公开(公告)号：US10658266B2

公开(公告)日：2020-05-19

申请号：US15495324

申请日：2017-04-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Choon Kim ,  Jichul Kim ,  Jin-Kwon Bae ,  Eunseok Cho

IPC: H01L23/38 ,  F25B21/02 ,  H01L35/32 ,  H01L25/10 ,  H01L25/18 ,  H01L23/00

Abstract: A method for managing a temperature of a device includes determining a temperature of a circuit or a package including the circuit, and selectively operating a thermoelectric semiconductor based on the determined temperature to adjust the temperature of the circuit or the package.

公开(公告)号：US09651431B2

公开(公告)日：2017-05-16

申请号：US14136787

申请日：2013-12-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Choon Kim ,  Jichul Kim ,  Jin-Kwon Bae ,  Eunho Jung

IPC: G01K7/42 ,  G01K3/06

CPC classification number: G01K7/42 ,  G01K3/06 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014

Abstract: A semiconductor package includes a first package including a first substrate and a first semiconductor chip mounted on the first substrate and a second package facing and spaced apart from the first package. The second package includes a second substrate on which a second semiconductor chip is mounted. The semiconductor package also includes a connection structure electrically connecting the first and second packages to each other, a first temperature sensor connected to the first substrate, a second temperature sensor connected to the first semiconductor chip, and a third temperature sensor connected to the second semiconductor chip.

公开(公告)号：US09679874B2

公开(公告)日：2017-06-13

申请号：US14938788

申请日：2015-11-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin-Kwon Bae ,  Jae Choon Kim ,  Jichul Kim ,  Kyol Park ,  Chajea Jo

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/367 ,  H01L25/065 ,  H01L23/00 ,  H01L23/36 ,  H01L23/538

CPC classification number: H01L25/0657 ,  H01L23/36 ,  H01L23/367 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5385 ,  H01L24/00 ,  H01L24/29 ,  H01L24/32 ,  H01L25/0655 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/29011 ,  H01L2224/3205 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06589 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/00

Abstract: A semiconductor device includes a substrate, a first semiconductor package disposed on the substrate, and a second semiconductor package spaced apart from the first semiconductor package on the substrate. The second semiconductor package includes a semiconductor chip stacked on the substrate, an adhesion part covering the semiconductor chip, and a heat-blocking structure disposed between the substrate and the semiconductor chip. Heat generated from the first semiconductor package and transmitted to the second semiconductor package through the substrate is blocked by the heat-blocking structure.

公开(公告)号：US09671141B2

公开(公告)日：2017-06-06

申请号：US14961167

申请日：2015-12-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Choon Kim ,  Jichul Kim ,  Jin-Kwon Bae ,  Eunseok Cho

IPC: F25B21/00 ,  F25B21/02 ,  H01L35/32

CPC classification number: F25B21/02 ,  F25B2321/0212 ,  F25B2700/2107 ,  H01L35/32 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A device includes a first board having a first area and a second area not overlapping the first area; and a thermoelectric semiconductor disposed between the first board and the second board at the first area of the first board configured to supply a voltage to the thermoelectric semiconductor; a package disposed at the second area of the first board.