公开(公告)号：US20250043149A1

公开(公告)日：2025-02-06

申请号：US18430808

申请日：2024-02-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： DONGHOON KWON ,  BOUN YOON

IPC: C09G1/02 ,  B24B57/02 ,  C09K3/14

Abstract: Provided are a slurry composition for chemical mechanical polishing including: an abrasive including a polishing particle and a coating layer surrounding the polishing particle; and a photoinitiator, wherein the polishing particle includes a metal oxide, and wherein the coating layer includes a photoreactive monomer or oligomer, and a chemical mechanical polishing apparatus.

公开(公告)号：US20210098261A1

公开(公告)日：2021-04-01

申请号：US17121233

申请日：2020-12-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chae Lyoung KIM ,  Tae-Hong KIM ,  Jung-Min OH ,  YUNGJUN KIM ,  INGI KIM ,  BOUN YOON ,  HYOSAN LEE ,  Sol HAN

IPC: H01L21/306 ,  H01L21/02 ,  H01L21/67 ,  B24B37/20 ,  B24B53/017

Abstract: A cleaning method includes supplying, to a substrate by a dual nozzle, a first chemical liquid and a first spray, the first spray including a first liquid dissolving the first chemical liquid, and moving the dual nozzle in a first direction. The the dual nozzle comprises a first nozzle and a second nozzle, the first nozzle supplies the first spray to the substrate and the second nozzle supplies the first chemical liquid to the substrate while the dual nozzle moves in the first direction, the first nozzle proceeds ahead of the second nozzle in the first direction while the dual nozzle moves in the first direction, and the first nozzle has a distance 3 cm to 7 cm from the second nozzle.

公开(公告)号：US20180315613A1

公开(公告)日：2018-11-01

申请号：US16020585

申请日：2018-06-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chae Lyoung KIM ,  Tae-Hong KIM ,  Jung-Min OH ,  YUNGJUN KIM ,  INGI KIM ,  BOUN YOON ,  HYOSAN LEE ,  Sol HAN

IPC: H01L21/306 ,  H01L21/67 ,  B24B37/20 ,  H01L21/02 ,  B24B53/017

CPC classification number: H01L21/30625 ,  B24B37/20 ,  B24B53/017 ,  H01L21/02057 ,  H01L21/02065 ,  H01L21/02074 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67173 ,  H01L21/67219

Abstract: A cleaning apparatus for removing particles from a substrate is provided. The cleaning apparatus includes a first cleaning unit including a first dual nozzle supplying, to a substrate, a first chemical liquid and a first spray including a first liquid dissolving the first chemical liquid, and a second cleaning unit including a second dual nozzle supplying, to the substrate, a second chemical liquid different from the first chemical liquid and a second spray including a second liquid dissolving the second chemical liquid and being the same as the first liquid.

公开(公告)号：US20170301553A1

公开(公告)日：2017-10-19

申请号：US15428963

申请日：2017-02-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chae Lyoung KIM ,  Tae-Hong KIM ,  Jung-Min OH ,  YUNGJUN KIM ,  INGI KIM ,  BOUN YOON ,  HYOSAN LEE ,  Sol HAN

IPC: H01L21/306 ,  H01L21/67 ,  H01L21/02 ,  B24B53/017 ,  B24B37/20

CPC classification number: H01L21/30625 ,  B24B37/20 ,  B24B53/017 ,  H01L21/02057 ,  H01L21/02065 ,  H01L21/02074 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67173 ,  H01L21/67219

Abstract: A cleaning apparatus for removing particles from a substrate is provided. The cleaning apparatus includes a first cleaning unit including a first dual nozzle supplying, to a substrate, a first chemical liquid and a first spray including a first liquid dissolving the first chemical liquid, and a second cleaning unit including a second dual nozzle supplying, to the substrate, a second chemical liquid different from the first chemical liquid and a second spray including a second liquid dissolving the second chemical liquid and being the same as the first liquid.

公开(公告)号：US20250025982A1

公开(公告)日：2025-01-23

申请号：US18427486

申请日：2024-01-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： DONGHOON KWON ,  BOUN YOON

IPC: B24B37/04 ,  B24B37/27 ,  B24B53/017 ,  B24B57/02

Abstract: A chemical mechanical polishing apparatus including a substrate support plate configured to support a substrate, a rotation member positioned on the substrate support plate and configured to include a polishing pad for polishing the substrate, and a jig member positioned on the substrate support plate and movably connected to the rotation member.

公开(公告)号：US20230223454A1

公开(公告)日：2023-07-13

申请号：US17898028

申请日：2022-08-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： YUNJIN KIM ,  KI HO BAE ,  BOUN YOON ,  ILYOUNG YOON

IPC: H01L29/423 ,  H01L29/417

CPC classification number: H01L29/4238 ,  H01L29/41775 ,  H01L29/42364 ,  H01L29/41766

Abstract: A semiconductor device may include a substrate including a first cell region, a second cell region, and a dummy region between the first and second cell regions, and conductive patterns included in the first cell region, the second cell region, and the dummy region. A first pattern density, which is defined as a density of the conductive patterns of the first cell region, may be different from a second pattern density, which is defined as a density of the conductive patterns of the second cell region. A third pattern density, which is defined as a density of the conductive patterns of the dummy region, gradually changes in a region between the first cell region and the second cell region. A top surface of the substrate may be inclined at an angle, in the dummy region.