THERMALLY CONDUCTIVE SHEET, CURED PRODUCT THEREOF, AND SEMICONDUCTOR DEVICE
    3.
    发明申请
    THERMALLY CONDUCTIVE SHEET, CURED PRODUCT THEREOF, AND SEMICONDUCTOR DEVICE 审中-公开
    导热片,固化产品和半导体器件

    公开(公告)号:US20160005677A1

    公开(公告)日:2016-01-07

    申请号:US14789207

    申请日:2015-07-01

    摘要: A thermally conductive sheet includes a thermosetting resin and an inorganic filler material. When a pore diameter distribution is measured through mercury intrusion technique for the inorganic filler material, a pore diameter distribution curve of the inorganic filler material has a first maximum value in the range where the pore diameter R is greater than or equal to 0.1 μm and less than or equal to 5.0 μm, and a second maximum value in the range where the pore diameter R is greater than or equal to 10 μm and less than or equal to 30 μm, and the difference between a second pore diameter at the second maximum value and a first pore diameter at the first maximum value is greater than or equal to 9.9 μm and less than or equal to 25 μm.

    摘要翻译: 导热片包括热固性树脂和无机填料。 当通过无机填充材料的水银侵入技术测量孔径分布时,无机填料的孔径分布曲线在孔径R大于等于0.1μm的范围内具有第一最大值 在孔径R大于或等于10μm且小于或等于30μm的范围内的第二最大值,以及第二最大值的第二孔径之间的差异 并且第一最大值的第一孔径大于或等于9.9μm且小于或等于25μm。