渣中的无机填料（B）的孔径分布 焚烧，通过汞侵入技术测量的孔径分布曲线，并以孔径R作为水平轴和孔体积（dV / d log R）的对数导数作为纵轴绘制 在孔径R大于或等于1.0μm且小于或等于10.0μm的范围内具有峰（P），并且峰（P）由两个或更多个重叠峰构成。
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